ELECTRONICS INDUSTRIES Rework of Electronic …

1 IPC-7711A/7721A. ASSOCIATION CONNECTING. ELECTRONICS INDUSTRIES . Rework of Electronic Assemblies IPC-7711, Change 1 - February 2002. IPC-7711 - February 1998. Repair and Modification of Printed Boards and Electronic Assemblies IPC-7721, Change 2 - April 2001. IPC-7721, Change 1 - March 2000. IPC-7721 - February 1998. These standards are now published in a single volume with three sections. Part 1 includes the general information and procedures that are common to both IPC-7711A and IPC-7721A. Part 2 includes all the Rework procedures from IPC-7711A and Part 3 includes all the repair and modification procedures from IPC-7721A. Developed by the Repairability Subcommittee (7-34) of the Product Assurance Committee (7-30) of IPC. Supersedes: Users of this publication are encouraged to participate in the IPC-R-700C - January 1988 development of future revisions. Contact: IPC. 2215 Sanders Road Northbrook, Illinois 60062-6135.

2 Tel 847 Fax 847 October 2003 IPC-7711A/7721A. Table of Contents PART 1 General Information and Common Procedures 1 General .. 1 4. Procedure Selection .. 4. 5. Patience .. 4. Scope .. 1 6. Heat Application .. 4. 7. Removal of Coatings .. 4. Purpose .. 1. Tools and Materials .. 4. Definition of Requirements .. 1. 1. Proper Workstations .. 4. Requirements Flowdown .. 1 2. High Quality Microscope .. 4. 3. Lighting .. 4. Background .. 1 4. Soldering Tools .. 4. 5. Component Removal and Installation .. 4. Controls .. 1 6. Preheating (Auxiliary) Heating .. 4. 1. Modification .. 1 7. Fume Extraction .. 4. 2. Rework .. 1 8. Hand Held Drilling and Grinding Tool .. 4. 3. Repair .. 1 9. Precision Drill/Mill System .. 5. 10. Replacement Conductors and Lands .. 5. Classification .. 2. 11. Gold Plating System .. 5. 1. Class 1 General ELECTRONICS Products .. 2. 12. Epoxy and Coloring Agents.

3 5. 2. Class 2 Dedicated Service Electronic Products .. 2. 13. Eyelets and Eyelet Press System .. 5. 3. Class 3 High Performance Electronic Products .. 2. 14. Cleaning Station/System .. 5. 15. Tools and Supplies .. 5. Printed Board Types .. 2. 16. Conformal Coating Area .. 5. R. Rigid Printed Boards and Assemblies .. 2. 17. Materials .. 5. F. Flexible Printed Boards and Assemblies .. 2. W. Discrete Wiring Boards and Assemblies .. 2. Process Goals and Guidelines .. 5. C. Ceramic Boards and Assemblies .. 2. Non-destructive Component Removal .. 6. Level of Conformance .. 2. Surface Mount Land Preparation .. 6. Levels of Conformance .. 2. 1. Remove Old Solder .. 6. L. Lowest Level .. 2. 2. Clean Lands .. 6. M. Medium Level .. 2. H. Highest Level .. 2 Component Installation .. 6. Skill Level .. 3 Primary Heating Methods .. 7. Terms and Definitions .. 3 Preheating and Auxiliary Heating Methods.

4 8. Training .. 3 Vision Systems and Surface Mount 1. Soldering Skills .. 3 Component Placement .. 8. 2. Personnel Selection .. 3. 3. Professional Training .. 3 Selecting Optimum Process for Manual Assembly/ Rework .. 9. Basic Considerations .. 4. BGA/CSP/Flip Chip Time Temperature 1. Appropriate Approvals .. 4 Profile TTP) .. 9. 2. Singular Procedures .. 4. 3. Quality and Reliability .. 4 Lead Free Solder .. 9. v IPC-7711A/7721A October 2003. Handling/Cleaning Level of Procedure Description Product Class Skill Level Conformance Handling Electronic Assemblies R,F,W,C Intermediate High Cleaning R, F, C, W Intermediate High Coating Removal Product Skill Level of Procedure Description Illustration Class Level Conformance Coating Removal, Identification of R, F, W, C Advanced High Conformal Coating Coating Removal, Solvent Method R, F, W, C Advanced High Coating Removal, Peeling Method R, F, W, C Advanced High Coating Removal, Thermal Method R, F, W, C Advanced High Coating Removal, Grinding/ R, F, W, C Advanced High Scraping Method Coating Removal, Micro Blasting R, F, W, C Advanced High Method vi October 2003 IPC-7711A/7721A.

5 Coating Replacement Product Skill Level of Procedure Description Illustration Class Level Conformance Coating Replacement, Solder R, F, W, C Intermediate High Resist Coating Replacement, Conformal R, F, W, C Intermediate High Coatings/Encapsulants Conditioning Product Skill Level of Procedure Description Illustration Class Level Conformance Baking and Preheating R, F, W, C Intermediate High Epoxy Mixing and Handling Product Skill Level of Procedure Description Illustration Class Level Conformance Epoxy Mixing and Handling R, F, W, C Intermediate High vii IPC-7711A/7721A October 2003. Table of Contents PART 2 Rework of Electronic Assemblies 3 Removal Through-Hole Removal Level of Round Lead Procedure Description Product Class Skill Level Conformance Continuous Vacuum Method R,F,W Intermediate High Continuous Vacuum Method - Partial Clinch R,F,W Intermediate High Continuous Vacuum Method - Full Clinch R,F,W Intermediate High Full Clinch Straigthening Method R,F,W Intermediate High Full Clinch Wicking Method R,F,W Advanced High PGA and Connector Removal Level of Procedure Description Product Class Skill Level Conformance Solder Fountain Method R,F,W,C Expert Medium Chip Component Removal Level of Procedure Description Product Class Skill Level Conformance Bifurcated tip R,F,W,C Intermediate High Tweezer Method R,F,W,C Intermediate High Bottom Termination - Hot Air Method R,F,W.

6 C Intermediate High Leadless Component Removal Level of Procedure Description Product Class Skill Level Conformance Solder Wrap Method R,F,W,C Advanced High Flux Application Method R,F,W,C Advanced High viii October 2003 IPC-7711A/7721A. SOT Removal Level of Procedure Description Product Class Skill Level Conformance Flux Application Method R,F,W,C Intermediate High Flux Application Method - Tweezer R,F,W,C Intermediate High Hot Air Pencil R,F,W,C Intermediate High Gull Wing Removal (two sided). Level of Procedure Description Product Class Skill Level Conformance Bridge Fill Method R,F,W,C Intermediate High Solder Wrap Method R,F,W,C Intermediate High Flux Application Method R,F,W,C Intermediate High Bridge Fill Method - Tweezer R,F,W,C Advanced High Solder Wrap Method - Tweezer R,F,W,C Advanced High Flux Application Method - Tweezer R,F,W,C Advanced High Gull Wing Removal (four sided).

7 Level of Procedure Description Product Class Skill Level Conformance Bridge Fill Method - Vacuum Cup R,F,W,C Advanced High Bridge Fill Method - Surface Tension R,F,W,C Intermediate High Solder Wrap Method - Vacuum Cup R,F,W,C Advanced High Solder Wrap Method - Surface Tension R,F,W,C Intermediate High Flux Application Method - Vacuum Cup R,F,W,C Advanced High Flux Application Method - Surface Tension R,F,W,C Intermediate High Bridge Fill Method - Tweezer R,F,W,C Advanced High Solder Wrap Method - Tweezer R,F,W,C Advanced High Flux Application Method - Tweezer R,F,W,C Advanced High Hot Gas Reflow Method R,F,W,C Advanced High ix IPC-7711A/7721A October 2003. J-Lead Removal Level of Procedure Description Product Class Skill Level Conformance Bridge Fill Method - Tweezer R,F,W,C Advanced High Bridge Fill Method - Surface Tension R,F,W,C Advanced High Solder Wrap Method - Tweezer R,F,W,C Advanced High Solder Wrap Method - Surface Tension R,F,W,C Advanced High Flux Application Method - Tweezer R,F,W,C Advanced High Flux & Tin Tip Only R,F,W,C Advanced High Hot Gas Reflow System R,F,W,C Advanced High BGA/CSP Removal Level of Procedure Description Product Class Skill Level Conformance BGA/CSP Removal R,F,W,C Advanced High Vacuum Method R,F,W,C Advanced Medium PLCC Socket Removal Level of Procedure Description Product Class Skill Level Conformance Bridge Fill Method R,F,W,C Advanced High Solder Wrap Method R,F,W,C Advanced High Flux Application Method R,F,W,C Advanced High Hot Air Pencil Method R,F,W.

8 C Advanced Medium 4 Pad/Land Preparation Level of Procedure Description Product Class Skill Level Conformance Surface Mount Land Preparation - Individual Method R,F,W,C Intermediate High Surface Mount Land Preparation - Continuous Method R,F,W,C Intermediate High Surface Solder Removal - Braid Method R,F,W,C Intermediate Pad Releveling R,F,W,C Intermediate Medium SMT Land Tinning R,F,W,C Intermediate Medium Cleaning SMT Lands R,F,W,C Intermediate High x October 2003 IPC-7711A/7721A. 5 Installation Through-Hole Installation Procedure Description Install following the requirements of J-STD-001 and J-HDBK-001. PGA and Connector Installation Level of Procedure Description Product Class Skill Level Conformance Solder Fountain Method with PTH Prefilled R,F,W,C Expert Medium Chip Installation Level of Procedure Description Product Class Skill Level Conformance Solder Paste Method R,F,W,C Intermediate High Point to Point Method R,F,W,C Intermediate High Leadless Component Installation (To Be Developed).

9 Gull Wing Installation Level of Procedure Description Product Class Skill Level Conformance Multi-Lead Method - Top of Lead R,F,W,C Advanced High Multi-Lead Method - Toe Tip R,F,W,C Advanced High Point-to-Point Method R,F,W,C Intermediate High Hot Air Pencil/Solder Paste Method R,F,W,C Advanced High Hook Tip w/Wire Layover (To be developed) R,F,W,C Intermediate High Blade Tip with Wire R,F,W,C Advanced High J-Lead Installation Level of Procedure Description Product Class Skill Level Conformance Wire Solder Method R,F,W,C Advanced High Point-to-Point Method R,F,W,C Intermediate High Solder Paste Method/Hot Air Pencil R,F,W,C Advanced High Multi-Lead Method R,F,W,C Intermediate High xi IPC-7711A/7721A October 2003. BGA/CSP Installation Level of Procedure Description Product Class Skill Level Conformance Using Wire Solder to Prefill Lands R,F,W,C Advanced High Using Solder Paste to Prefill Lands R,F,W,C Advanced High BGA Reballing Procedure R,C Advanced High 6 Removing Shorts Level of Procedure Description Product Class Skill Level Conformance J-Leads - Draw Off Method R,F,W,C Intermediate High J-Leads - Respread Method R,F,W,C Intermediate High Gull-Wing - Draw Off Method R,F,W,C Intermediate High Gull-Wing - Respread Method R,F,W,C Intermediate High 8 Wires Splicing Level of Procedure Description Product Class Skill Level Conformance Mesh Splice N/A Intermediate Low Wrap Splice N/A Intermediate Low Hook Splice N/A Intermediate Low Lap Splice N/A Intermediate Low xii October 2003 IPC-7711A/7721A.

10 Table of Contents PART 3 Repair and Modification of Printed Boards and Electronic Assemblies Legends/Markings Product Skill Level of Procedure Description Illustration Class Level Conformance Legend/Marking, Stamping R, F, W, C Intermediate High Method Legend/Marking, Hand Lettering R, F, W, C Intermediate High Method Legend/Marking, Stencil Method R, F, W, C Intermediate High Blisters and Delamination Product Skill Level of Procedure Description Illustration Class Level Conformance Delamination/Blister Repair, R Advanced High Injection Method Bow & Twist Product Skill Level of Procedure Description Illustration Class Level Conformance Bow and Twist Repair R, W Advanced Medium Hole Repair Product Skill Level of Procedure Description Illustration Class Level Conformance Hole Repair, Epoxy Method R, W Advanced High Hole Repair,Transplant Method R. W Expert High xiii IPC-7711A/7721A October 2003.