Transcription of Gap Pad 1500R - bergquistcompany.com
1 All statements, technical information and recommendations herein are based on tests we believe to be reliable, andTHE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIEDWARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers and manufacturers only obligation shall be toreplace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the productfor its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NORMANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE ORTHE INABILITY TO USE A PRODUCT.
2 No statement, purchase order or recommendations by seller or purchaser notcontained herein shall have any force or effect unless in an agreement signed by the officers of the seller and Pad 1500 RThermally Conductive, Reinforced Gap Filling Bergquist Company -North American Headquarters18930 West 78th StreetChanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-0430 The Bergquist Company - European HeadquartersNetherlandsPhone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company - Asia HeadquartersHong KongPhone: 852-2690-9296 Fax: 852-2690-2344 Features and Benefits Thermal conductivity: W/m-K Fiberglass reinforced for puncture, shearand tear resistance Easy release construction Electrically isolatingGap Pad 1500R has the same highlyconformable, low-modulus polymer as thestandard Gap Pad fiberglassreinforcement allows for easy material handlingand enhances puncture, shear and natural tack on both sides ofthe material allows for good compliance tomatingsurfaces of components, furtherreducing thermal : Resultant thickness is defined as the final gapthickness of the 20 18 16 14 12 10 Thickness vs.
3 Thermal Resistance Gap Pad 1500R Thermal Resistance (C-in2/W) Resultant Thickness (mils) Typical Applications Include: Telecommunications Computer and peripherals Power conversion RDRAM memory modules / chip scale packages Areas where heat needs to be transferred to a frame chassis or other type of heat spreaderConfigurations Available: Sheet form, die-cut parts, and roll form (converted or unconverted)Building a Part NumberStandard OptionsSection ASection BSection CSection DSection ENA = Selected standard option. If not selecting a standardoption, insert company name, drawing number, andrevision = Gap Pad 1500R Rev. ANote: To build a part number, visit our website at thicknesses available.
4 ", ", "02 = Natural tack, both sides0816 = Standard sheet size 8" x 16", or00 = custom configuration TYPICAL PROPERTIES OF GAP PAD 1500 RPROPERTYIMPERIAL VALUEMETRIC VALUETEST METHODC olorBlackBlackVisualReinforcement CarrierFiberglassFiberglass Thickness (inch) / (mm) to to D374 Inherent Surface Tack (1 side)22 Density (Bulk Rubber) (g/cc) D792 Heat Capacity (J/g-K) E1269 Hardness (Bulk Rubber) (Shore 00) (1)4040 ASTM D2240 Young's Modulus (psi) / (kPa) (2)45310 ASTM D575 Continuous Use Temp ( F) / ( C)-76 to 392-60 to 200 ELECTRICALD ielectric Breakdown Voltage (Vac)>6000>6000 ASTM D149 Dielectric Constant (1000 Hz) D150 Volume Resistivity (Ohm-meter)10111011 ASTM D257 Flame RatingV- OV- 94 THERMALT hermal Conductivity (W/m-K) D5470 THERMAL PERFORMANCE vs.
5 STRAIND eflection (% strain)102030 Thermal Impedance ( C-in2/W) " (3) ) Thirty second delay value Shore 00 hardness scale. 2)Young s Modulus, calculated using in/min. step rate of strainwith a sample size of inch2. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-mal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
