FCCL - kisehome.or.kr

1 FCCL FCCL 2011. 5. 20 SlittingCTE / -1/13--1/16- Cu , Drum Speed , , (AOI) Knife Setting - / /L ot T r a c k i ng -Distributed ControlSystem-Real Time PlantInformationSystem - -Ray , FESEM, EDS- , - (AAS, ICP), 1 stepNucleationCopper foilDrum(Shinyside) CheckListDrum (Shiny side)2 StepGrowth3 StepGrowthDrum (Shiny side)Drum (Shiny side)-2/13--2/16-Anode : CuSO4+ 2H++ 2e Cu + H2SO4 Cathode: H2O 2H++ 2e + O2 Total reation : CuSO4+ H2O H2SO4+ Cu+ O2 Check ListThicknessRoughnessTensile strenthElongationSurface (Micro-porosity, Pinhole et al)ThicknessRoughnessTensile strenthElongationSurface (Micro-porosity, Pinhole et al) MechanicalBondingCorrosionResistanceChem icalBondingHeat/ChemicalResistance-3/13- -3/16-BondingResistanceBondingResistance Check ListCheck ListPeel Strength RoughnessPeel Strength RoughnessHeat resistanceChemical-resistanceHeat resistanceChemical-resistanceSlitting -4/13--4/16-Check ListCheck ListPeel Strength RoughnessPeel Strength RoughnessHeat resistanceChemical-resistanceHeat resistanceChemical-resistance FCCL (Flexible Copper Clad Laminate) FCCL , , / Pick-up FCCL / CCL FCCLCCL1)FCCL FCCL10 PCB3) (Matte )FPC4) (Matte )

2 Polyimide FR-42)10 CCL-5/13--5/16- : Polyimide : Barrier : : Polyimide Rigid PCB1) CCL: Copper Clad Laminate, 2) FR-4 : , 3) PCB: Printed Circuit Board, 4) FPC: Flexible Printed Circuit BoardFlexible Flexible PCBPCBPCB , L/S 20 / 20 L/S 30 / 30 L/S 40 / 40 L/S 50 / 50 L/S 60 / 60 Road Map (Rz, )30 4. 0 5. 0 6. 0 LSU-STN 12 LSU-STN 18 LSU-STN 35 LSBLPV18-6/13--6/16- ( )5 10 15 30 50 2. 0 3. 0 LSB-FXN 12 LSB-FXN 9 LSB-FXN 7 Carrier 3~5 LSB-LPV 18 9~12 LSB-FXU 12 FCCL(Flexible Copper Clad Laminate) ( , Polyimide) ( ) LCD COF Flexible PCB Substrate FCCL FCCL iiCCCL (Flexibility) 3 Rigid PCBF lexible PCBCCLFCCL 3 Width48158 Width250500 -7/13-Polymer ( ) Copper ( ) COF ApplicationFPC ApplicationWidth 48~158 Width 250, 500 , Rigid PCB Flexible , , Fine Pitch Flexible PCB , 2 Layer Shift Substrate Trend Substrate forRiidPCBL aminatingThick+CCLC opperRigidPCBR igid PCBaminatingSubstrate forFlexible PCBL aminatingSputteringCti (12~70 )Prepreg+Polyimide(PI)(75 )FCCL(3 Layer)+Adhesive(10~20 ) (12~35 )+FCCL()PolyimideAdhesiveCopperPrepregRi gid PCBF lexible PCBTCP-8/13-PCB: Printed Circuit BoardCCL: Copper Clad LaminateFCCL.

3 Flexible Copper Clad LaminateThinCastingLaminating+Polyimide( PI)(25~38 )(2 Layer) (12~18 )PolyimideCopperPrepreg : Glass fiber Epoxy Main Trend of CCLF lexible, 2 Layer, Environment FriendlyCOFF lexible PCB Adhesive TypeAdhesiveless Type3 FCCL2 FCCLC asting/LaminatingSputteringCFilCopper FoilSputtering + Electroplating2 FCCL 3 FCCL PI (Varnish/Film)Copper FoilPI FilmCu LayerPI FilmAdhesivePI FilmCu LayerPI (Varnish/Film)Copper FoilCopper FoilPI FilmAdhesive-9/13- Fine Pitch GoodGoodGoodGood ng Copper Foil Pitch CopperFoil- / - Epoxy FCCL Casting, Laminating Fine Pitch , Sputtering Fine Pitch LayerCastingLaminatinPIAdhesiveor TPIC opper FoilPI12~70 12~35 50 CopperFoilPI VarnishPIAdhesive or TPIFoilRoll: , Resin, Epoxy- : -PI Varnish : , -Casting - :Tension - Laminating - 12 9 Fine Pitch - Short - Fine Pitch Ovenxxxxxxxx3 2 2 -10/13-SputteringTie CoatElectroPlatingPI2~8 40 40 Copper Foil: Tension : -Plasma - Sputtering - -2 - Fine Pitch -Bending , - Driver IC Bonding PIVacuum ChamberTargetDrum+Anode (Cu ball)----xxxx2 2 FCCL Laminating Casting Sputtering CopperLayer Limited, Difficult Limited, DifficultEasy Thickness ( )12, 1812, 188 Surface Defect Etching LayerCu layer onlyCu layer onlyCu layer + Sputtered LayerPILayerManufacturing MethodThermoplastic PI + PI 2 Casting(Varnish Coating+Drying)PI FilmThickness ( )404038 (35)Total Thickness( )52 52 46 -11/13-* ILB.

4 Inner Lead BondingGoodGoodGoodGoodFine Pitch TransparencyPeel Strength Ion MigrationPrice2 FCCL 2 CCLLCDAutoMobilePDAPMPHDDN otebook PC-12/13-2 CCLDVCDSCDMBC ellular PhoneSputter Type FCCL Sputter Type FCCL PI Tie-coat Cu Seed , NiCr Tie-coat Layer( )Cu Seed LayerSputtering Electroplating Cu Layer (8 )E lectroplat ing PET Fillm (50 )Polyimide Fi lm (25,38 )(100~300 )( ~ )(8 )Laminating & Slitting Stiffener (PET Film) Slitting : 48, 70, 96, 105, 158, 250 -13/13-StiffenerPolyimideCopperPolyimide CopperCopperPolyimideCopperLCD COF ( )FPC ( )FPC ( )Plasma Treatment & Sputtering( ) Electroplating( )Laminating & Slitting(Stiffener )FCCL Sputtering Electroplating Sputter Type FCCL PI Film (PET Film)-14/13- PI Film (NiCr/Cu) FCCL (48~250 )PI Film ( )Tie-coat : PI Cu : Cu PI Cu seed.

5 Stiffener ( ) FCCL COF fine pitch FCCL Fine PitchFine Pitch - -Tiecoat Layer - (PI film )-Sputter Trouble - -15/13- -PI Film Thermal Damage - (Curl, Twist )- -Tiecoat , , - - , - Etch FactorFine Pitch /PI Low Profile BottomTopThicknessEtched Lead PI FilmEtch Factor =2 Thickness( Bottom Top ) PI Film - PI Film / Tie-coat Roughness Tie-coat MaterialMt il(Ni CNiCAllt)OuterLead Semi-additive Process -16/13--Material (Ni, Cr, Ni-Cr Alloy etc)- Composition- Thickness Electroplated Cu Layer - Grain Size & Distribution- Texture (Crystallographic Orientation)Outer LeadInner Lead Chip LCD Panel, PCB FCCL 1.

6 4 2. (Method B)3. 150 C, 30min annealing (Met hod C)4. MD, TD LS LU S LPo te ntia l (Within) Ca pa b ilityWithinOverall1. PI Film : , 2. 3. Roll to roll Tension 4. , -17 * ra ll Ca pa bility Surface Morphology(After Plasma Treatment)- Fine Pitch Normal SurfaceDamaged Surface: P l a s m a ( D C , A C , R F ) , I o n G u n- , : Ar, O2, N2 - Power -PI film - Tie-coat : , - -18/13-R/WU/WDrumPretreatmentTargetPatte rn- -P I F i l m.