Transcription of High Elastic Modulus, Low CTE ... - hitachi-chem.co.jp
1 CTE is 20% lower in X,Y directions and 50% lower in Z direction than that of our standard FR-4. Elastic modulus is 30% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection. Superior heat resistance at PCT. Surface roughness is 1/4 that of our standard FR-4, making fine pattern possible. Semiconductor packages. FC-BGA, BGA, CSP Core material for Elastic Modulus, Low CTE Multilayer MaterialMCL-E-679 Type R High Tg Glass Epoxy Multilayer Material FR-4 Features Standard Specifications ApplicationsCopper Foil ThicknessCode Thickness and *1 Heating Rate:10 C/min. *2 Measured by Triplate-Line Resonator. *3 Refer to last page Condition Note thickness core is used depending on test Type R Prepreg Part NumberMCL-E-679 FType R Characteristics Thin Laminate ItemXYZUnit Cppm/ CcycleskN/m mGPa cm Actual ValueMCL-E-679F Type R Test Method IPC-TM-650 160 170190 20012 1412 1420 30130 160 300 60 30340 360 327 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 3 TMADMA 30 120 C Tg Tg ATMATGA260 C ReflowAAAC-96/20/65C-96/20/65C-96/35/90C -96/20/65C-96/20/65+D-2/100E-24/50+D-24/ 23 ATgCTE 1 Solder Heat Resistance 260 C T-260 Without Copper T-288 Without Copper Decomposition Temperature 5% Weight Loss Heat Resistance for HDI Process Semi-Additive Copper Peel
2 StrengthSurface Roughness Ra Flexural Modulus Lengthwise Dielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceWater AbsorptionFlammability18 m35 m 1 MHz 1 GHz 21 MHz 1 GHz 2 2 m 5 m12 m18 m35 m70 m STD,LP,PF 2,3,5,12,18,35 m STD,LP,PF Note 1 In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker 2 The thickness means that of dielectric layer. Figure in bracket )means thickness of dielectric layer of MCL using 70 m copper foil. 1 Thickness of STD:12 m, 18 m, 35 m, 70 m. 2 Thickness of LP:3 m, 5 m, 12 m, 18 m. 3 Thickness of PF:3 m, 5 m, 12 STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profile-free copper STD:12 m,18 m, 35 m, 70 m; LP:2 m, 3 m, 5 m, 12 m, 18 m; PF:2 m, 3 m, 5 m, 12 m.
3 Please contact us for In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker The thickness means that of dielectric CTE is 20% lower in X,Y directions and 50% lower in Z direction than that of our standard FR-4. Elastic modulus is 30% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection. Superior heat resistance at PCT. Surface roughness is 1/4 that of our standard FR-4, making fine pattern possible. Semiconductor packages. FC-BGA, BGA, CSP Core material for Elastic Modulus, Low CTE Multilayer MaterialMCL-E-679 Type R High Tg Glass Epoxy Multilayer Material FR-4 Features Standard Specifications ApplicationsCopper Foil ThicknessCode Thickness and *1 Heating Rate:10 C/min.
4 *2 Measured by Triplate-Line Resonator. *3 Refer to last page Condition Note thickness core is used depending on test Type R Prepreg Part NumberMCL-E-679 FType R Characteristics Thin Laminate ItemXYZUnit Cppm/ CcycleskN/m mGPa cm Actual ValueMCL-E-679F Type R Test Method IPC-TM-650 160 170190 20012 1412 1420 30130 160 300 60 30340 360 327 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 3 TMADMA 30 120 C Tg Tg ATMATGA260 C ReflowAAAC-96/20/65C-96/20/65C-96/35/90C -96/20/65C-96/20/65+D-2/100E-24/50+D-24/ 23 ATgCTE 1 Solder Heat Resistance 260 C T-260 Without Copper T-288 Without Copper Decomposition Temperature 5% Weight Loss Heat Resistance for HDI Process Semi-Additive Copper Peel
5 StrengthSurface Roughness Ra Flexural Modulus Lengthwise Dielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceWater AbsorptionFlammability18 m35 m 1 MHz 1 GHz 21 MHz 1 GHz 2 2 m 5 m12 m18 m35 m70 m STD,LP,PF 2,3,5,12,18,35 m STD,LP,PF Note 1 In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker 2 The thickness means that of dielectric layer. Figure in bracket )means thickness of dielectric layer of MCL using 70 m copper foil. 1 Thickness of STD:12 m, 18 m, 35 m, 70 m. 2 Thickness of LP:3 m, 5 m, 12 m, 18 m. 3 Thickness of PF:3 m, 5 m, 12 STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profile-free copper STD:12 m,18 m, 35 m, 70 m; LP:2 m, 3 m, 5 m, 12 m, 18 m; PF:2 m, 3 m, 5 m, 12 m.
6 Please contact us for In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker The thickness means that of dielectric layer. 5101520253035050100150200 Flexural Modulus GPa Temperature C Thickness mm Flexure mm Stiffness Properties Flexural Modulus01020304050608070050100150200250 Barcol HardnessTemperature C Barcol Hardness0 MCL-E-679 Type W MCL-E-679F Type R MCL-E-679F Type R MCL-E-679 Type W MCL-E-679 Type W MCL-E-679F Type R Test Method IPC-TM-650 Prepreg R 69 7260 4853 5360 5860 5073 268 268 258 251 2 25110 25 FRZPE FRUOE FRROE FRSKE FREGE TypeYarn Count warp fill Resin Content Volatile Content Gelation Time sec.
7 Dielectric Thickness after Lamination 1 mm PropertiesGlass Cloth10371080107821161504 StylePart NumberGEA-679F*1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer FR-4 Standard FR-4 Standard FR-4 Absorption % Processing Time hrs. Water Absorption under 85 C 85%RHMCL-E-679F Type R MCL-E-679 Type W Weight 20g Test Method Span 100mm SubstrateSubstrate Size220mm Length 10mm Width Flexure27
