Hi3670 V100 Application Processor Data Sheet - …

1 Hi3670 V100 Application Processor Data Sheet Issue 01 Date 2018-03-02 Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co., Ltd i Copyright HiSilicon Technologies Co., Ltd. 2018. All rights part of this document may be reproduced or transmitted in any form or by any means without prior written consent of HiSilicon Technologies Co., Ltd. Trademarks and Permissions , , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.

2 Notice The purchased products, services and features are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

3 HiSilicon Technologies Co., Ltd. Address: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China Website: Email: Hi3670 Data Sheet About This Document Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co., Ltd ii About This Document Purpose This document describes the basic functions and specifications of the Hi3670 V100. Related Version The following table lists the product version related to this document. Product Name Version Hi3670 V100 Intended Audience This document is intended for: Technical support engineers Board hardware development engineers Software engineers Symbol Conventions The symbols that may be found in this document are defined as follows.

4 Symbol Description Alerts you to a potentially hazardous situation that could, if not avoided, result in equipment damage, data loss, performance deterioration, or unanticipated results. Provides additional information to emphasize or supplement important points in the main text. Hi3670 Data Sheet About This Document Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co., Ltd iii Change History Changes between document issues are cumulative. The latest document issue contains all the changes made in earlier issues. Issue 01 (2018-03-02) This issue is the first official release Hi3670 Data Sheet Contents Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co.

5 , Ltd iv Contents About This Document .. ii 1 1 Major Features .. 1 Computing Capability .. 1 multimedia .. 1 Interfaces .. 3 Chip Architecture .. 3 Typical Application .. 4 2 Description .. 5 Interrupt .. 5 Function Description .. 5 Interrupt Mapping .. 5 Memory Mapping .. 7 3 Mobile Processing Module .. 24 CPU .. 24 Overview .. 24 Operating Mode .. 25 GPU .. 26 Overview .. 26 Operating Mode .. 26 I/O Processor .. 27 4 Media Processing .. 28 Overview .. 28 VENC .. 28 VDEC .. 31 Function Description .. 31 Clock and Reset .. 33 ICS .. 34 Function Description .. 34 Clock and Reset.

6 35 DSS .. 36 Hi3670 Data Sheet Contents Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co., Ltd v Function Description .. 36 Clock and Reset .. 38 Application .. 39 DP (DSS) .. 45 ASP .. 46 DSP .. 46 DMAC .. 51 SIO .. 53 WatchDog .. 58 GPIO .. 59 Timer .. 60 IPC .. 61 OCRAM .. 63 DP (ASP) .. 63 5 Storage Control .. 65 Overview .. 65 Storage Solution .. 65 SD/SDIO .. 66 UFS .. 67 6 Interface Control .. 68 USB .. 68 69 SPI .. 69 I2C .. 70 GPIO .. 70 PWM .. 72 PCIe .. 72 Hi3670 Data Sheet 1 Introduction Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co.

7 , Ltd 1 1 Introduction Major Features Computing Capability Core specifications of the Hi3670 computing capability are as follows: 8-core CPU, including four GHz ARM Cortex-A73 MPCore high-performance cores and four GHz ARM Cortex-A53 MPCore energy-efficient cores OPENGL , OPENCL , OPENCL , Renderscript, and high-performance 3D acceleration technologies compressed by AFBC MMU management for all chip channels, reducing overhead of reserved memories 1866 MHz four-channel LPDDR4x AFBC compression and process optimization to reduce the DDR bandwidth Hardware acceleration for secure encryption and decryption using dual engines multimedia Core specifications of the Hi3670 multimedia features are as follows.

8 Built-in video hardware decoder (with the maximum rate of 3840 x 2160@60 3840 x 2160@30 fps) Built-in video hardware encoder ( 3840 x 2160@30 fps) Built-in Mali-G72 MP12 GPU Independent JPG codec and face detection acceleration module Maximum resolution of 3840 x 2400@60 Hz) Dual MIPI display interfaces Table 1-1 describes the multimedia features of the Hi3670 . Table 1-1 Hi3670 multimedia features multimedia Feature Description GPU Hi3670 Data Sheet 1 Introduction Issue 01 (2018-03-02) HiSilicon Proprietary and Confidential Copyright HiSilicon Technologies Co., Ltd 2 multimedia Feature Description 3D acceleration Supports OpenGL ES and , OpenGL ES , OpenGL ES , and OpenGL ES Supports OpenCL , , and Renderscript Vulkan Camera input interface Three MIPI CSI interfaces (D-PHY 4+4+4 lane or C-PHY 3+3+3 lane) Image input format 1.

9 Supports uncompressed RAW10, RAW12, and RAW14. 2. Supports RGB-IR input RAW10, RAW12, and RAW14 (2 MPs at 120 fps at most). 3. Supports phase data sensors. 4. Supports uncommon formats after storage conversion in bypass mode. Storage format Supports RAW10, RAW12, and RAW14. Data in these formats is stored in 2-byte alignment. 3A Supports auto focus (AF), auto white balance (AWB), and auto exposure (AE). Display Display pixel depth RGB888 or RGB565 Display resolution The maximum resolution is 3840 x 2400, with the refresh rate of 60 Hz. MIPI interface Supports dual MIPI display interfaces. Display system Supports online multi-layer overlay, color key, alpha blending, and DIM.

10 Supports online resizing and offline resizing and rotation. Supports the interface IFBC, IFBC and RSP integration, and VESA compression algorithms. Supports online display post processing and color management. Supports offline overlay for multiple layers, color key, alpha blending, and DIM. Supports bus data compression and decompression. Encoding and decoding Video encoding Encoding format: or HD photographing: 3840 x 2400@30 fps 4 x 1080p@30 fps simultaneous HD encoding 720p 240 fps video, supporting fast recording and slow playback Video decoding Supports multiple formats such as and Up to 4K@60 fps and 4K@30 fps Audio Audio interface Supports I2S and PCM interfaces.