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Grade Selection Guide - alteklatex.ae

Polychloroprene Rubber ( 11ed .)Version 14 SHOWA DENKO CHLOROPRENETM - Grade Selection Guide -Showa Denko Chloroprene is one of synthetic elastomer which is manufactured mainly of chloroprene Denko Chloroprene possesses exceptional resistance to weather, sun, ozone, andabrasion and is good in resilience, gas impermeability, and resistance to heat, oil, andflame, as well as fairly good in low temperature and electrical versatility makes Showa Denko Chloroprene useful in many applications such as wireand cable, hose, belts, molded and extruded goods, dipped goods and Modified type type type Raw polymerStabilityWorse than W/T typesVery StableVery StableMilling Effect Effective (specialpeptizer can be used)SmallSmallTackiness StickyLess stickyLess stickyMill Shrinkage Very small when milling Larger than G typeLess shrinkageExtrudability Very smooth surface Good collapseresistanceVery smooth surfacewith better RateCurable without anyacceleratorsVariable depending onacceleratorsVariable depending onacceleratorsTensileStrengthBetter than W/T types athigher rubber contentBetter than G typewhen highly loadedBetter than G typewhen highly loadedTear StrengthBetter than W/T types--Resilience Larger than W/T types--Elongation Better than W/T types--Compressio

Polychloroprene Rubber (’11ed.) Version 14 SHOWA DENKO CHLOROPRENETM - Grade Selection Guide - Showa Denko Chloroprene is one of synthetic elastomer which is manufactured via.

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Transcription of Grade Selection Guide - alteklatex.ae

1 Polychloroprene Rubber ( 11ed .)Version 14 SHOWA DENKO CHLOROPRENETM - Grade Selection Guide -Showa Denko Chloroprene is one of synthetic elastomer which is manufactured mainly of chloroprene Denko Chloroprene possesses exceptional resistance to weather, sun, ozone, andabrasion and is good in resilience, gas impermeability, and resistance to heat, oil, andflame, as well as fairly good in low temperature and electrical versatility makes Showa Denko Chloroprene useful in many applications such as wireand cable, hose, belts, molded and extruded goods, dipped goods and Modified type type type Raw polymerStabilityWorse than W/T typesVery StableVery StableMilling Effect Effective (specialpeptizer can be used)SmallSmallTackiness StickyLess stickyLess stickyMill Shrinkage Very small when milling Larger than G typeLess shrinkageExtrudability Very smooth surface Good collapseresistanceVery smooth surfacewith better RateCurable without anyacceleratorsVariable depending onacceleratorsVariable depending onacceleratorsTensileStrengthBetter than W/T types athigher rubber contentBetter than G typewhen highly loadedBetter than G typewhen highly loadedTear StrengthBetter than W/T types--Resilience Larger than W/T types--Elongation Better than W/T types--CompressionSetresistance-Better than G type atelevated temperatureBetter than G type atelevated temperatureHeatResistance-Better than G type Better than G typeFlexResistanceBetter than W/T types--Texture Similar to NR--AdhesionBetter adhesion to NR orSBR than W/T typesGoodGoodOthersHot tear

2 Compoundviscosity. Belting,Sponge(foam).Heat purpose shrinkage withcollapse goods,calendered ApplicationCHARACTERISTICS OF G / W / T TYPESNon-Sulfur ModifiedProcessabilityPhysical PropertiesLittle difference of weather, ozone and flame resistance among G,W and Ttypes /8 DRY GRADES1-1 GENERAL PURPOSE Mooney ViscosityCrystallizationGrade[ML 1+4 100 C RateG Types (Sulfur-modified Group) GS40 54 Slightl Slow Non-staining, sulfur modified basic G type with best tearstrength and flex resistance GRT40 54 Slow Good low temperature properties G type with best tack forfrictioning application SND1632 39 Slow Lower viscosity version of GRT GW34 52 Slow Sulfur modified G type with better heat and compression setresistance than GS and GRTW Types (Basic Group) W42 51 MediumStandard Grade for general purpose WM134 41 Medium Lower viscosity version of W WHV109 130 Medium Higher viscosity version of W for high loading application andgeneral adhesives WHV10095 105 Medium Lower viscosity version of WHVW Types (Crystallization Resistant Group) WXJ42 51 Very Slow Good low tempetature properties for general use SND567 76 Very Slow Higher viscosity version of WXJ SND832 37 Very Slow Lower viscosity version of WXJ WRT42 51 Extremely slow Excellent low temperature propertiesW Types (Extrusion & Calendering)]

3 WB42 51 Medium Best extrusion and calendering properties WXK73 89 Very Slow Good low temperature properties with better extrudability WXKT106 117 Very Slow Higher viscosity version of WX-K for high loading use SND3773 89 Very Slow Better extrusion version of WX-K with improved mold releaseW Types (Low Mold Fouling Group) WK42 51 MediumBetter mold release version of W with good mill-and flow-ability WXJK42 51 Very Slow Improved mold release version of WXJ with good mill-ability SND3563 73 Extremely slow More excellent low temperature properties of WRT withimproved mold release for injection molding goods SND4378 88 Extremely slow Higher viscosity version of SND-35 with less shrinkage SND4560 73 Extremely slow More excellent low temp. and improved brittleness of WRT with improved mold release for injectionT Types (Specific Group for Extrusion, Calendering) TW42 51 Medium Superior extrusion and calendering Grade with good tensileproperties TW10085 102 Medium Higher viscosity version of TW for high loading use SND2242 51 Very slow Good low temperature properties with better extrudability SND4885 100 Very slow Higher viscosity version of SND-22 with better calender-abilityand extrusion-ability having colapse resistance.

4 TRT42 51 Extremely slow Excellent low temperature properties with better processability Other Characteristics 2/8 WHV140 WHVWXKTWHV100TW100 ADSND48AC SND43 WXK SND37 SND5 SND35 SND45 GWWTWWBGRTWXJSND22 WRTTRTWKGSWXJKWM1 SND16 SND8 Crystallization RateFastSlowPLOT OF DRY GRADES PER CRYSTALLIZATION RATE AND MOONEY VISCOSITY30150 Mooney Viscosity, 1+4' @100 C100500 AFAG 3/8 Better Heat Resistance Better Dynamic PropertiesCrystallization ResistanceLower MVNon-Sulfur Modification ImprovedLower MVBrittleness Less Mold FoulingHigher MVHigher MVHigher MVBetter Flexibility Better Heat ResistanceHigher MVLower MVLower MVLess Mold Fouling Less Mold Fouling Less Mold Fouling Better Extrudability and CalenderabilityImproved Processability Higher MV Lower Die SwellHigher MVLower Die Swell Less Mold FoulingHigher MV Better Processability and Physical Properties Higher MV Better Collapse ResistanceHigher CrystallizationResistanceWRTH igher CrystallizationResistanceTRTSND37 WXKTWXKH igher CrystallizationResistance Better Compression SetWSND8 SND16 WHV100 WHVDry GradesForWell-BalancedPropertiesGSSELECT ION Guide OF DRY GRADESGWSND48TW100WM1

5 WBWXJKTWSND22 WKSulfur ModificationSND43 SND45 SND35 SND5 WXJH igher CrystallizationResistanceGRT4/8 ADHESIVE / LIQUID DISPERSION GRADES1- 2 ADHESIVE APPLICATIONC rystallizationRateW Types WMediumChipMost common Grade WM1 MediumChipLower viscosity version of W. WHVM ediumSlice WHV100 MediumChipLower viscosity version of WHV. WHV140 MediumSliceFor high viscosity adhesive WXJVery slowChipSoft film and high tack at low temperature. WRTE xtremely slowChipExtremely soft film and high tack at low Types ACVery fastChip ADVery fastSlice AFSlowChip AGMedium-SlowSliceNote: 1) Brookfield viscosity of 5% raw polymer solution in toluene at 25 C, [mPas] 2) Brookfield viscosity of 10% raw polymer solution in toluene/hexane(60/40 vol/vol) at 25 C, [mPas]1- 3 LIQUID DISPERSIONSGel Content Homo/Copolym400 Anionic49 MediumCopolymer Extremely fast Ozone,Weatherability750 Anionic50 MediumCopolymer Extremely slowFlex resistance650 Anionic60 MediumCopolymer Extremely slowHigh solid version of LD750842A Anionic50 HighHomopolymerVery slowHigh cure rate671 AAnionic59 Med-HighHomopolymer Medium-Slow High wet gel strength572 Anionic50 HighHomopolymerFastQuick Grab strength571 Anionic50 HighHomopolymerSlowGeneral Purpose,High cure rate115 Non ,Hot bond strengthSND57 Anionic58 Sol(No gel) Homopolymer Fast-Medium Excellent tackinessSD77 Anionic58 Sol(No gel) HomopolymerVery fastQuick break (2-part)

6 For foam bondingSD77 SAnionic55 Sol(No gel) HomopolymerVery fastQuick break (1-part) for foam bondingSD78 Anionic60 Med-HighCopolymerFast-Medium Wood High Pressure Laminate[ML 1+4 100 C Other Characteristics34 4195 10542 5142 51100 130 *1)Polymer StructureCrystallizationRatePolarityHigh er viscosity version of 43 *1)109 13033 46 *1)80 130 Excellent Sprayability, 115 *2)Excellent hot bond strength. (%)GradeFormMooney Viscosity Adhesives and paints use with good breakdown properties Adhesives and paints use with good solution viscositystabilityOther Characteristics42 51 5/8 Higher Initial Bond GenerationBetter peptizablity(Easy polymer break-down) Fast crystallization to attain good initial bond strength Excellent heat resistance Carboxylated Excellent Rheology Higher tackinessSprayability, LevellingLower viscosity Higher viscosity Higher viscosity Higher viscosity WHV100 Better tackinessExcellent tackinessWHV140 Selection Guide OF ADHESIVE GRADESACADFor High QualityAdhesivePropertiesAdhesive GradesAFAGWWM-1 WRTWHVWXJ 6/8 Crystallization400 572 571 842A115671A 750(650)]

7 SlowFastMuch Sol Little Gel ContentSND57 Map of LD grades per crystallization and gel , 2010SD78 SD77, SX1489SD77,SD77S 7/8 SHOWA DENKO CHLOROPRENE LIQUID DISPERSION PROPERTIES (Typical Values)Grades400750650842A671A572571 SND57SD77SD77 SSD78115 Main FeatureOzone andweatherresistanceFast curingGood wetstrengthFastcrystallizingGeneralpurpo seExcellenttackinessWaterbasedadhesivesf or foamWaterbasedadhesivesfor foamWaterbasedadhesivesfor HighNonionicSolids Content,% Primary Applications-Bondedfibers-Adhesives -Dippedgoods-Treatedpaper-Dippedgoods-Bo ndedfibers-Dippedgoods-Pressuresensitive adhesives-Adhesives -Adhesives -Adhesives -Contactadhesives-Coatings-Dippedgoods-A dhesives -Bondedfibers-Adhesives -Primer-Coating-Adhesives -Non-wovenfabric-Foam-Dippedgoods-Bonded fibers-Mastic -sealant-Coatings-Treatedpaper-Sealant-C arpetbacking-Mastics Physical Characteristics pH 25 C *1) gravity 25 C Brookfield viscosity mPa s 25 C810400 *2)154010103530030030300 *2)(Spindle , 60rpm)Surface tension, dyn/cm,20 C373939384138384138364047 Emulsion Particle size, GelMed-High.

8 GeHigh GelHigh GelSolSolSolMed ResinateResinateResinateResinateResinate ResinateResinateResinateResinatePolyviny l alcoholWet gel propertiesTensile strengthVery highVery high Very highMedium Very highMediumMediumLowVery highVery highVery highHighElongationHighHighHighMedium HighMedium Medium Very highHighHighHighMediumCure rateSlowMedium Medium Cured Film PropertiesModulusVery highLowLowMedium HighHighHighMedium Tensile strengthHighMedium Medium Medium Medium HighHighHighMedium Crystallization rateExtremelyfastExtremelyslowExtremelys lowVery slowMedium -slowVery fastSlowMediumVery fastVery fastFast -MediumSlowNote : *1): pH values decline slowly upon ageing. *2):Spindle polymer, withdifferent solid contentsExcellent flexibility 8/8------------------------------------- -----------------------------------Copyr ight 2011 Showa Denko All Rights more information on Showa Denko Chloroprene, contact us via.

9 Phone or fax: SHOWA DENKO Industrial Chemicals DepartmentChemicals Sector5-1,Okawa-Cho,Kawasaki-ku,kawasaki -shiKanagawa 210-0858,JapanPhone: +81_44_344_0721 Facsimile: +81_44_344_0461 Shoprene Brochure, Version 14 Revised 05/11/2011 CAUTION: Do not use in medical applications involving permanent implantation in thehuman body. For other medical applications, discuss with your Showa Denkocustomer service representative. Showa Denko Chloroprene is a trademark of ShowaDenko information set forth herein is furnished free of charge and is based on technicaldata that Showa Denko believes to be reliable. It is intended for use by personshaving technical skill, at their own discretion and risk. The handling precautioninformation contained herein is given with the understanding that those using it willsatisfy themselves that their particular conditions of use present no health or safetyhazards.

10 Because conditions of product use and disposal are outside our control, wemake no warranties, express or implied, and assume no liability in connection with anyuse of this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as alicense to operate or a recommendation to infringe on any patents.


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