ELECTRONICS INDUSTRIES Rework of Electronic …

1 IPC-7711 - Includes Change 1 Rework of ElectronicAssembliesDeveloped by the Electronic Assembly Rework Task Group (7-34b)of IPCU sers of this standard are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 , Chg 1 - May 2002 IPC-7711 - February 1998 Supersedes:IPC-R-700C - January 1988 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES AcknowledgmentAny Standard involving a complex technology draws material from a vast number of sources. While the principal members of theIPC Electronic Assembly Rework Task Group (7-34b) of the Product Assurance Committee are shown below, it is not possible toinclude all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their AssuranceCommitteeElectronic Assembly ReworkTask GroupTechnical Liaison of theIPC Board of DirectorsChairmanMel ParrishSoldering Technology InternationalChairmanDaniel L. FosterSoldering Technology InternationalVice ChairmanPeggi BlakleyNSWC CraneWilliam Beckenbaugh, CorporationA Special Note of AppreciationThe following core group hasvolunteered much of their time andhave made significant contributionsto this , Peggi, NSWC CraneBrock, Ron, NSWC CraneDay, Jennifer, Current CircuitsFerry, Jeff, Circuit TechnologyCenter, , Daniel L.

2 , Soldering TechnologyInternationalHersey, Ralph J., Ralph Hersey& AssociatesHoughton, Bruce, CelesticaCorporationMoffitt, James H., Moffitt ConsultingServicesNorton, John S., Tektronix , Eric, PACE, Assembly Rework Task GroupAoki, Masamitsu, Toshiba , Peter, Cisco Systems , Timothy E., Alcatel USAB ergum, Erik J., Polyclad LaminatesBlakley, Peggi, NSWC CraneBoerdner, Richard W., EJE ResearchBogert, , Bechtel Plant Machinery, , Diana, Soldering TechnologyInternationalBrock, Ron, NSWC CraneCash, Alan S., Northrop GrummanCorporationChen, D. Phillip, Honeywell CanadaCirimele, Ray, BEST Andrade, Derek, Surface MountTechnology CentreDaugherty, Dale, Siemens Energy &AutomationDay, Jennifer, Current CircuitsDeane, William, EPTAC CorporationDehne, Rodney, WorldwideDennehy, Charles S., CircuitTechnology Center , William C., BAES ystems ControlsDiFranza, Michele J., The Mitre , Nancy, AssembliesHallstead , Thomas R., Boeing Aircraft& MissilesFalconbury, Gary, Raytheon TechnicalServices , Jeff, Circuit Repair CorporationFieselman, Charles D.

3 , SolectronTechnology , Daniel L., Soldering TechnologyInternationalFreeman, Fortunata A., SolectronTechnology , Alan L., Boeing Aircraft &MissilesGonzalez, Constantino, ACME, , William F., Plessey TellumatSouth AfricaGrim, Edward A., Raytheon SystemsCompanyHargreaves, Larry, DC. Scientific , Steven A., Hughes DefenseCommunicationsHiett, Carol E., Lockheed MartinAstronauticsHill, Michael E., Dynamic Details , David P., Circuit Graphics , F. D. Bruce, CelesticaHymes, Les, Les Hymes AssociatesJohnson, Kathryn L., Hexacon ElectricCompanyJohnson, Laurence G., General , Sue A., Compaq ComputerCorporationKemp, Cindy A., Evenflo , Richard, Bahiatech BahiaTechnologia , Terence, Axiom ELECTRONICS , , Robert J., GlasteelIndustrial LaminatesKorth, Connie M., ReptronManufacturing Services/HibbingLambert, Leo P., EPTAC CorporationLee, Frederic W., Northrop GrummanNorden SystemsMacLennan, Karen E., M/A-COM , Peter E., PEM ConsultingMalewicz, Wesley R., Siemens MedicalSystems , John, Sypris ELECTRONICS ,LLCA special note of thanks is due to PACE, Metcal and Circuit Technology Centerfor the preparation of the illustrations in this 2002 IPC-7711iiiMay, William Dean, NSWC - CraneMcCormick, Becky, EMD , Jr.

4 , Stephen, White ElectronicDesigns , Christine A., FORE SystemsMoffitt, James H., Moffitt ConsultingServicesMoir, Jim, Hewlett Packard , Yori, Hadco , DavidNortham, Riley L., EMPF/ACIN orton, John S., Tektronix , Benetta, IEC , Seppo, Nokia Networks,Switching PlatformParrish, Mel, Soldering TechnologyInternationalPoelking, Monica, Defense SupplyCenter ColumbusQuinn, Paul J., Lockheed MartinMissiles & SpaceRaby, Jim D., Soldering TechnologyInternationalRassal, David, 3 COM CorporationRausch, James E., Delphi DelcoElectronics SystemsRaye, John F., Defense Supply CenterColumbusRobertson, David , Teresa M., AAI CorporationSanford, Kelly, Micron Custom , Patricia A., SolderingTechnology InternationalSherman, Lowell, Defense SupplyCenter Columbus DSCCS iegel, Eric, PACE, , Rick B., Motorola , Douglas J., Essex TechnologiesGroup, , David B., Lucent , Wayne A., Rockwell CollinsTevels, John R., Harris , Ronald E., NSWC - CraneTorres, Steven, Corlund , Sharon T.

5 , Aviation &Missile CommandWoodford, James Walter, Departmentof DefenseWooldridge, James R., RockwellInternationalXiao, Nora, Tektronix , Don, Honeywell s documentation strategy is to provide distinct documents that focus on specific aspects of Electronic packaging this regard document sets are used to provide the total information related to a particular Electronic packaging topic. Adocument set is identified by a four digit number that ends in zero (0) ( , IPC-7710).This standard is intended to provide information on the Rework , repair and modification of printed boards and electronicassemblies. This information must also be supplemented by a performance specification that contains the requirements forthe chosen technology. When used together, these documents should lead both manufacturer and customer to consistentterms of documents supersede the following:IPC-7711 supersedes IPC-R-700 CIPC-7721 supersedes IPC-R-700 CAs technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-ment set.

6 The IPC invites input on the effectiveness of the documentation and encourages user response through completionof Suggestions for Improvement forms at the end of each 2002ivTable of Contents1 12 Handling/CleaningProcedureDescriptionPro duct ClassSkill LevelLevel Electronic AssembliesR,F,W, ,F,W, ConditioningProcedureDescriptionProduct ClassSkill LevelLevel and PreheatingR,F,W, CoatingProcedureDescriptionProduct ClassSkill LevelLevel , Identification of Conformal CoatingR,F,W, , Solvent MethodR,F,W, , Peeling MethodR,F,W, , Thermal MethodR,F,W, , Grinding/Scraping MethodR,F,W, , Micro Blasting MethodR,F,W,CAdvancedHigh3 Through-Hole RemovalProcedureDescriptionRound LeadProduct ClassSkill LevelLevel Vacuum MethodR,F, Vacuum Method - Partial ClinchR,F, Vacuum Method - Full ClinchR,F, Clinch Straigthening MethodR,F, Clinch Wicking MethodR,F,WAdvancedHighMay 2002 IPC-7711v4 Pad/Land PreparationProcedureDescriptionProduct ClassSkill LevelLevel Mount Land Preparation - Individual MethodR,F,W, Mount Land Preparation - Continuous MethodR,F,W, Solder Removal - Braid MethodR,F,W, RelevelingR,F,W, Land TinningR,F,W, SMT LandsR,F,W,CIntermediateHigh5 Through-Hole InstallationProcedureDescriptionInstall following the requirements of J-STD-001 PGA and Connector InstallationProcedureDescriptionProduct ClassSkill LevelLevel Fountain Method with PTH PrefilledR,F,W, Chip InstallationProcedureDescriptionProduct ClassSkill LevelLevel Paste MethodR,F,W, to Point MethodR,F,W, Leadless Component Installation(To Be Developed) Gull Wing InstallationProcedureDescriptionProduct ClassSkill LevelLevel Method - Top of LeadR,F,W, Method - Toe TipR,F,W, MethodR,F,W, Air Pencil/Solder Paste MethodR,F,W, Tip w/Wire Layover (To be developed)

7 R,F,W, Tip with WireR,F,W,CAdvancedHighIPC-7711 May J-Lead InstallationProcedureDescriptionProduct ClassSkill LevelLevel Solder MethodR,F,W, MethodR,F,W, Paste Method/Hot Air PencilR,F,W, MethodR,F,W, BGA/CSP InstallationProcedureDescriptionProduct ClassSkill LevelLevel Wire Solder to Prefill LandsR,F,W, Solder Paste to Prefill LandsR,F,W, Reballing ProcedureR,CAdvancedHigh6 Removing ShortsProcedureDescriptionProduct ClassSkill LevelLevel - Draw Off MethodR,F,W, - Respread MethodR,F,W, - Draw Off MethodR,F,W, - Respread MethodR,F,W,CIntermediateHigh7 Bonding/CoatingProcedureDescriptionProdu ct ClassSkill LevelLevel Mixing and HandlingR,F,W, , Solder ResistR,F,W, , Conformal Coatings/EncapsulantsR,F,W,CIntermediate High8 SplicingProcedureDescriptionProduct ClassSkill LevelLevel SpliceN/AIntermediateLowMay 2002 IPC-7711ixRework of Electronic ScopeThis document covers procedures for repair-ing and reworking printed board assemblies.

8 It is an aggre-gate of information collected, integrated and assembled bythe Repairability Subcommittee (7-34) of the ProductAssurance Committee of the PurposeThis document prescribes the proceduralrequirements, tools and materials and methods to be usedin the modification, Rework , repair, overhaul or restorationof Electronic products. Although this document is based inlarge part on the Product Class Definitions of ANSI/J-STD-001, this document should be considered applicable to anytype of Electronic equipment. When invoked by contract asthe controlling document for the modification, Rework ,repair, overhaul or restoration of products, the requirementsflowdown has identified the most common equipment and pro-cess in order to affect a specific repair or Rework . It is pos-sible that alternate equipment and processes can be used tomake the same repair. If alternate equipment is used, it isup to the user to determine that the resultant assembly isgood and Definition of RequirementsThe wordsmustandshallhave no special meaning beyond that commonly usedin other IPC Requirements FlowdownThe applicable require-ments of this document must be imposed by each manufac-turer or supplier on all applicable subcontracts and pur-chase orders.

9 The manufacturer or supplier must notimpose or allow any variation from these requirements onsubcontracts or purchase orders other than those that havebeen approved by the user. Unless otherwise specified, therequirements of this document are not imposed on the pro-curement of off the shelf assemblies or , the manufacturer of these items may comply asdeemed BackgroundToday s PC boards are more complexand microminiaturized than ever before. Despite this, theycan be successfully modified, reworked or repaired if theproper techniques are followed. This manual is designed tohelp you repair, Rework and modify PC boards reliably. Theprocedures in this document have been obtained from endproduct assemblers, printed board manufacturers and endproduct users who recognized the need for documentingcommonly used Rework , repair and modification tech-niques. These techniques have, in general, been proven tobe acceptable for the class of product indicated throughtesting and extended field functionality.

10 Procedures con-tained herein were submitted for inclusion by commercialand military organizations too numerous to list individu-ally. The Repairability Subcommittee has, where appropri-ate, revised procedures to reflect completed satisfactorily will meet the originalspecification and requirements of IPC-A-600 and IPC-A-610. But, by definition, modifications and repairs do notcomply with the initial design or fabrication criteria. Formodification and repair, the user must recognize that thecriteria in IPC-A-600 Acceptability of Printed Boards andIPC-A-610 Acceptability of Printed Board Assemblies arenot necessarily applicable to the procedures herein. Modi-fications and repairs should not compensate for the lack ofproper processes and quality controls. Ultimate cost effec-tiveness is achieved using appropriate design, fabricationand assembly techniques that minimize the need for modi-fication and ControlsAlthough modification, Rework and repairprocedures may be very similar, the control of such proce-dures may not be the same, due to the conditions andobjectives revision of the functional capability of a productin order to satisfy new acceptance are usually required to incorporatedesign changes which can be controlled by drawings,change orders, etc.