H&S HighTech Corp. - 株式会社 JASP

1 H&S HighTech & & ScienceCompany History1995 Start R&D of ACF & IPDE nter ACF & IPD market1995 Established DSI company name to TELEPHUS20052005 Inauguration of President Jung-HeeKim2007 Specialized in ACFIPD Biz. was acquired by Samsung200720092009 Changed company name to H&S HighTech201120122013 Factory relocation & Expansion20112012M&A ACF Biz. of EXAX Crystal Biz. of KQTM&A ACF Biz. of LG Innotek2013 IPD : Integrated Passive Device 1 / 24 Human & ScienceYantai FactoryElectronics Device divisionSeongnam Office : Sales & AdministrationAddress : 106-2 Imae-Dong,bundang-gu, Name : H&S HighTech : KimEstablishment : Dec,1995 Employees : 150 PersonsMain Products : ACF,Crystal Oscillator, OCRC ompany ProfileAddress : #89 Huanghai Road,Yantai City,Shandong Province, ChinaFactory Area : 3,000 m Clean room : m Headquarter: ACF Division / ED division (R&D,Production,QA)Address.

2 757-2 Gwanpyeong-Dong, Yuseong-Gu,Daejeon, KoreaTotal Area : 4,500 m Office Area : 1,300 m Factory Area : 3,200 m Clean Room : 1,000m (1000 Class)2 / 24 Human & ScienceOrganizationCEOQ ualityAssuranceAdministrationACF / OLB / COG / COF Team2TP / PCB / CMDomesticSalesOverseasSalesProductionAs semblyEquipmentResearch(Sample)Developme ntOCR / 24 Human & Science Human & ScienceCapa. Capa. (P/O ) & & : -5 C~5 C, : -5 C~5 C 6 ( ) : 25 C, 75%RH 3 : 25 C, 75%RH 24 * 30 Telephus ACFACF /ReelFullCapacity(2014)100m/Roll320,000 Roll (32KK m) / Month 7 [ ] 14 [ forwarder]Human & ScienceWhat is the ACF ?

3 Process Human & ScienceLSI or TABG lass or PCBI nsulationConductionAdhesion Conduction Insulation AdhesionHeat, Pressure and TimeSubstrate2 : Glass or PCBS ubstrate1 : FPC or ICACFE lectrode/BumpConductorsManufacturing ProcessACF is a connective material that satisfy 3 functions: ConductiveparticleMixing processResinMixingMixtureCuringAgentResi n&AdditivesCoating ProcessPacking ProcessCoating on SeparatorSlittingSlitting processReelCutting Knife4 / 24 Human & SciencePolymer AgentComposition of ACF -1 BinderParticlesThermoplastic typeThermosetting typeCarbon fiberMetallic powderPolymer (Ni, Au plating)Insulation Additives.

4 Inorganic filler, Antioxidant, Particle, Size = 3~30 (Au/Ni plated polymer beads or Ni particle)Matrix adhesive system(Thermoset & thermoplastic resin mixture)Thickness = 4~50 Release film (PET)ACF5 / 24 Human & ScienceApplicationTouch/OLB/CMPCBCOG/COF Type ofConductorRemarksPlastic:PS, PMMA, etc. 3um~30um(Ni:~ :~ Au/Ni`DendritetypeSphericaltypeOr using inorganic fillers with OLB conductorsPlastic BeadNiAu Composition of ACF -26 / 24 Human & ScienceTAB Bonding_Input [TCP / LCD]TouchscreenpanelFOG ProductFOF bonding_[FPCB / PET]PCB Bonding_Output [TCP / PCB]FOG bonding [FPCB / LCD]Camera module [CMOS sensor/TCP]COG bonding [IC / LCD]FPCBFOG ProductACF applicationOLB ProductFingerprint Recognition Sensor [FOB/FOF]7 / 24 Human & ScienceIntroduction to H&S ACFs Human & ScienceNormal cureLow temp.)

5 CureLow condition170 C / 13sec or 180 C / 10sec or 190 C / 7secConductor Size20um10um4um20um10um5/4um10/5umModelT OU3020 CPTOU3010 CPTOU8810 JPTSC3140 TYTOU5000YZ1 TOU5010 DYTSC535(4)0seriesTOU_SeriesRemarkApplic able on the Ag(BM coated on the glass), ITOandMetal Product Line Up -TOUCH Film type Glasstype8 / 24 Normal cureAdhesion ImproveFast cureLowTemp. & Fast cureBonding Condition150~160 C / 10~15sec150~160 C / 10~15secConductor Size20um10um20um10um20um10um20 / 10umModelTGP20520 AGTOU2051 ASTCH8020 MPTCH8010 MPTOU5000 SPTOU5010 SPTOU_SeriesRemarkNormal issue & adhesion withPET.

6 Low pressure bonding ~160 C/5sec130~160 C/10sec120 C/10sec130 C/5sec130~150 C/10sec130~170 C/5sec140~180 C/4sec120~160 C/4secHuman & ScienceH&S Product Line Up FOG&COG FOG COG9 / 24 ItemHigh-temp cureMiddle-temp cureLow-temp cureTCG1031 GYTCG9031 METCG9031 UNUnder developmentBondingcondition190~230 C/5sec150~190 C/5sec135~175 C/5s120~150 CConductor(Size)Insulation coated3 , 4um3 3 3 RemarkConventional Storage : 500 2 Normal cureFast cureFast cure &Low temperatureBonding Condition180~190 C / 10sec180~190 C 7sec160~200 C 5~10sec140~180 C / 4secConductor Size10um5um4um4/5um4/5umItemTSC22000 NTSC3050 BPTSC3140 TYTSC5300SM seriesTSC5300 DMseriesRemarkNormal typeHigh.

7 Bonding at fast at fast goodSalt resistance & ScienceModelTGP5010 UBHTSB20522 FTCM5022UZ2 Bonding condition140~200 C, 4 Sec180~200 C, 7 Sec130~180 C, 6 SecConductor(Size)10 8+20 20+8umRemarkWaterproof/ Reliability CameraModuleH&S Product Line Up Camera Module Fingerprint RecognitionModule10 / 24 Epoxy gradeAcryl gradeBonding Condition180~200 C >15 Sec180~200 C 7 Sec180~200 C 7 Sec140~170 C 10 Sec140~170 C 10 Sec130~180 C 6 SecConductor SizeNormal typeSoft typesoft + hardSoft type10 10 8+20 10 15 20 ItemTSB21000 SDTSB21001F TSB20522 FTCM5010 UZTCM5015UZ3 TCM5000UZ2 RemarkNormal cure & goo protect electrical open, used the mixed ball.

8 (metal +polymer)Low & Science PCB OLBH&S Product Line UP PCB&OLB11 / 24 ModelHigh cureLow cureTGP20505 NEMA8888E TGP5552 UBHTGP5552 UATGP5552US3 BondingCondition180 ~ 200 C/ 8sec130 ~ 190 C/ 4sec140 ~ 200 C/ 4sec150 ~ 220 C/ 4sec130 ~ 200 C/ 4secConductor(size)Ni ball5 3 5 RemarkEpoxy flow & Press Temp. (300~700 )pitch adhesion condition150~200 C/4sec170( 20) C / 4~10sec130~180 C/4secConductor(Size)3um3um3/4umRemarkFi ne pitch 1layer (ACF)Good Adhesion2layer (ACF/NCF)Fine pitch, Low-Temp. & Fast (ACF/NCF)

9 Human & ScienceH&S / 12 / 24 / Flexible ACF Bonding Just In Time 1W, 2 Just In Time ACF Bondingsolution VOC ISSUE, Line Tool SMT ACF C S , Application Flexible PET COP I / D Human & ScienceTest/Process condition Guidefor Touch PanelHuman & ScienceEvaluation System _ Pressure, Temperature, Time-> Before Pre-bondingTemperature conditionPressure conditionIn case of target pressure 3 MPa( 30kgf/cm2)

10 X 3cm = 30kgf/cm2= pressure device is set up so that the pressure of may be applied3cm FilmCushion bandHeat toolFPCACF 90% of target bonding temperature shouldbe reached within 3 sec in case of 7sec bondingthermocoupleRKC ST-50 ACF width13 / 24 Human & ScienceChecking Flatness of Bonding Tool -> Before Pre-bondingPIPressure sensitive paper Left/Right -balance NGForward/rear -balanceNGTool balance OK-. A tool tip have to manage balance and surface of tip, because it might be caused bubble and uneven conductor tip -roughness NG14 / 24 Human & Science[ Proper pre-bonding pressure ][ Excessive pre-bonding pressure ]Base filmACFPET(TSP)ACFPET(TSP)Base film About pre-bonding pressureThe pre-bonding pressure and the temperature should be as low as possible since the purpose of pre-bonding isonly for attaching ACF on the image shows the failure case due to excessive pre-bonding pressure.