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Fundamentals of AEC-Q100: What “Automotive Qualified” …

Fundamentals of AEC-Q100: What Automotive Qualified Really MeansRichard Oshiro, Director, QMS-Automotive November 2018 MPS Automotive Background201120122013201420152016201720 1820192020 AECP articipationFirst Q100 part , MPQ2451$120M+World s Most Compact LED Driver Module, MPM6010 First Q100 Flip-Chip part , MPQ4470 Flip-ChipPackaging QualifiedFirst Functional Safety PMIC, MPQ790177 GHzRadar for ADAS80 AEC Orderables240+ AEC Products200M Units ShippedAutomotive Hits $12M Annual RevenueAutomotive Spiked Out in Company Earnings, $53 MRichard Oshiro Director, QMS, Automotive Nearly 20 years experience in Automotive Quality Currently responsible for MPS Automotive Quality as well as our Quality Management System. Representative for MPS on Automotive Electronics Council 11+ years as Director of Quality at Cypress Semiconductor with first task getting 2 internal fabsand 1 assembly test facility ISO/TS16949 certified 5 years as Director of Quality at a based assembly subconwhere we assembled a Ford microelectronics componentAgendaThe Who/What/Why s of AECThe Many AEC-QxxxStandardsAEC-Q100: Temperature GradesAEC-Q100: Key Reliabi

Acceptable Failure Rates 300 parts per million Zero Supply Lifetime 2-3 years 15-20 years. Why AEC-Q100 Qualification is Needed Automotive companies sell millions of very expensive vehicles –to some people this means they think they can ... Ariel Potter Created Date:

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Transcription of Fundamentals of AEC-Q100: What “Automotive Qualified” …

1 Fundamentals of AEC-Q100: What Automotive Qualified Really MeansRichard Oshiro, Director, QMS-Automotive November 2018 MPS Automotive Background201120122013201420152016201720 1820192020 AECP articipationFirst Q100 part , MPQ2451$120M+World s Most Compact LED Driver Module, MPM6010 First Q100 Flip-Chip part , MPQ4470 Flip-ChipPackaging QualifiedFirst Functional Safety PMIC, MPQ790177 GHzRadar for ADAS80 AEC Orderables240+ AEC Products200M Units ShippedAutomotive Hits $12M Annual RevenueAutomotive Spiked Out in Company Earnings, $53 MRichard Oshiro Director, QMS, Automotive Nearly 20 years experience in Automotive Quality Currently responsible for MPS Automotive Quality as well as our Quality Management System. Representative for MPS on Automotive Electronics Council 11+ years as Director of Quality at Cypress Semiconductor with first task getting 2 internal fabsand 1 assembly test facility ISO/TS16949 certified 5 years as Director of Quality at a based assembly subconwhere we assembled a Ford microelectronics componentAgendaThe Who/What/Why s of AECThe Many AEC-QxxxStandardsAEC-Q100: Temperature GradesAEC-Q100: Key Reliability TestsSpotlight on HTOL, ELFR, PTC, TC, HASTB eyond AEC: STRM, Road Test, EVB BIMPS Consumer / Industrial / Automotive Grades ComparedBackground: Automotive EcosystemPCN guidelinesWho is AEC?

2 Automotive Tier-1 SuppliersSemiconductor SuppliersAutomotive vs. ConsumerConsumerAutomotiveAmbient Temperature Range0 to85 C-40 Cto 150 CExpected Operating Life2-3 years10 years+AcceptableFailure Rates300 parts per millionZeroSupply Lifetime2-3 years15-20 yearsWhy AEC-Q100 Qualification is NeededAutomotive companies sell millions of very expensive vehicles to some people this means they think they can sue them for a lot of moneyAutomotive buyers have increased their quality requirements, partly due to automotive company s own advertisementsSingle 1 ppm per part defect rate1000 parts per ECU(IC, res, cap, etc)1 Million cars sold 1000 defective carsExampleReliability Bathtub Curve TimeFailure RateEarly Infant Mortality FailuresConstant / Random FailuresWear-Out FailuresThe Bathtub Covered with Safe Launch ProtocolsCovered with AEC-Q100 QualificationThe Many AEC-Q StandardsAEC-Q102 AEC-Q101 AEC-Q200 AEC-Q100 AEC -Q100-007 -Rev-B: Fault Simulation and Test GradingAEC -Q100-008 -Rev-A: Early Life Failure Rate (ELFR)AEC -Q100-009 -Rev-B: Electrical Distribution AssessmentAEC -Q100-010 -Rev-A: Solder Ball Shear TestAEC -Q100-011 -Rev-C1: Charged Device Model (CDM) Electrostatic Discharge Test AEC -Q100-001 -Rev-C: Wire Bond Shear TestAEC -Q100-002 -Rev-E: Human Body Model (HBM) Electrostatic Discharge TestAEC -Q100-004 -Rev-D.

3 IC Latch-Up TestAEC -Q100-005 -Rev-D1: Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life TestAEC -Q100-012 -Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12 VSystemsAEC-Q104 (New)Additional StandardsAEC -Q101 Rev -D1: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors (base document)AEC -Q101-001 -Rev-A: Human Body Model (HBM) Electrostatic Discharge TestAEC -Q101-003 -Rev-A: Wire Bond Shear TestAEC -Q101-004 -Rev-: Miscellaneous Test MethodsAEC -Q101-005 -Rev-: Charged Device Model (CDM) Electrostatic Discharge TestAEC -Q101-006 -Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12 VSystemsAEC -Q200 Rev -D base: Stress Test Qualification For Passive Components (base document)AEC -Q200-001 -Rev-B: Flame RetardanceTestAEC -Q200-002 -Rev-B: Human Body Model (HBM) Electrostatic Discharge TestAEC -Q200-003 -Rev-B: Beam Load (Break Strength) TestAEC -Q200-004 -Rev-A: Measurement Procedures for Resettable Fuses.

4 AEC-Q100 Key Figures & GradesNumber of unique lots testedSample size per lotAccelerated tests durationMinimum CPK for distribution related parametersNumber of fails Temperature RangeGrade 3-40 to85 CGrade 2-40 to 105 CGrade 1-40 to 125 CGrade 0-40 to 150 CAEC-Q100 Key Test CategoriesAccelerated Environment StressAccelerate Lifetime SimulationPackaging/AssemblyDie FabricationElectrical VerificationDefect ScreeningCavity Package IntegrityAEC-Q100: Key Reliability Tests Preconditioning Temperature-Humidity-Bias (THB) / Biased Highly Accelerated Stress Test (HAST) Autoclave (AC) / Unbiased (HAST) Temperature Cycling (TC) Powered Temperature Cycling (PTC) High Temperature Storage Life (HTSL)Accelerated Environment Stress Tests High Temperature Operating Life (HTOL) Early Life Failure Rate (ELFR) NVM Endurance, Data Retention, and Operational Life (EDR)Accelerate Lifetime Simulation Tests Wire Bond Shear (WBS) Wire Bond Pull (WPL) Solderability (SD) Physical Dimensions (PD) Solder Ball Shear (SBS) Lead Integrity (LI)Packaging/Assembly Electromigration(EM) Time Dependent Dielectric Breakdown (TDDB) Hot Carrier Injection (HCI) Negative Bias Temperature Instability (NBTI) Stress Migration (SM)

5 Die Fabrication Pre-and Post-Stress Function Parameter ESD HBM/CDM Latch-Up Electrical Distributions Fault Grading Characterization Electromagnetic Compatibility (EMC) Short Circuit (SC) Soft Error Rate (SER) Lead (Pb) FreeElectrical Verification part Average Testing Statistical Bin/Yield AnalysisDefect ScreeningPackage IntegrityHTOLvs. ELFR EVB basedPTC EVBTC Pre-conditioning firstHAST ACProcess/Design Change Impact on AEC-Q100 Highly Recommended FAQ About AEC-Q100 Qual Do all qualification tests have to be performed for every new device? How long is qualification data valid?End Product: QualReport in PPAP 80 application evaluation boards 1000 hours 125 C ambient temperature 150 C junction temperature Fully operational (switching)Beyond Q100: EVBBurn-InBeyond Q100: Road Test & EMC 300-point application road test Grade 1: 25 C, -55 C, 150 C for margin Tests include stability/margin, ripple, fault response, load dump, cold crank CISPR25 radiated & conducted emissions testingMPS EMI Lab Hangzhou, ChinaBeyond Q100.

6 Short Term Reliability MonitoringShort Term Reliability Monitoring CriteriaLot AcceptedFinal Test48h Autoclave96-Cycle Temperature Cycling (-65 to 150 C)Preconditioning (3x Reflow)MPS Product GradesConsumerIndustrialAutomotiveProduc t QualQualification StandardJEDECJEDECAEC-Q100 Tri-Temp Application Road TestSupply ChainDedicated Fab / AssemblySpecialized Tools / PersonnelProcessEnhanced Process Controls*Ultra-Enhanced Process Controls*ProductionTest Lot Size RestrictionATE Test at Room TempATE Test at Hot TempSTRM & QA Sample TestPPAP*(SPC, Particle, PCM) & SBL/SYLT hank You Q&AAdditional resources: more information, out our AEC-Q100 Power Management Solutions at


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