Future of MEMS: a Market & Technologies …

1 1. Future of mems : a Market & Technologies Perspective Dr. Eric MOUNIER. October 2014. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. Content mems Markets mems Challenges Future Perspectives Conclusions Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 3. Markets Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 4. 2012-2019 mems Markets (US$M). $30 000 Others 16,1%. Oscillators 52,7%. RF mems . 15,5%. $25 000 Microdispensers 16,3%. (microfluidics). Microfluidics for IVD. 23,1%. Microfluidics for research 34,8%. $20 000. Other optical mems . 10,0%. Projection systems 17,7%. Micro displays 57,8%. $15 000. PIR & thermopiles 23,5%. Microbolometers 12,5%. Inertial combos 28,4%. $10 000. Digital compass -5,1%. Gyroscopes -3,7%. Accelerometers -3,4%. $5 000. Microphones 13,2%. Pressure sensors 7,7%. InkJet heads $0 1,1%. 2012 2013 2014 2015 2016 2017 2018 2019.

2 TOTAL $10 662M $11 723M $13 017M $14 450M $16 249M $18 192M $20 818M $24 014M. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 2012-2019 mems Markets by Application (US$M) 5. $30 000M. $25 000M. $20 000M. $M. $15 000M. $10 000M. $5 000M. 2013-19 CAGR. $0M. 2012 2013 2014 2015 2016 2017 2018 2019. Telecom $190M $212M $241M $266M $297M $336M $379M $373M 9,9%. Medical $1 662M $2 004M $2 452M $3 000M $3 697M $4 600M $5 859M $7 250M 23,9%. Industrial $951M $1 037M $1 132M $1 293M $1 468M $1 667M $1 897M $2 192M 13,3%. Defense $261M $267M $278M $296M $316M $332M $353M $376M 5,9%. Consumer $4 892M $5 449M $5 930M $6 447M $7 115M $7 719M $8 702M $10 032M 11,2%. Automotive $2 599M $2 639M $2 862M $3 015M $3 213M $3 388M $3 474M $3 634M 5,5%. Aeronautics $107M $115M $124M $133M $142M $151M $154M $156M 5,2%. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 6.

3 Increasing Functionalities for Mobile Phones & Wearable Electronics Proliferation of functions using inertial sensors Market introduction Market acceptance Context awareness With additional sensors and sensor fusion Indoor navigation Activity monitoring Barometer In-air signature & authentication With Pointing gyroscopes High resolution camera stabilization Menu navigation & advanced user interface 3D gaming Location-based service With compass Map navigation & GPS assistance Pedometer With Gaming accelerometers Portrait/Landscape switching, Tap/double tap and shake control 2008 2010 2012 2014 2016 2018. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 7. Emerging mems Value Proposition in Mobile Devices beside Inertials High volume Small production Better communication performance Sound quality Sampling /. R&D. WiSpry antenna tuner on cell Sand 9 mems Oscillator phone board DelfMEMS switch Audio Pixels micro speaker Knowles microphones Lemoptix Scanning mirror Sensirion humidity sensor Improved Navigation &.

4 Visual environment experience sensing poLight mems . Freescale pressure sensor autofocus Mirasol display STMicroelectronics 9-axis Lilliputian Systems Nectar fuel cell Increased battery lifetime New tactile interface TI temperature sensor versus a NextInput SoftTouch interface competing thermopile sensor M Optics thermal imager Infrared sensing Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 8. Key mems Players Better communication performance Sound quality Wispry antenna tuner on cell Sand 9 mems Oscillator phone board DelfMEMS switch AudioPixel microspeaker Knowles microphones Scanning mirror from Lemoptix Sensirion Humidity Sensor Improved Navigation &. visual environment experience sensing Polight mems . Freescale autofocus pressure sensor Mirasol display STM 9-axis Nectar fuel cell Increased battery lifetime New tactile interface TI temperature sensor versus a NextInput SoftTouch interface competing thermopile sensor Thermal imager MuOptics Infrared sensing Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014.

5 9. Challenges Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 10. Consumer mems challenges Closer integration with processing New mems design Better performance Above IC. Software Sensor fusion SIZE REDUCTION. MORE. 3D integration INTELLIGENCE. Stronger RF specifications New wafer bonding Data discrimination Mobility Connectivity everywhere High volume production E-Health LBS Shared fab infrastructure Social networking PRICE PRESSURE. NEW Fabless model APPLICATIONS. Internet of Things mems across multiple markets Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 11. Evolution 2009-2013: Maintaining growth is a challenge for consumer applications Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 12. mems are NOT IC! Bell labs, US, 1947! Intel 22 nm technology Sandia's micromachine ( mems ). 1. No standard process (CMOS, BiCMOS ). 2. No p-n junction for mems .

6 And NO roadmap so what ? Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 13. Accelerometer mems size evolution AUTO $ mems Size (mm ). All are 3-axis accelerometers $ US$ values are Production Cost CONSUMER. ST. 12 LIS3L02AE. >$ BOSCH 5 ST SMI540. LIS331 DLH. VTI. 4 CMA3000. ST LIS302DL. BOSCH. 3 BMA180. ST. LSM330 ST. Kionix KXTE9. LSM303D. ST LIS3DH BOSCH. 2 ADI BMA250 / ADI. ADXL346 BMC050 ADXL362 MCube BI3L. 1 BOSCH. BMA355. 2007 2008 2009 2010 2011 2012 2013 2014. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. Evolution of STMicroelectronics mems Gyros Significant size reduction has been achieved with a smaller sensing area. GK10A 2009 GK12B 2010 GK14A 2011 GK18A 2012. (L3G4200D, LSM330DL) (LSM330 DLC) (L3G3250A, LSM330D) (L3GD20H). Die ref. Package size (mm3) mems die size Sensing area GK10A for 6-axis ( x ) (~40% of die area). GK12B for 6-axis ( x ) (~41% of die area).

7 GK14A for 6-axis ( x ) (~39% of die area). GK18A for 3-axis ( x ) (~43% of die area). Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. New approaches to overcome size/cost challenges SIZE + COST REDUCTION. Maximum optimization Breakthrough Design: Manufacturing processes New detection principles moving from 3 improvements dies to one die TSV via last (STM) BAW resonant sensor (Qualt ). TSV via first (STM) M&NEMS (Tronic's). Single 3A gyro design TSV in ASIC (Bosch). (STM, Invensense) NEMS gas chromatography (APIX). 3D mems with TSV (mCube) Suspended Microchannel Resonator (Affinity Biosensors). Single 3A accelero + 3A Eutectic Au-Si bonding (Maxim). gyro structure (STM, Quartz Crystal Microbalance (Q-Sense). Eutectic Al-Ge bonding (Bosch, Invensense) Invensense). CMOS- mems (Invensense). TSV platform (Teledyne Dalsa). 16. TSV are coming - Different TSV architectures (STM, mCube, Bosch).

8 2012 2013 2014. Copper TSV in ASIC. Trench TSV. Tungsten TSV connecting mems to IC. metal layers. STMicro mems accelerometer chip with TSV mCube mems accelerometer chip with TSV (Courtesy Bosch mems accelerometer chip with TSV (Courtesy (Courtesy of System Plus Consulting) of System Plus Consulting) of System Plus Consulting). Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. PiezoMEMS. 18. mems take time! Cost RF mems R&D Product evolution reduction Commercialization Product Cost Microphones R&D evolution reduction Commercialization Cost Average R&D time: 10 years Gas sensors R&D Product evolution reduction Commercialization Average product evolution: 8 years Product Average cost evolution: 10 years Gyros R&D evolution Cost reduction Commercialization From R&D to commercialization: 27 years! Product Cost Micro valves R&D evolution reduction Commercialization Product Bio mems R&D evolution Cost reduction Commercialization Product Cost DLP for pico projection R&D Commercialization evolution reduction Product Micro relays R&D Cost reduction Commercialization evolution Product Accelerometers R&D evolution Cost reduction Commercialization Product IJ Heads R&D evolution Cost reduction Commercialization Oscillators R&D Product evolution Cost reduction Commercialization Pressure sensors Product R&D evolution Cost reduction Commercialization 1950 1960 1970 1980 1990 2000 2010.

9 Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. 19. What's next? Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014. Sensors & Applications for IoT. Legend: Sensor Level of demand SENSORS OF. THE. INTERNET THINGS. OF. Building Automation Healthcare & Life science Consumer & Home automation Transportation Light (IR, visible) Contact Pressure Bio Sensors Gyroscope Temperature Gyroscope Pressure Temperature Temperature Inertial Accelero Chemical Accelero Temperature Chemical (CO2) Chemical Magneto Magneto Accelero Light (IR, X-Ray) Pressure Chemical Industrial Environment Security & Public Safety Retail & Logistics Pressure Hall Effect Chemical Humidity Gyro Light (IR,XRay,THz) Light (IR/Optical) Magneto Light (IR,Optical) Accelero Temperature Accelero Pressure Chemical Light (IR, visible) Magneto Temperature Temperature Pressure Chemical Chemical Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014.

10 IoT, the next wave? Market Value Repartition in IoT Structure ($M). 450,000. 400,000. 350,000. Hardware (incl. Sensors) will top at $70B in 2018. $400B. Market value ($M). 300,000. then will lower because of price pressure! Cloud 250,000. 200,000. 150,000. 100,000. 50,000. 0. 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 CAGR. Hardware 9,458 17,895 34,426 58,295 69,995 67,200 54,555 54,785 47,005 43,172 46,338 17%. Cloud 431 970 2,113 4,097 5,867 10,060 14,895 26,984 36,003 46,931 58,851 63%. Data 2,156 4,848 10,631 21,004 31,338 56,914 82,743 144,400 187,763 240,330 296,149 64%. Total 12,045 23,713 47,170 83,396 107,200 134,174 152,193 226,169 270,770 330,433 401,337 42%. In 2024, total Market value from IoT should reach $400B with a global CAGR rate of 42%. Market value from data processing could be almost x3 bigger than cloud and hardware values combined. Yole D veloppement Copyrights 2014 - mems Tech Seminar 2014.