FO-WLPと再配線絶縁材料の 技術･市場展望

1 FO-WLP 103-0004 3-10-14 Tel: 03-5641-2871 Fax: 03-5641-0528 < > FO-WLP (Fan-out Wafer Level Package): Chip-First , RDL-First RDL-First - / , - / < > FO-WLP 1. : - IC AP, RF IC, PMIC, PKG , .. - WL-CSP .. 2. - - RDL RDL 1. : - , FC , RDL, - FO-WLP 2. FO-WLP RDL : WLP / -1- 2 FO-WLP 1. FO-WLP P21 28 WL-CSP FO-WLP FO-WLP FO-WLP 2.

2 FO-WLP P29 40 FO-WLP FO-WLP FO-WLP 3. P41 46 FO-WLP 4. FO-WLP P47 64 FO-WLP AP WL-CSP 5. P65 67 P1 20 1. FO-WLP FO-WLP FO-WLP FO-WLP IC 2. AP FO-WLP AP FO-WLP AP FO-WLP AP AP FO-WLP FC-CSP 3. / FO-WLP FO-WLP 4. IC AP PMIC BB/RF IC 5. FO-WLP RDL RDL RDL / -2- 3.

3 P102 110 4. P111 116 5. P117 166 2014 RDL 2014 ) RDL FO-WLP RDL 2024 RDL FO-WLP FO-WLP FO-WLP 6. P68 94 2014 2014 PKG RDL 2014 2024 PKG RDL PoP /PKG / RDL /PKG RDL / 3 1. P96 99 / 2.

4 P100 101 FO-WLP , HD , , , EM, JSR, , , FT, Dow Chemical, ASE, SPIL, TSMC, Amkor, STATS ChipPAC, Nanium, , Infineon, Freescale, , (FO-WLP) (RDL ) A4 , 166 550,000 CD - 1 - CD PDF 1 (Fax:0120-052-807) FO-WLP.

5 Email.