Guidelines for Cleaning of Printed Boards and …

1 IPC-CH-65 BGuidelines for Cleaningof Printed Boards andAssembliesDeveloped by the Cleaning and Alternatives Subcommittee (5-31) of theCleaning and Coating Committee (5-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-CH-65A - September 1999 IPC-CH-65 - December 1990SC-60A - August 1999SA-61A - June 2002AC-62A - January 1996SM-839 - April 1990 Table of Contents1 .. and Emerging Cleaning -RelatedChallenges .. Chapters .. 2: Applicable Documents .. 3: Assembly Cleaning Value andApplicability .. 4: Designing assemblies forCleaning .. 5: Materials Compatibility.

2 6: Process Development andVerification .. 7: Contamination and Its Effectson PWBs .. 8: Assembly Residues/CleaningConsiderations .. 9: Environmental Considerations .. 10: Solvent Cleaning Agents .. 11: Semi-Aqueous Cleaning Agents,Equipment, and Process Optimization .. 12: Aqueous Cleaning Agents,Equipment, and Process Integration .. 13: Cleaning for Rework, Repair,and Restoration Operations .. 32 APPLICABLE Standards .. Standards .. Industry Standards .. Technologies .. Federal Regulations .. Laws .. Standards .. of Defense .. Safety and HealthAdministration (OSHA) .. Protection Agency (EPA) .. of Transportation .. Conference of GovernmentalIndustrial Hygienists (ACGIH).

3 Institute of Occupational Safetyand Health (NIOSH) .. Standards for Testing Materials .. Specification of Materials .. Fire Protection Association (NFPA) .. National Standards Institute(ANSI), American Society for QualityControl (ASQC) .. Considerations .. Standards .. cGMP .. and Definitions .. Cleaning .. Cleaning Steps .. or Washing .. or Rinsing .. Cleaning Agent Recoveryand Recycle .. Agitation Methods .. Cleaning Agent AcronymDefinitions .. Cleaning Process Definitions .. Adsorption .. (Bi-solvent) .. Cleaning .. Cleaning Steps Definitions .. (HCS, HC/S, HC-S) Cleaning .. or Washing .. or Emulsification .. or Rinsing.

4 Or Drying .. Cleaning Agent AcronymDefinitions .. Cleaning ProcessDefinitions .. Adsorption .. 10 July .. Solvent Emulsions in AqueousMedia .. Softening .. Definitions .. Biological Oxygen Demand .. Chemical Oxygen Demand .. Organic Compounds (VOC) .. Hazardous Air Pollutants .. Warming .. Cleaning .. Cleaning Steps Definitions .. Cleaning Agent AcronymDefinitions .. Definitions .. Cleaning .. Cleaning .. Cleaning .. Cleaning .. 123 ASSEMBLY Cleaning VALUE .. Innovation .. Residues and Their Impact onProduct Reliability .. Clean vs. Clean .. Involved with Implementing NoClean Technology .. Drivers .. Materials for No Clean; ProductDesign.

5 Are the Perceived No-Clean CostBenefits and Drivers? .. are the No-Clean Cost Drivers? .. are the Costs of Cleaning ? .. per Cleaned Part .. are the Costs of IgnoringCleanliness? .. Free Soldering .. Changes .. Failure Mechanisms .. Migration .. Risks .. 214 DESIGNING assemblies FOR of assemblies for EffectiveCleaning .. for Cleaning .. Components .. Contaminants .. Gradients .. Agent Design Options .. Cleaning Materials .. Cleaning Materials .. Cleaning Materials .. Equipment Design Options .. An Optimized System .. Rs+RdBalance .. Factors .. 295 MATERIALS Compatibility Considerations .. Process Effectiveness.

6 Considerations .. Compatibility Testing .. and Functionality .. Materials to be Tested forCompatibility .. Methods: Examples .. and Other Testing Standards .. Effects of Lead-Free on PCBA ssembly .. Fabrication .. and Component Finishes .. Materials .. Equipment .. Issues and Compatibility .. Effects of Miniaturization .. of Components .. Compatibility Examples .. Oxide .. Coil Attack .. Masks .. Circuits .. Joint Attack .. Marking/Labels .. 42 IPC-CH-65 BJuly Coating Adhesion .. 426 PROCESS DEVELOPMENT .. 1 Tests .. 2 Tests and Considerations .. 2 Test Vehicles .. 3 Tests and Considerations .. Process Qualification.

7 Documents .. Feasibility Assessment Phase 1 .. Analysis .. Considerations .. Business Assessment .. of Process Plan .. and Process Testing Phase 2 .. Vehicles .. Methods .. Testing Report .. board Assembly EvaluationPhase 3 .. Testing on Applicable HardwarePhase 3 .. Cleaning on Most ChallengingAssemblies Phase 3 .. and Document Process RangePhase 3 .. Compatibility Testing on ActualPWB Hardware Phase 3 .. Inspection .. Analysis .. Performance Testing .. Run .. Program .. of the Quality System .. of Procured Material .. Controls .. Item Inspection .. of Nonconforming Materials .. Action Program .. , Handling, and Packaging.

8 Product Qualification .. Information .. Performance Data .. Monitoring .. Collection and Reporting .. 587 CONTAMINATION AND ITS EFFECTSON .. and Definitions (Items noted withan * are quoted from IPC-T-50) .. *Anode .. *Bridging .. *Conductivity .. *Conductor Spacing .. *Corrosive Flux .. Corrosion .. *Dendritic Growth .. Migration .. Moment .. of Metallization .. Migration .. (EM) .. *Flux Activity .. Residue .. Corrosion .. Content .. *Inorganic Flux .. Cleanliness .. Contamination .. *Leakage Current .. *Metal Migration .. *Non-activated Flux .. *Nonionic Contaminant .. Contamination .. Flux .. *Packaging Density.

9 62 July Matter .. *Stand-Off .. Clean is Clean? .. Discussion of No Clean Terminologyand Flux History .. Residues .. Migration (ECM) .. Corrosion .. Corrosion and Miniaturization .. Corrosion and PCB board Finish .. Corrosion and Circuit BoardCleanliness .. Prone to Sulfide Creep .. Prevention Strategies .. Whiskers and Circuit BoardCleanliness .. Corrosion .. 748 ASSEMBLY .. and Definitions .. Flux .. Rosin Flux .. Contaminant .. Pitch .. Spacing .. Coating .. Flux .. from board Surface to the Bottomside of a Component .. Residue .. Surface Mount Components .. Flux .. Flux .. Density .. Flux.

10 Temperature .. Flux .. Flux .. Ball .. Solder Resist .. Resin .. Soluble Flux .. Cleaning Residues .. Based Fluxes .. Soluble Fluxes .. Activated (more accuratelyORH0 or ORH1) Fluxes .. Solids (No-Clean) Fluxes .. and Miniaturization Influenceson Assembly Residues .. Pastes .. Acid Fluxes .. Solder Pot Additives .. Residues .. Soils .. Place and Ambient StorageConditions .. Packaging as a Source ofContamination .. Solder Stops/Masks/Resists/Tapes .. and Greases .. Considerations .. Inspection Criteria .. Geometries .. Height and its Influence onCleaning .. Fluids .. Issues and Residues .. of Surfaces .. Tension and Capillary Force.