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High Tg FR-4 Laminates and Prepregs (170ºC)

high Tg FR- 4 laminates and prepregs (170 C) performance and Processing Advantages high interlayer bonding strength with optimum resin flow Superior dielectric thickness control Wide processing window for maximum lamination performance Enhanced thermal and chemical resistance Compatible with automatic optical inspection process UV-block feature Meet IPC-4101C /24 [ mm] to [ mm]Size:40 x48 , 42 x42 , 42 x48 , 48 x48 , 54 x48 Option: special size Foil Cladding:Grade 3 (HTE), to : Low profile & very low profile copper :Available in roll or panel formGlass Styles:0106, 1080, 2313, 2116, 1500 and 7628 TLM-170 TDSI ssued: 01/2011 TLM-170 products are manufactured with a unique high performance epoxy resin reinforced with electrical grade (E-glass) glass fabric.

High Tg FR-4 Laminates and Prepregs (170ºC) Performance and Processing Advantages • High interlayer bonding strength with optimum resin flow

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  Performance, High, Laminate, Prepreg, 4 laminates and prepregs, 186 c

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Transcription of High Tg FR-4 Laminates and Prepregs (170ºC)

1 high Tg FR- 4 laminates and prepregs (170 C) performance and Processing Advantages high interlayer bonding strength with optimum resin flow Superior dielectric thickness control Wide processing window for maximum lamination performance Enhanced thermal and chemical resistance Compatible with automatic optical inspection process UV-block feature Meet IPC-4101C /24 [ mm] to [ mm]Size:40 x48 , 42 x42 , 42 x48 , 48 x48 , 54 x48 Option: special size Foil Cladding:Grade 3 (HTE), to : Low profile & very low profile copper :Available in roll or panel formGlass Styles:0106, 1080, 2313, 2116, 1500 and 7628 TLM-170 TDSI ssued: 01/2011 TLM-170 products are manufactured with a unique high performance epoxy resin reinforced with electrical grade (E-glass) glass fabric.

2 TLM-170 offers enhanced thermal resistance due to a high Tgvalue, Tg 170 oC and achieve flammability class of UL94V-0. These materials are compatible with the AOI process , photoimagable for solder mask and exhibit the UV block approvalUL-Recognized FR-4, File Number E174552 TLMTLM--170 TYPICAL laminate PROPERTIES170 TYPICAL laminate & TwistUL-94C-24/23/50+E-24/125V-0V-0 GHz500 MHz1 MHzC-24/23 Tangent (Df) GHz1 Breakdown, spec 107104 MohmSurface x 108106 Mohm-cmVolume ResistivityAfter thermal ( ) ( ) oz. (35 micron) oz. (17 micron)ASTM Conductivity150 ( )-50 - 260 oC~ 280-Post-TgPre-Tg60 Pass - 10-MinutesTD-260 As receivedE1/105+ D-24/23 IEC 60112C-24/23/50288 C solder dippingX 10 D3850315- CDecomposition Temperature (Td) 175 CGlass Transition Temperature (Tg) by DSC, spec minimum1315--ppm/ CCTE X-Axis Ambient to ~ 50-ppm/ CCTE visualSecondsThermal Constant (DK) resistanceUL-746 AASTM D3638175-250 (CL=3)-VoltsComparative Tracking Index (CTI) Method(IPC-TM-650 orAs noted) ( ) ( )Lb/inch (N/mm)Peel Strength(spec minimum)

3 50,000 ,000 ValueUNITSP roperty60,00070,000psiFlexural Strength AbsorptionInformation contained in this data sheet represents typical or average values and does not constitute any warranty or TDSI ssued: 01/2011 Note: 1 Other fabric styles are available upon Property values are adjustable for special processing needs3 Volatile content for all Prepregs is less than prepreg TYPICAL PROPERTY VALUES170 prepreg TYPICAL PROPERTY VALUESTLM-170 TDSI ssued: 01 2025 2024 2021 2018 2023 2032 2030 2034 2042 2039 flow Thickness2 Resin Flow2(%)After Pressed Thickness2 Gel Time2(sec)VolatileContent3(%)Resin Content2(%)Fabric Style1 Storage condition.

4 - prepreg properties will maintained for 3 months when keep it under 23oC and under 50%RH- Beware of moisture, always keep it wrapped in damp proof Press Parameter For TLM-170 Time (min)Temperature (oC)Pressure 20 - 28 kg/cm2temperature 195oC5 kg/cm2195oC -> 30oC 50 oC50 oC150 oC100 oC20 80 60 40 140 120 100 50oC -> 195oC 20 temperaturePressureTLM-170 TDSI ssued: 01/2011 Cushion: Craft paper 162 g/m2top and bottom 9-12 sheets eachNumber of sheets: 6-8 oC/minProduct heating rate (@ 65-120oC) < 2 oC/minCool down rate20 28 kg/cm2 Full Pressure50 60 minCure time @ 180 oCRecommended Press Cycle:Note : This press cycle is just recommendation Manufacturer may adjust it based on genuine process.


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