Transcription of Halogen Free, High Tg, Low Transmission Loss, Low …
1 Halogen Free, high Tg, Low Transmission loss , Low CTE multilayer material MCL-HS100 GH-100 Prepreg . Low Dielectric Constant Glass Thermosetting Resin multilayer material Features Applications MCL-HS100 Type D with Low Dk glass has low Dk/Df values. Semiconductor packages. Suitable for package and high frequency application. FC-CSP,PoP,SiP . MCL-HS100 has low CTE value and reduces warpage. Core material for HDI. Well-suited for build-up construction. Core material for Thinner Module. Standard Speci cations Part Number Type Copper Foil Thickness Code Name Actual Thickness and Tolerance 3 m 5 m 12 m 18 m 35 m STD,LP,RT,HVLP MCL-HS100. 3 m 5 m 12 m D 18 m 35 m LP,RT,HVLP Note1) STD:12 m, 18 m, 35 m; LP:3 m, 5 m, 12 m; RT:18 m, 35 m; HVLP:12 m, 18 m, 35 m. Please contact us for details. Note2) In case laminate thickness lies in between two thickness gures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one.
2 Characteristics Thin Laminate . 3 Actual Value Test Method Item Condition Unit MCL-HS100 D IPC-TM-650 . MCL-HS100 Type TMA 240 260 Tg . DMA 240 260 . X 6 8. 30 120 . 1. Y 6 8. CTE ppm/ Tg 20 30. Z. Tg 130 180. Solder Heat Resistance 260 A sec. 300 . - . Without copper 60. TMA min. - . Without copper 60. Decomposition Temperature(5% weight loss ) TGA 430 450 12 m Copper Peel Strength A kN/m 18 m Surface Roughness Ra A m 2 3 Flexural Modulus Lengthwise A GPa 23 28 1 GHz 2 Dielectric Constant C-96/20/65 . 10 GHz 2 JPCA TM-001. 1 GHz 2 Dissipation Factor C-96/20/65 . 10 GHz 2 Volume Resistivity C-96/20/65+C-96/40/90 cm 1 1014 1 1016. Surface Resistance C-96/20/65+C-96/40/90 1 1013 1 1015. C-96/20/65 1 1014 1 1016 . Insulation Resistance . C-96/20/65+D-2/100 1 1013 1 1015 . Water Absorption E-24/50+D-24/23 *1 . Heating Rate:10 /min.
3 *2 . Measured by Triplate-Line Resonator. *3 . Refer to last page Condition Note . 10. Prepreg Glass Cloth Properties Part Number Type Yarn Count Resin Content Volatile Content Dielectric Thickness Style warp ll after Lamination 1 mm . 1017N75 1017 95 95 75 2 1027N71 1027 75 75. 71 2 1037N71 1037 69 72 71 2 1078N61 1078 53 53 61 2 2116N55 2116 60 58 55 2 GH-100 D1027N73 1027 75 75 73 2 D1037N73 1037 69 72 73 2 D D1078N63 1078 53 53 63 2 D2013N60 2013 69 76 60 2 D2116N57 2116 60 58 57 2 Test Method IPC-TM-650 . 1 . The dielectric thickness after lamination is de ned as the thickness of one sheet of prepreg when the resin ow is 0%. This value changes depending on the press condition or inner layer pattern. Warpage of coreless-5layer Transmission loss TEG Chip 0. dB/cm . Package size : 14mm 14mm Chip size : Chip thickness : 150 m Under ll thickness : 60 m CEL-C-3730-4 MCL-LW-910G.
4 Transmission loss <Sample>. MCL-HS100 Type(D). L1,5:12 m Cu100%,L2,3,4:No copper,SR:- MCL-LW-900G. Prepreg construction GH-100 Type(D):(1078, :63%) 4ply GEA-700G Type(R):(1078, :66%) 4ply GEA-705G:(1078, :65%) 4ply MCL-E-770G Type(LH). MCL-E-700G Type(R). 200 0 5 10 15 20. Room Room Temp Temp(Start) Convex (after re ow) Frequency GHz . 150. 100. m . 50 <Measurement conditions>. Evaluation PWB Strip-line Temperature & Humidity:25 /60%RH. Warpage 0. Characteristic impedance . Proofreading method TRL(Thru-Re ect-Line). -50. Reflow Temp P/P w -100 t b Trace width(w) Dielectric thickness(b) -150. Core Trace thickness( ) 18 m Concave 25 260 25 . -200. GH-100 GEA-700G GEA-705G. Type D Type R 5L-PWB. 5L-PWB 5L-PWB. 11.
