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FPC Technical Guide - 山下マテリアル株式会社

FPC Technical Guide1. FPC quick delivery course2. YFC Cable( yamashita Flexible Circuit Cable)3. Low-loss FPC(GHz band)4. LCP-FPC suitable for high-speed transmission5. High temperature resistant FPC6. Conduction noise controlling FPC7. Impedance control FPC8. Impedance control FPC(GND mesh)9. Flexible high heat dissipation FPC10. Radiation heat dissipationPrinted Wiring Board11. COMPANY OUTLINE ContentsTechnology friendly to people and the earthCharacteristicExample of use applicationStandard materialsHow to estimate and paymentPayment by PayPal is a quote from the following Base material [polyimide] m 50 m Copper foil 9 m 35 m Electrolytic or Rolled Cover material Coverlay Solder resist Surface finishing Electrolytic gold plating Electrolessgold plating Solder plating etcSingle sided FPCD ouble sided FPC This product is the highly economical FPC that utilizes the characteristics of FPC at a maximum for standard configuration.

FPC Technical Guide 1. FPC quick delivery course 2. YFC Cable(Yamashita Flexible Circuit Cable) 3. Low-loss FPC(GHz band) 4. LCP-FPC suitable for high-speed transmission

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Transcription of FPC Technical Guide - 山下マテリアル株式会社

1 FPC Technical Guide1. FPC quick delivery course2. YFC Cable( yamashita Flexible Circuit Cable)3. Low-loss FPC(GHz band)4. LCP-FPC suitable for high-speed transmission5. High temperature resistant FPC6. Conduction noise controlling FPC7. Impedance control FPC8. Impedance control FPC(GND mesh)9. Flexible high heat dissipation FPC10. Radiation heat dissipationPrinted Wiring Board11. COMPANY OUTLINE ContentsTechnology friendly to people and the earthCharacteristicExample of use applicationStandard materialsHow to estimate and paymentPayment by PayPal is a quote from the following Base material [polyimide] m 50 m Copper foil 9 m 35 m Electrolytic or Rolled Cover material Coverlay Solder resist Surface finishing Electrolytic gold plating Electrolessgold plating Solder plating etcSingle sided FPCD ouble sided FPC This product is the highly economical FPC that utilizes the characteristics of FPC at a maximum for standard configuration.

2 More complex wiring is available than single sided FPC As the harness part can be folded or inflected, three-dimensional allocation in chassis and use for operation part are available. [Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail] : friendly to people and the earthStandard layer configurationCharacteristic The response by small lot is enabled by our FPC production know-how. Even the FPC can be responded without drawing with high flexibility, the product is good for repeated bending. The product with requested length, number of cores and terminal pitch can be produced without initial cost. This product is superior in corrosion resistance and contact stability. Correspond to the pitch, pitch, and pitch (zigzag connection) . The gold plating specification can support lead-free of use application Thickness of coverlay(Polyimide / adhesive ) 25 m/25 m Thickness of copper foil 18 m or 35 m Thickness of base polyimide 25 m Thickness of adhesive of stiffening plate 40 m Polyimide stiffening plate 75 m or 180 mand pitch terminal area standard pattern size (mm)How to estimate and paymentPayment by PayPal is a quote from the following [Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail].

3 Friendly to people and the earthCharacteristics of each type layer structureS21 measurement resultsNote, Data are measured values, it is not a guaranteed value Underdevelopment PTFE-based and Low dielectric cover-lay PTFE-based FPCof 100 m thickness Insulation cover with low dielectric cover-lay This is Structure of most low-loss-12-11-10-9-8-7-6-5-4-3-2-100510 152025303540S21 [ dB/100mm ]Frequency [ GHz ] Evaluation sample specification Impedance single 50 ohmSignal length 100mmMeasurement probe GSG250um pitch LCP-based and Low dielectric cover-lay LCP-based FPC of 50 m thickness Insulation cover with low dielectric cover-lay This low-loss FPC is possible mass production LCP-based and General cover-lay LCP-based FPC of 50 m thickness Bending resistance and heat resistance is excellentin the range of LCP-basedIn development PTFE-based and Low dielectric cover-layLCP-based and low dielectric cover-layLCP-based and General cover-layReference PI-based and General cover-layProduct imageProduct imageProduct imageThickness m 12 Polyimide25 Low dielectric adhesiveRF line28 Conductor100 Poly tetra fluoro ethyleneGND28 Conductor25 Low dielectric adhesive12 PolyimideThickness m 12 Polyimide25 Low dielectric adhesiveRF line28 Conductor50 Liquid crystal polymerGND28 Conductor25

4 Low dielectric adhesive12 PolyimideThickness m 12 Polyimide25 AdhesiveRF line28 Conductor50 Liquid crystal polymerGND28 Conductor25 Adhesive12 PolyimideFeatures of the product It is possible to perform characteristic impedance with the high-precision pattern formation technology. Low dielectric material is used for the insulating layer, and low-roughness foil is used for the conductor, and it is possible to manufacture FPC suitable for high-speed transmission. Since it is a stripline structure with countermeasure for shielding, the role as an alternative to a coaxial cable may be expected. By using LCP for insulation and the adhesive layer, changes in the transmission loss by moisture absorption can be controlled. By using 100 m-thick LCP as the base material, it becomes possible to set a wide range of characteristic diagram of layers and the result of TDR measurementTechnology friendly to people and the earthComparison and evaluation of the transmission loss in the normal state and after moisture absorption [ ]Time [ns]TDR[ m]15 Copper plating18 Copper foil50 LCP18 Copper foil18 Copper foil15 Copper platingGNDGND100 LCP100 LCPRF line-60-50-40-30-20-10001000200030004000 50006000S11 [dB/100mm]Frequency [MHz]S11 (reflection) measurement resultNormal stateAfter moisture [dB/100mm]Frequency [MHz]S21 (loss) measurement resultNormal stateAfter moisture absorptionTransmitter of FPC[Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail].

5 Of the product Since LCP, which has a lower dielectric property than polyimide, also has a low dielectric dissipation factor, signals hardly damp even in a long circuit, and it is possible to transfer signals precisely. All LCP substrates also have excellent long-term heat resistance and comply with MOT of UL Standards (796F).Test method: Check the state after a 240-hour degradation test at 230 Cby winding around a pin gage whose diameter is 5 testing the all LCPC racks in the adhesive after testing the polyimide FPCE xamples of product layer configuration[Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail] : friendly to people and the earthPictures of the productLCPgeneral characteristicsTest itemProcessing conditionsLCP50 m, Cu18 UnitRelative dielectric constant2GH 10GH dissipation factor2GH 10GH absorptionImmersion at 25 Cfor stabilityAfter etchingMDdirectionAfter 50 LCP L1 33L1 + 50L1 LCP 40 50L2 LCP 180 18L2 50 LCP 18L3 50L3 LCP 50L4 LCP 33L4 + 50L4 LCP 402L1liquid resistL1copper foil+copper platingL1paceLCPL2 LCPcover layL2copper foilBaseLCPL3copper foilL3 LCPcover layL4baseLCPL4copper foil+copper platingL4 LCPcover layUnit ( m)LCPcover layAdhesiveReinforcing sheetL4 LCPcover layFeatures of the product This is an FPC which incorporates a noise controlling film "SPINPEDA " manufactured by Shin-Etsu Polymer Co.

6 , Ltd. into the cover layer. It is effective for reducing crosstalk between wirings such as the power source and signals. It is effective in a wide range of high-frequency band, and utilization as an alternative to a bypass evaluationExamples of the purposes of use Cable for hi-speed communicationS41 result of far end crosstalkSPINPEDA without a Fwith a capacitorSPINPEDA with a coverdBGHzPort allocationLayer friendly to people and the earthRFline, virtual power lineGround planeThickness[ m]Image of the actual productVirtual power lineThe effect is verified with and without "SPINPEDA " Fcapacitor mounted positionPort1 Port3 Port4 Port250 line (RFline)Line-to-line gap1mm* The terminals of the ports 2and 3are50 .* The ports 1and 4are for the measurement terminalGSG250 m.[Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail] : of product-The characteristic impedance control is enabled by high-accuracy pattern forming reflection of electric signal in a pattern is prevented and the high-speed transmission circuit can be also supported by interfacing the characteristic performanceEarth and People-friendly technologyMicrostrip lineCoplanarwaveguideStriplineSingle end25, 50, 75 50 50 Differential100 100 100 Tolerance 10 % 10 % 10 %Measurement of characteristic impedance-The characteristic impedance can be measuredby creating a test coupon in a work piece.

7 [ INFORMATION ] yamashita Materials Corporation. Circuitec Company Sales Department TEL : +81-46-251-3722 FAX : +81-46-251-3725 HP : E-mail : of use application-Optical communication module-LVDS communication cable-Hard disk inspection deviceUsed materials-Polyimide (PI)-Liquid crystal polymer (LCP)Measurement frequency[GHz]Transmission loss [dB][ Microstrip line : Single][Coplanar waveguide : Differential ][Strip line : Single ]Characteristics of product-Increase flexibility by mesh the GND of the microstrip performanceEarth and People-friendly technologyComparison of transmission loss S21 * This data is a measured value, it is not a guaranteed lineSingle end50, 75 Differential100 Tolerance 10 %Photo of the test sampleResultGND: Mesh22 gGND : Solid54 g7 mmScalesHeight gaugeRepulsionSpring-back measurement-Mesh size is the repulsive force ina state such as that in by GND : SolidS21 by GND.

8 Mesh[ INFORMATION ] yamashita Materials Corporation. Circuitec Company Sales Department TEL : +81-46-251-3722 FAX : +81-46-251-3725 HP : E-mail : high heat dissipation FPCF eatures of the product FPC uses "ECOOL-F", a thick copper foil flexible copper-clad epoxy laminate manufactured by Panasonic. With the copper foil and the polyimide film, it has heat dissipation equivalent of metal substrate ( ). Bent formation is possible like normal flexible substrate. 3 types of copper foil thicknesses, 75 m,105 mand 150 mare dissipating characteristics JPCA-TMC-LED02T "plane-direction thermal resistance measurement method" In the state the sample is contained in the container for measurement hanged from the top plate, after turning out the LED, apply DC voltage , and turn on the LED. When the temperature of the thermocouple is stabilized, the measurement is of product layer configuration20406080100120 FPC(single-side copper foil)Result of temperature measurementFPC (Single-sided copper foil)Measurement sampleUnit ( m)Cover lay lay adhesive layer25 Copper foil35 Polyimide base25 Copper foil75 105 150 Layer of the back side of the measurement sampleCopper thickness 75 m Result of temperature measurementCopper thickness 105 mResult of temperature measurementCopper thickness 150 mResult of temperature measurementA[front LED side]B[LEDback]A[front LED side]B[LEDback]A[front LED side]B[LEDback][Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail].

9 (Right side of table)D (Left side of table)C (Right side of table)D (Left side of table)C (Right side of table)D (Left side of table)Radiation heat dissipationPrinted Wiring BoardFeatures of the product This is an FPCwhich uses white heatproof resist ink, which realizes high optical reflectance and heat resistance. As an FPC, it has excellent flexibility and resistance to bending. It is possible to apply to high-definition resist apertures suitable for mounting on resistance testHeat dissipation test by radiation[Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail] : PI/Cu:25/18 m)Resist20 mPressurizationContinuous heating in bent statetemperature:150 C 1000 HrBending heatinginitialstateAfter heating(150 C 1000Hr)Currvatureradius(R= )No crackNo crackThermal discolorationHeating temperature:125 C1000Hr750Hr500Hr250 HrinitialEvaluation conditions-Measuring instrument KONICA MINOLTA CM-3600d-Method:SCI-Thickness:20 m-Base material.

10 GlassNormal FPCHeat radiation FPCHeat conduction+Heat radiation CBase(Pi)ResistCopperResistCopperBase(Pi )CopperBase(Pi)ResistCopperTemperature difference between the normal CAdding the heat radiationAddingthe heat radiationelement by the copper foilCompany nameYamashita Materials CorporationHead quarters3-5-13,Minami Shinagawa,Shinagawa-ku,Tokyo,140-0004,Ja panPresidentHiroki yamashita [TEL] +81-3-3474-0611 [FAX] +81-3-3474-0984 EstablishmentJune 15, 1965 Capital fund2 million yen[Contact for inquiries about this document] yamashita Materials CorporationCircuitec CompanySales Department[TEL] : 046-251-3722[FAX] : 046-251-3725 [HP] : [E-mail].


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