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半導体製造装置の安全 ... - fujisafety.jp

( ) SEMI-S2 ISO/IEC/NFPA/JIS 2017/11/24 1. : (EHS) *EHS: Environment Health Safety 2017/12/182. : : EHS 4. : SEMI/ANSI/CEN CENELEC/NFPA/ACGIH (IC/ISO) 5. : EU (CE Marking) * Info.:TUV Rh. 2017/11/24) No.(JIS) / ) LVD/EMCD/RED/RoHS (ISO/IEC) *As of 2017/11(ISO/IEC)(RA)( URL on Web)6.

【「半導体製造装置の安全ガイドライン」と法規制(法令)・安全規格との俯瞰表】 semi-s2 ※iso/iec/nfpa/jisの最新規格動向(2017 ...

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Transcription of 半導体製造装置の安全 ... - fujisafety.jp

1 ( ) SEMI-S2 ISO/IEC/NFPA/JIS 2017/11/24 1. : (EHS) *EHS: Environment Health Safety 2017/12/182. : : EHS 4. : SEMI/ANSI/CEN CENELEC/NFPA/ACGIH (IC/ISO) 5. : EU (CE Marking) * Info.:TUV Rh. 2017/11/24) No.(JIS) / ) LVD/EMCD/RED/RoHS (ISO/IEC) *As of 2017/11(ISO/IEC)(RA)( URL on Web)6.

2 ( ) (Risk Analysis) JIS B 9960-1:2008 * :2018 (2004/42/EC) IEC 60204-1 ISO/TR 14121-2 - - JIS B 9700:2013 (2014/35/EU) ISO 12100:2010 ( ) EMC (2014/30/EU) (RA)8. JIS B 8433-1:2015 IEC 61000-6-4 ANSI ( ) ( ) RoHS (2014/65/EU) R- PSE (J**) IEC 61000-6-2 SEMI9.

3 ( ) ( ) NFPA79:2015 CENELEC Guide 32:2014 ISO 22100 SeriesISO/TR 22100-4 ISO/TR 14121-2:2012 ( ElectricalGuidance and consideration of related security JIS B 9705-1:2011 Standard for Industrial*NWIP SEMI-S1 Machinery( *NWIP: ISO ( ) SEMI S1 2018 ISO/TR 22100-1:2015 ISO/CD 20607 ISO/TR 22100-2:2013 Instructions for JIS B 9710:2006 * NFPA70:2017 ISO/TR 22100-3:2016 ( ) NationalISO/TR 22100-4 ( )12.))

4 Electric CodeMachine Directive ISO 12100:2010*CD2 / ( ) (EMO) 2020 First draft Stage (2004/42/EC) Safety of machinery -- General principles for design -- Risk assessment and risk reduction (240VA EMO EMO JIS B 9960-33:2012 12100:2010 ( )13. ISO 14120:2015 ( (SEMI S9)ISO 13853:1998 (AIC) ( )ISO 13854: 2017 ) ( ) JIS B 6802:2014 ISO 13855: 2010 PL ) ISO 13857: 2008 ISO/DIS 13857 *IS:2018 ( ) ISO 14119:2013 (IP: ) (UPS) ISO 14120:201514.

5 ISO 13849-1:2015 ISO 13849-1 WD Safety of machinery -- Safety-related parts of control systems -- Part 1: General principles for design 13849-1:2015 ISO 13849-2:2012 ISO/DIS 13851 CD DIS => (2016 12 ISO 13850:2015 ISO 13851:2002 ( ) ISO 14118:2017 ISO/FDIS 14119 (2017/12/8)15. ISO 13856-1/-2/-3:2013 ISO 19353:2015 DAMD1:2017-03 (Fail-Safe) ISO 14122-1:2016 IEC60204-1 - 16.)

6 ISO 14122-2:2016 ISO 14122-3:2016 ISO 14122-4:2016 17. ISO 14122-5:xxxx ISO 14122-5: Safety of machinery- Permanent means of access to machinery ISO 21260 xxxx WG IEC 62061:2015 * ISO 17305 18. ISO TR 22053:xxxx NP *IEC 61010-1 ISO 4413:2010 ( ) ISO 4414:2010 ( ) ISO 3864:1984 ISO 3864-1:2011 EU ( I) Machine Directive( AnnexI) ( ) ) ISO 3864-2:2016 ( ) ( ) ISO 3864-3:201219.

7 ISO 3864-4:2011 (HPM) ( CE EMC 201711/24 Low Voltage Directive IEC 60204-1:2016 * JIS B 9705-1:xxxx * (TC199) (2014/35/EU)Safety of machinery - Electrical equipment of machines - Part 1: General requirements ( ) ( ) (UTV) JIS B 9705-2:xxxx *JISC 60204-1 Ed. :2016 RLV (Redline version) EMC (ANSI/RIA ) (UTV) JIS B 9710:xxxx * (JTC199)IEC 60204-31:2013 (ISO 10218, EN 775) UTV ( ) JIS B 9960-1:xxxx * (TC44/SWG60204-1)IEC 60204-32:200821.)

8 JIS B 9960-34:xxxx * (TC44/PT60204-34)IEC 60204-33:2009*Semiconductor IEC/WD 60204-33(2017 6 WG ) JIS B xxxx(IEC 62745) *JIS - (2017/12 )IEC/TS 60204-34:2016 ( ) IEC 62061:2012 * CD1 CD2 2018 ( ( ) DTR63161 2017-10 DTR * 22. IEC 61496-1:2012 COR1:2015 IEC 61496-1 (2017 1 ) ( ) ( ) JIS B 9960-1:2008 IEC 61496-2:2013 ( ) ( )4 IEC 61496-3:2008 IEC/CDV 62496-3 IEC/TR 61496-4:200723.)

9 6 IEC/TS 61496-4-2:2014 7 IEC/TS 61496-4-3:2015 / / IEC 62745:2017 (RoHS) 6 ( , , , ,PBB,PBDE AC1000V )9 IEC 61310-1:2007 (IEC 82079-1)24. 10 IEC 61310-2:2007 ( ) ) ( )11 IEC 61310-3:2007 ( ) ( )12 IEC 62998:xxxx 2017-08: 2CD /2018-10 IS 13 IEC 63074:xxxx NP , 2017-07: CD DIS:2017 OS:201925.

10 14 IEC/TS 62046:2008 FDIS failed -2015-11 CDV FDIS ( ) ) 15 IEC 60825-1:2014 ) 16 Safety of laser products. Equipment classification and requirements 18 60825-1 Ed. :201426. ) JIS B 9700:2013 ISO 10218:2011 *Class2 - ) Robots and robotic devices -- Safety requirements for industrial robots -- Part 1: Robots / / 10218-2:201127.


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