EXTENDED PERFORMANCE 200MM Higher test cell utilization ...

1 4090 +Test Managers Are Driven To Reduce Rising Test CostsAgreater portion of the total chip manufacturingcost is now spent on test as devices become morecomplex and smaller. Test floor managers aretasked with driving down the cost of test and operating their test floors as efficiently as Test Cell Efficiency and Increased CapabilitiesThe requirement for lower test cell costs, combined with new wafer test requirements for the latest device types, has prompted manufacturers to search for new ways to improvetheir test cell efficiency while expanding theirapplication PERFORMANCE for 200mmProductivity BreakthroughElectroglas has undertaken a whole new approachto enhancing its flagship 200MM wafer probersystem. The new system, the 4090 +, enablescustomers to lower their test cell costs throughsignificant PERFORMANCE improvements that resultin increased test cell availability, Higher throughput and simplified operation. As the 4090 + improves PERFORMANCE , it alsoexpands existing capabilities with superior accuracy for testing fine pitch , the 4090 + provides a new feature,MicroTouch , which decreases the impact force as the probe pins contact the bond pads to reduce pad damage to Cu, low-k and SOI test cell utilization and hands-offoperation for the lowest cost of test The 4090 +is a new EXTENDED PERFORMANCE version of the Electroglas 4090 prober that enables high test cell utilization for thermal applications, simplifies probingoperations,increases throughput, and expands application capabilities with softtouchdown features for advanced copper and low-k dielectric devices.

2 These productivityand capability enhancements are also available as an upgrade to existing Electroglas4080, 4090, and 4090 probers. Fine-pitch enhancedaccuracy over a broadtemperature range of themotion system and automaticsystem calibration make the4090 + ideal for testingtoday's leading edge deviceswith fine pitch pads. Quickly test at different thermal technologyallows testing to resumerapidly after changing temperatures. Damage-free probing of Cu,low K and SOI wafers with soft newMicroTouch feature allowsthe user to control the velocity of the Z stage justbefore contact and duringovertravel to reduce probedamage to low-k dielectrics,circuitry under bond pads,and aluminum cappedcopper pads. Robust wafer auto focus andlighting algorithms combinedwith new pattern recognitiontechniques enhance the reliability of auto-align inmixed contrast environments. High-speed probe card probe card alignmenttechniques align the mostadvanced probe cards 75% faster than traditionaltechniques.

3 Comprehensive Z accuracy accuracy isenhanced in four ways:stage accuracy, pindetection, wafer profiling and thermal PERFORMANCE 200 MMPROBER FOR HIGH-VOLUME ANDLEADING-EDGE MANUFACTURING5/06 Fine pitch capabilityUsing the same proven platen motor technology,with frictionless air bearings, accuracy performanceis increased by 25%. During manufacturing or anupgrade, a Prober Accuracy Measurement System(PAMS) is used to map and correct for cyclic andlinear errors at multiple 4090 + increases test cell availability bymaintaining excellent alignment of probe pins to bond pads without operator adjustments. The temperature of the probing environment isconstantly changing and the effects of this changecan be seen on the probe-to-pad positioningwithin a wafer and across the lot. The systemautomatically senses thermal shifts of systemcomponents and probe pins adjusts the probes-to-pad contact as required. All of this isaccomplished with the wafer on the chuck andwithout alignment tools or operator intervention.

4 During a temperature change over, testing withthe 4090 + can begin immediately after the chuckreaches the set point, even while componentswithin the prober are still expanding or provides a significant increase in testerutilization and cost savings. Operation of the 4090 + has been significantlysimplified and automated, making it easier and faster for operators to use. The 4090 + allowsoperators to efficiently start probing and walkaway while the prober automatically completes allnecessary tasks to setup and align the probe cardand wafers. Each of these automation steps has beenredesigned for robustness to increase the timebetween assists (MTBA). When combined withself-calibration features, this improved automationone-button probing slashes the operator and technician time needed to adjust probers and perform manual operations. SYSTEM INFORMATIONThe "Plus" Upgrade is available for 4080, 4090,and 4090 probers. An upgraded 4080 does notfully equal a 4090 + but provides equivalent productivity enhancements.

5 Other Electroglas products and solutions,including Electroglas' prober software productsand the SORT manager Test Floor ManagementSoftware family, can enhance or expand on thecapabilities of Electroglas 4000 Series Next, Easy StepFor more information on how the 4090 + canlower your test cell costs and probe your mostadvanced devices, contact your Electroglas salesrepresentative at (800) 538-5124 or mark images after probing, unloading, loading, and aligning a wafer five times. The excellentwafer-to-wafer accuracy of the 4090 + is demonstrated by the centered placement of all five probemarks on every pad and die of this wafer using a standard cantilever probe Fontanoso Way, San Jose CA 95138 TEL: (408) 528-3000 FAX: (408) 528-3562(800) 538-5124 , INNOVATIVETOOLS FOR TESTE lectroglas is Focused on AdvancingInnovative Technologies to Meet EvolvingChallenges in Semiconductor is all about ensuring device qualityand manufacturing PERFORMANCE .

6 In the high-volume manufacturing environment of our customers, our innovative productsprovide substantial value and help lowerthe overall cost of delivers high-speed tools forwafer probing and package test that arereliable, accurate and production , we are focused on overcoming our customers' evolving test challenges,partnering with them to develop solid solutions for wafer probing, prober-basedtest handling, and test management that will drive greater efficiencies in their wafer and device testing processes. Our customers have rapid, direct access to our worldwide team of experts for service and Probers for Any Test Environment;With Shipments of Over 15,000 SystemsElectroglas' probers have been meeting a variety of probing needs for more than40 years. These automated systems consistently deliver accurate,reliable wafer probing for high volume, low costmanufacturing, as well as leading edge,multi-die, bumped wafer, in-line parametrictest and fine-pitch probing Test Handlers for Today'sLatest Packaging Technologies Electroglas' test handlers are built uponproven prober technology to give chip-makersa fast,flexible handling solution for today sfinal test challenges.

7 Strip test handlersdeliver unprecedented throughput for testing a wide variety of popular packagetypes in panel or leadframe handlers have unique capabilitiesfor testing Wafer Level Packages (WLP),Known Good Die (KGD) on diced wafers,Microelectro-mechanical Systems (MEMS),and ultra-thin Floor Management Software for Web-Based Process Analysis and ControlElectroglas test floor management softwareprovides a unique,networked solution toconnect wafer probers and test handlers to the broader testing infrastructure,allowing the chipmaker to better manageoverall test effectiveness with accurateand efficient tools for monitoring, analyzingand improving important Products Backed by Global Service for Fastest Response Electroglas' customer service centers arelocated worldwide for rapid-response fieldservice and local spare parts demonstrates its commitmentto total customer satisfaction through service excellence backed by factory-basedtechnical support,applications developmentand training.