FloTHERM PACK User's Guide - flopack.com

1 Note - Viewing PDF files within a web browser causes some links not to function. Use HTML for full navigationFloTHERM pack user s GuideSoftware Version October 2018 Document Revision 5 Unpublished work 2010-2018 Mentor Graphics CorporationAll rights reserved. This document contains information that is confidential and proprietary to Mentor Graphics Corporation, SiemensProduct Lifecycle Management Software Inc., and their affiliates (collectively, "Siemens"). The original recipient of thisdocument may duplicate this document in whole or in part for internal business purposes only, provided that this entirenotice appears in all copies. In duplicating any part of this document, the recipient agrees to make every reasonableeffort to prevent the unauthorized use and distribution of the proprietary document is for information and instruction purposes. Siemens reserves the right to make changes in specifications and other information contained in this publication without prior notice, and the reader should, in all cases, consult Siemens to determine whether any changes have been terms and conditions governing the sale and licensing of Siemens products are set forth in written agreements between Siemens and its customers.

2 No representation or other affirmation of fact contained in this publication shall be deemed to be a warranty or give rise to any liability of Siemens MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR SHALL NOT BE LIABLE FOR ANY INCIDENTAL, DIRECT, INDIRECT, SPECIAL, OR CONSEQUENTIAL DAMAGES WHATSOEVER (INCLUDING BUT NOT LIMITED TO LOST PROFITS) ARISING OUT OF OR RELATED TO THIS PUBLICATION OR THE INFORMATION CONTAINED IN IT, EVEN IF SIEMENS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH GOVERNMENT LICENSE RIGHTS: The software and documentation were developed entirely at private expense and are commercial computer software and commercial computer software documentation within the meaning of the applicable acquisition regulations. Accordingly, pursuant to FAR 48 CFR and DFARS 48 CFR , use, duplication and disclosure by or for the Government or a Government subcontractor is subject solely to the terms and conditions set forth in the license agreement provided with the software, except for provisions which are contrary to applicable mandatory federal : The trademarks, logos and service marks ("Marks") used herein are the property of Siemens or other parties.

3 No one is permitted to use these Marks without the prior written consent of Siemens or the owner of the Mark, as applicable. The use herein of a third- party Mark is not an attempt to indicate Siemens as a source of a product, but is intended to indicate a product from, or associated with, a particular third registered trademark Linux is used pursuant to a sublicense from LMI, the exclusive licensee of Linus Torvalds, owner of the mark on a world-wide pack user s Guide , 2018 Revision HistoryRevisionChanges Date11. The following exception has been removed from the first bulleted paragraph in Generating a Two-Resistor Compact Model as it no longer applies: ..solder ball modeling options FloTHERM pack assumes an orthotropic, lumped approximation even if the detailed model choice is Restrictions have been updated for Generating DELPHI Compact Models from Uploaded PDMLJuly 20122 Detailed trace modeling added to improve accuracy for low pin count power packages and QFNs, see Detailed Trace Modeling.

4 Feb 20133 Material property values of die flags are inherited from either the lead or spreader material, depending on the package type, see Material Properties section of Die 20144 Broken link to Application Note fixed in DELPHI Application 201451. Free trials statement removed from Logging In section as these are no longer Broken link to VRML viewers fixed in Library Preview Changes due to replacement of SupportNet by Support 2018 FloTHERM pack user s Guide , HistoryOctober 2018 FloTHERM pack user s Guide , 2018 Table of ContentsChapter 1 What is FloTHERM pack ? ..11 Chapter 2 Getting Started ..13 Introduction ..13 Logging In ..13 Workbench Structure ..13 The Library Menu ..15 Summary Tab ..15 Edit Design Tab ..17 Compact Model Tab ..19 Advanced Tab ..22 Add Test Tab..23 Detailed Model Tab ..23 Library Preview Tab ..25 user Preferences ..25 Managing Your Folders ..26 For Corporate Account Administrators Only ..27 Managing Your Libraries..27 Moving a Library ..27 Deleting a Library.

5 27 Copying, Renaming a Library..27 Sending Library to Another FloTHERM pack user ..28 Sorting Your Library Display ..28 The Search Options ..28 Basic Search ..28 Advanced Search ..28 Chapter 3 General Functionality ..31 Attaching a PDML file to a Design and Generating a Compact Model ..31 Attaching a PDML File to a Design ..31 Standard JEDEC Test Models ..33 Using the JEDEC Test Environment Wizard ..33 Downloading and Importing into FloTHERM ..35 Material Library ..35 Assigning Materials in a Design ..35 The Main Material Library ..37 Adding a New Material..37 Editing an Existing Material ..38 user Privileges (Single- user Account)..38 Table of Contents6 October 2018 FloTHERM pack user s Guide , Privileges (Corporate Account) ..38 Chapter 4IC Packages ..39 Die..40 Using the Non-Uniform Heat Flux Feature ..41 Die Attach ..49 Die Flag..50 Encapsulant ..52 Bond Wires ..53 Solder Balls ..55 Uploading a Solder Ball Array Configuration Using a CSV File..58C4 Interconnect ..61 Leadframes.

6 63 Organic Substrate ..65 Ceramic Substrate ..69 Chapter 5 Package Families ..71 Cavity-Up Plastic Ball Grid Array (PBGA) ..72 Cavity-Down Plastic Ball Grid Array (PBGA) ..76 Wire-Bonded and Flip-Chip Ceramic Ball Grid Array (CBGA) ..78 Wire-Bonded Tape Ball Grid Array (TBGA) ..81 Micro-BGA ..83 Cavity-Up and Cavity-Down Ceramic Pin Grid Arrays (CPGA)..85 Chapter 6 Compact Modeling ..89 Two-Resistor Compact Models ..89 Theoretical Basis..89 The FloTHERM pack Approach ..91 Generating a Two-Resistor Compact Model ..91 DELPHI Compact Models ..95 DELPHI Compact Models in FloTHERM pack ..95 The Quick Junction Temperature Predictor Tool .. 109 Generating DELPHI Networks from Fluxes.. 111 Generating DELPHI Compact Models from Uploaded PDML .. 114 Customizing Boundary Conditions for DELPHI Model Generation .. 115 DELPHI Application Note .. 121 Detailed Trace Modeling .. 121 FloTHERM pack user s Guide , 2018 List of FiguresFigure 2-1. Main Workbench Display ..14 Figure 2-2. Summary Sheet of IC Component Library with Minimum Data.

7 16 Figure 2-3. Summary Sheet of IC Component Library with All Data Filled ..17 Figure 2-4. Editing Your Design Sheet ..18 Figure 2-5. Localized Gridding Options for Library ..18 Figure 2-6. List of Compact Models Available for Library Item ..19 Figure 2-7. Model Job Submitted ..20 Figure 2-8. DELPHI Compact Model Job in Queue ..20 Figure 2-9. DELPHI Compact Model Job In Progress ..20 Figure 2-10. DELPHI Compact Model Job Finished ..20 Figure 2-11. Two-Resistor Model Results..21 Figure 2-12. DELPHI Model Results showing Resistor Table and Error Histogram ..21 Figure 2-13. Compact Models Listing ..22 Figure 2-14. Upload PDML File ..23 Figure 2-15. Downloading a PDML File of a Modified Detailed Model ..24 Figure 2-16. Open or Save a PDML File ..24 Figure 2-17. user Preferences Screen ..25 Figure 2-18. Folder Management ..26 Figure 2-19. Basic Search Menu on Top Menu Bar of Workbench ..28 Figure 2-20. Advanced Search Screen..29 Figure 3-1. Uploading a PDML File ..32 Figure 3-2. Uploaded (Attached) File Details.

8 32 Figure 3-3. Uploaded PDML File Displayed on Summary Page ..33 Figure 3-4. Attachment Shown in Library Listing..33 Figure 3-5. Sub-Element Link to Material..36 Figure 3-6. Material Library ..36 Figure 3-7. Main Material Library..37 Figure 4-1. Basic Structure of a Die ..40 Figure 4-2. Representation of a Die ..41 Figure 4-3. Non-Uniform Heat Option ..41 Figure 4-4. Multiple Heat Sources Represented in FloTHERM ..42 Figure 4-5. Data Type 1 Manual Selection ..43 Figure 4-6. Data Type 1 Input ..43 Figure 4-7. Data Type 1 Save ..44 Figure 4-8. Data Type 1 File Upload ..45 Figure 4-9. Data Type 1 File Update Load Data ..45 Figure 4-10. Data Type 2 Manual Selection ..46 Figure 4-11. Data Type 2 Manual Entry ..47 Figure 4-12. Data Type 2 Save ..47 Figure 4-13. Die Attach ..49 List of Figures8 October 2018 FloTHERM pack user s Guide , 4-14. Die Flag ..50 Figure 4-15. Encapsulant ..52 Figure 4-16. Bond Wires ..53 Figure 4-17. Bond Wires in a Peripheral Leaded Package and their Representation.

9 53 Figure 4-18. Bond Wires in an Area Array Package and their Representation ..54 Figure 4-19. Solder Ball Array ..55 Figure 4-20. Actual Solder Ball Cross-Section ..56 Figure 4-21. Representation of Solder Ball Cross-Section ..56 Figure 4-22. Actual Solder Balls ..56 Figure 4-23. Collapsed Cuboid Option ..56 Figure 4-24. Representation with Full Cuboid ..57 Figure 4-25. Spurious Lateral Spreading in Isotropic Cuboid ..57 Figure 4-26. Part of a CSV File for Uploading a Solder Ball Array ..58 Figure 4-27. Launching the Solder Balls CSV Upload Tool ..59 Figure 4-28. Upload CSV File Pop-Up ..59 Figure 4-29. Solder Ball Map ..60 Figure 4-30. C4 Interconnect ..61 Figure 4-31. Representation of a C4 Interconnect ..61 Figure 4-32. Structure of a Typical Leadframe in a PQFP Package ..63 Figure 4-33. The Die Flag-to-Leadframe Gap ..63 Figure 4-34. The Leadframe and its Representation ..64 Figure 4-35. Actual Substrate with Metal Trace Layers ..65 Figure 4-36. Representation of Actual Substrate with Metal Trace Layers.

10 66 Figure 4-37. Actual Via ..66 Figure 4-38. Representation of Actual Vias ..66 Figure 4-39. Organic Substrate with Vias ..67 Figure 4-40. Representation of Lumped Vias ..67 Figure 4-41. Ceramic Substrate ..69 Figure 5-1. Plastic Ball Grid Array ..72 Figure 5-2. Key Constituents of a PBGA ..73 Figure 5-3. Wire-Bonded PBGA ..73 Figure 5-4. Flip-Chip PBGA ..73 Figure 5-5. Top Trace Layer and Die Flag ..74 Figure 5-6. Cavity-Down PBGA ..76 Figure 5-7. Structure of a Cavity-Down PBGA..76 Figure 5-8. Ceramic Ball Grid Array ..78 Figure 5-9. Wire-Bonded CBGA ..79 Figure 5-10. Flip-Chip CBGA ..79 Figure 5-11. Capped Flip-Chip CBGA ..79 Figure 5-12. Wire-Bonded TBGA (Half-Symmetric) ..81 Figure 5-13. Structure of a Micro-BGA ..83 Figure 5-14. Ceramic Pin Grid Array ..85 Figure 5-15. Cavity-Up CPGA ..86 Figure 5-16. Cavity-Down CPGA ..86 Figure 6-1. A 2-Resistor Network Compact Model..89 List of FiguresFloTHERM pack user s Guide , 2018 Figure 6-2. Package in a Ring Cold Plate ( FloTHERM Model).