1 HMT150044_CMDB roschuere_BW_02_2016_final 15:04 Seite 1. Bonding Wires for Semiconductor Technology HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 2. Contents History 4. Superior Bonding Wire Technology 5. Research & Development 6. Bonding Wire Technology Laboratory & Applications 7. Commitment to Product and Service Excellence 8. General Bonding Wire Characteristics 9. Gold Bonding Wires 10. Aluminum Bonding Wires 14. Copper Bonding Wires 17. Aluminum Bonding Ribbons 20. Gold, Silver and Platinum Bonding Ribbons 21. Special Wire Products 22. 2. HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 3. Heraeus is a family-owned, global company active in the business areas of precious metals, sensors, dental and medical products, quartz glass and specialty lighting sources.
2 Heraeus has been one of the leading companies in precious metals and materials technology for 160 years. We develop, manufacture and supply bonding wires made of gold, copper and aluminum as well as gold and aluminum ribbons and specialties for contacts in discrete and inte- grated components. In addition, we supply all kinds of materials for surface mount technology in the semiconductor, electronics, communications and computer industries. 3. HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 4. History From the Melting of Precious Metals to Micro-Joining Technology Electrically conducting connections have to be manufactured Heraeus established bonding wire production in the early for integrated and highly integrated circuits to join the con- 1970s at the headquarters in Hanau, Germany.
3 For more nection pad of the chip to the system carrier of the than 25 years bonding wires made by Heraeus have been semiconductor component. available in Korea. Between 1992 and 2002 production sites were set up in China and the Philippines. With this strategic Fine and ultra-fine wires of precisely doped and alloyed decision Heraeus was able to offer its excellent service and metals having diameters ranging from 8 m to 500 m technological advances to the local customers. are used for this purpose. Highest demands are made on reliability and quality of these bonding wire connections. With the acquisition of the bonding wire business of Kulicke & Soffa Inc.
4 Heraeus subsequently combined its The experience of decades, the high technical competence own knowledge with over 40 years experience from the and the continual integration of the wide variety of customer companies formerly known as Mueller Feindraht AG and requirements into our production expertise guarantee the American Fine Wire . high quality of Heraeus products. Today Heraeus is a leading provider of technological solutions Worldwide activities and an intensive interchange of for gold, aluminum and copper bonding wires, serving our technology and information between our production sites customers locally with a global perspective.
5 Throughout the world permit optimum supplies and best possible prompt service. 1856 1900 1950 1965 1980 2000 2011. South Korea Philippines China W. C. Heraeus Hanau, Germany China IC Metals Heraeus Bonding Wires American Fine Wire Kulicke & Soffa AFW Singapore Mueller Feindraht AG. First wire Industrial 2 wafer 4 wafer 8 wafer bond 1947 wire bonding starts 1971 starts 1976 starts 1990. of 1 wafer starts 1966. 4. HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 5. Superior Bonding Wire Technology Pure Raw Materials Heraeus uses raw materials of highest purity for maximum uniformity and consistency in all gold wire products.
6 Doping and Casting Advanced doping and casting techniques enable precise definition of bonding wire characteristics. Wire Drawing High performance technology is used to draw wire to the finest diameters and in extreme lengths. Annealing Grain structure and wire properties are controlled through precise thermo-mechanical processing. Spooling Precision winding systems ensure optimal despooling. Resulting in finished products of the highest quality! 5. HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 6. Research & Development 5 nm The electronics and semiconductor industries can be charac- We are driven by the needs of the market particularly terized by perpetual change and technological advancement.
7 Moore's law and the ongoing device feature size reduction In response to the demands of this volatile market, our Ongoing end product miniaturization which in turn drives researchers are continually looking for new and improved tighter bond pitches, stacked die and complex bond loops solutions for advanced materials. Demanding bond-reliability requirements especially with finer wires Through the close cooperation with our customers, we Demanding cost-performance solutions driving the need ensure the function, quality and long-term supply of products. for alternative metallurgies including copper The laboratory and analysis departments of Heraeus help our Unique solutions required in power applications customers to improve the process and increase yields; they Overall performance improvements support R&D in designing new products and implementing new material products into customers' assembly concepts.
8 Long-term experiences in the areas of materials and defect- analysis, as well as close contact with the world's leading international research institutes, industrial partners and universities, are good reasons to have confidence in Heraeus' technology. All of the above results in Heraeus' researchers working on industry leading products on a market tailored roadmap. 6. HMT150044_CMDB roschuere_BW_09_2015_final 15:04 Seite 7. Bonding Wire Technology Laboratory Our research and development teams are staffed by Our products are developed with state of the art tools recognized experts in the fields of metallurgical science and our labs are equipped with most of the instruments our and interconnect technologies.
9 Highly-skilled staff utilize customers use in their qualification or production processes. advanced materials analytical systems, including high performance optical and electron microscopes, as well This enables us to simulate the customer's environment as X-ray diffraction and spectroscopic equipment, thus and provide application services which support our providing experienced and comprehensive metallographic customer's in reducing time to market with their products. capabilities. Our application engineers bring together their industrial experience with full process knowledge of bonding We work closely with equipment and tool providers enabling equipment, bonding tools and bonding wire.
10 Synergy between the equipment and materials, resulting in robust processes for our customers. Applications The increasing miniaturization in electronics has resulted Heraeus Electronics offers a wide product range in bonding wires becoming important constituents of for various applications of the electronic assemblies. Automotive industry Telecommunications For this purpose fine and ultrafine bonding wires of Semiconductor manufacturers gold, aluminum, copper and palladium are used. Highest Consumer goods industry demands are made on their quality, especially with regard to the uniformity of the wire properties. Heraeus Bonding Wire product groups are: Bonding wires for applications in plastic filled Depending on their chemical composition and specific electronic components properties, the bonding wires are adapted to the bonding Aluminum and aluminum alloy bonding wires for technique selected and to automatic bonding machines as applications which require low processing temperature well as to the various challenges in assembly technologies.