ELECTRONICS INDUSTRIES Performance Test Methods and ...

1 IPC-9701 APerformance TestMethods and QualificationRequirements for SurfaceMount Solder AttachmentsDeveloped by the SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 :IPC-9701 - January 2002 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. Classification .. of Terms .. 12 APPLICABLE .. Industry Standards .. Tin Research Institute .. Publications .. INDUSTRIES Association .. Working Group .. 23 TERMS, DEFINITIONS AND .. Concepts .. Definition .. Concepts .. Relaxation .. Creep-Fatigue Model .. Thermal Expansion .. Parameters .. Zone .. Temperature Range/Swing .. Temperature: Ts.

2 Sample Temperature: Ts (max) .. Nominal Temperature: T (max) .. Sample Temperature: Ts (min) .. Nominal Temperature: T (min) .. Cyclic Temperature, T .. Time, Temperature .. Time .. Ramp Rate .. Cyclic Strain Range .. Cyclic Stress Range .. Loop .. Service Life .. Service Life Service .. Mortality Failures .. Steady-State Failures .. Failures .. Failure Distribution Concepts .. Failure Distribution .. Fatigue Life, N(50%) .. Free Life, Failure Percentage .. Failure Probability .. Cumulative Failure Probability .. Tests .. Reliability Test .. Cycling .. Shock .. Cycling .. Tests .. Test .. Stress Screening (ESS) .. Accelerated Stress Testing (HAST) .. Shock .. Qualification .. Verification .. and Application Considerations .. of Solder Attachment 74 Performance TEST Requirements.

3 Vehicles .. Description .. Wiring (Circuit) Boards .. Assembly .. Temperature Test Methods .. by Isothermal Aging .. Cycling .. Monitoring .. 125 QUALIFICATION Cycling Ranges .. Cycling Test Durations .. of Samples .. Exemption Requirements .. 146 FAILURE Analysis Procedures .. Analysis DocumentationRequirements .. 14 February 2006 IPC-9701 Aiii7 QUALITY for Inspection .. Conformance Inspection .. Assembled Inspection .. Cycling Inspection .. Analysis Inspection .. 15 APPENDIX 16 APPENDIX 18 FiguresFigure 3-1 Representative Temperature Profile forThermal Cycle Test Conditions .. 3 TablesTable 3-1 Product Categories and Worst-CaseUse Environments for SurfaceMounted ELECTRONICS .. 4 Table 4-1 Temperature Cycling Requirements .. 8 Table 4-2 Daisy Chain Requirements .. 8 Table 4-3 Test Exemption Requirements.

4 9 Table 4-4 Test Monitoring Requirements .. 13 Table A-1 Values for Exponent m for the FourTest Condition Levels and for FourRepresentative Product Use Conditions .. 17 Table A-2 Mean Fatigue Lives for a Given ComponentAssembly for the Four Test ConditionLevels and for Four RepresentativeProduct Use Conditions .. 17 IPC-9701 AFebruary 2006ivPerformance Test Methods and QualificationRequirements for Surface Mount Solder Attachments1 SCOPEThis specification establishes specific test Methods toevaluate the Performance and reliability of surface mountsolder attachments of electronic assemblies. It furtherestablishes different levels of Performance and reliability ofthe solder attachments of surface mount devices to rigid,flexible and rigid-flex circuit structures. In addition, it pro-vides an approximate means of relating the results fromthese Performance tests to the reliability of solder attach-ments for the use environments and conditions of elec-tronic PurposeThe purpose of this document is: To provide confidence that the design and themanufacturing/assembly processes create a product that iscapable of meeting its intended goals.

5 To permit the analytical prediction of reliability based ona generic database and technical understanding. To provide standardized test Methods and reporting Performance ClassificationThis specification rec-ognizes that surface mount assemblies (SMAs) will be sub-ject to variations in Performance requirements based onend use. While Performance Classes are defined in IPC-6011,Generic Performance Specification for PrintedBoards,these Performance classifications are not specificas to the required reliability. At this point in time, the reli-ability requirements need to be established by agreementbetween customer and Definition of TermsThe definition of all terms usedhereinshallbe as specified in IPC-T-50, except as other-wise specified in Section Interpretation Shall, the imperative form of theverb, is used throughout this specification whenever arequirement is intended to express a provision that is man-datory.

6 Deviation from a shall requirement may be con-sidered if sufficient data is supplied to justify the words should and may are used whenever it isnecessary to express non-mandatory provisions. Will isused to express a declaration of purpose. To assist the reader, the word shall is presented in Revision Level ChangesChanges made to this revi-sion of the IPC-9701 include Appendix B which establishesguidelines for thermal cycle requirements for Pb-free sol-der joints. Appendix B provides additional recommenda-tions to existing IPC-9701 section requirements when uti-lizing a Pb-free soldering APPLICABLE DOCUMENTSThe following documents are applicable and constitute apart of this specification to the extent specified herein. Sub-sequent issues of, or amendments to, these documents willbecome a part of this specification.

7 Documents are groupedunder categories as IPC, Joint Industry Standard, ITRI,EIA and others depending on the IPC1 IPC-T-50 Terms and Definitions for Interconnecting andPackaging Electronic CircuitsIPC-D-279 Design Guidelines for Reliable Surface MountTechnology Printed Board AssembliesIPC-TM-650 Test Methods , Strength, Metal Bond Strength, Surface Mount Land (Perpen-dicular Pull Method) and Simulation, Plated-Through Coefficient of Thermal Expansion, Strain Withstanding Voltage, Printed (Mechanical) Shock, Multilayer Shock-Rigid Printed Stress, Plated-Through , Rigid Printed WiringIPC-SM-785 Guidelines for Accelerated Reliability Testingof Surface Mount Solder AttachmentsIPC-S-816 SMT Process Guideline and Checklist1. Current and revised IPC Test Methods are available on the IPC website ( ).February 2006 IPC-9701A1