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IPC-4556 Specification for Electroless Nickel/Electroless …

IPC-4556 Specification forElectroless Nickel/ Electroless Palladium/Immersion Gold (ENEPIG)Plating for Printed CircuitBoardsDeveloped by the Plating Processes Subcommittee (4-14) of theFabrication Processes Committee (4-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 Table of of Scope .. Nickel Reducing Agents -Phosphorus Content .. Palladium Reducing Agents .. of Precedence .. Functions .. Bonding .. Surface .. Switches .. Dome Contacts .. Shielding .. for Conductive and/or AnisotropicAdhesives .. Applications .. Tab Contact Applications .. of ENEPIG .. Corrosion/Chemical Resistance .. Frequency Signal Loss .. 32 APPLICABLE DOCUMENTS AND TERMS .. Society for Testing and Materials(ASTM International).

functional surface finish, applicable to soldering and to gold, aluminum and copper wire bonding. It is also suitable as the mating surface for soft membrane and steel dome contacts. Additional applications include use in Low Insertion Force (LIF) and Zero Insertion Force (ZIF) edge connectors and for press-fit applications.

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Transcription of IPC-4556 Specification for Electroless Nickel/Electroless …

1 IPC-4556 Specification forElectroless Nickel/ Electroless Palladium/Immersion Gold (ENEPIG)Plating for Printed CircuitBoardsDeveloped by the Plating Processes Subcommittee (4-14) of theFabrication Processes Committee (4-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 Table of of Scope .. Nickel Reducing Agents -Phosphorus Content .. Palladium Reducing Agents .. of Precedence .. Functions .. Bonding .. Surface .. Switches .. Dome Contacts .. Shielding .. for Conductive and/or AnisotropicAdhesives .. Applications .. Tab Contact Applications .. of ENEPIG .. Corrosion/Chemical Resistance .. Frequency Signal Loss .. 32 APPLICABLE DOCUMENTS AND TERMS .. Society for Testing and Materials(ASTM International).

2 Standardization Program .. Technologies, Inc.. Organization for Standardization(ISO) .. , Definitions and Acronyms .. Magnification Reference Images .. Thickness .. Nickel Thickness .. Palladium Thickness .. Gold Thickness .. Calibration Standards .. of Non-Statistical ThicknessSpecification .. Overruns and/or Inventory Items .. Measurement Testing (Wetting BalanceTesting) .. Corrosion .. 94 QUALITY ASSURANCE Quality Assurance Provisions .. Recommendations .. Test Coupons .. Conformance Testing .. Measurements .. Processes .. 11 APPENDIX 1 Chemical Definitions and 12 APPENDIX 2 Round Robin Test 14 APPENDIX 3 ENEPIG PWB Surface Finish XRFR ound Robin 16 APPENDIX 4 Factors Affecting MeasurementAccuracy of ENEPIG Coatingsby 23 APPENDIX 5 ENEPIG PWB Surface FinishWetting Balance 32 APPENDIX 6 Solder Spread 40 APPENDIX 7 ENEPIG PWB Surface FinishShear Test 48 APPENDIX 8 Gold wire 58 APPENDIX 9 XRF Thickness Measurementsof thin Au and Pd (ENEPIG):Recommendations forInstrumentation (Detectors)and their 64 APPENDIX 10 Gage Capability.

3 Gage R&RType 1 66 APPENDIX 11 Solderability Testing Helps SelectSurface 69 January 2013 IPC-4556vFiguresFigure 3-1 Uniform Plating .. 5 Figure 3-2 Extraneous Plating or Nickel Foot .. 5 Figure 3-3 Edge Pull Back .. 5 Figure 3-4 Skip Plating .. 5 Figure 3-5 Skip Plating of Gold Over Palladium .. 6 Figure 3-6 Skip Plating of Gold Over a PalladiumDeposit .. 6 Figure 3-71000X SEM Image of a Normal ENEPIGS urface .. 6 Figure 3-84000X SEM Image of a Normal ENEPIGS urface .. 6 Figure 3-92500X FIB Image of a Normal ENEPIGD eposit .. 6 Figure 3-10100,000X FIB Image of a Normal ENEPIGD eposit .. 6 Figure 3-11 TEM Image of a Normal ENEPIG Deposit .. 7 Figure 3-122500X Image of Nickel that isHyper-Corroded .. 7 Figure 3-13 The Standard IPC Force MeasurementCoupon .. 9 Figure A3-1 Test Coupon Used for XRF Round RobinMeasurements .. 16 Figure A3-2 Immersion Gold Thickness Readings inMicroinches for the Sixteen Test PadsWhere C Is the Reference XRF.

4 18 Figure A3-3 Electroless Palladium Thickness Readingsin Microinches for the Sixteen Test PadsWhere C Is the Reference XRF .. 19 Figure A3-4 Electroless Nickel Thickness Readingsin Microinches for the Sixteen Test PadsWhere C Is the Reference XRF .. 20 Figure A3-5 The Impact of Feature Size on ElectrolessPalladium and Immersion Gold DepositionThickness Plated on the Same PB .. 22 Figure A4-SS1 XRF Spectra of 1/2 oz Cu/Epoxy oz Cu/Epoxy .. 28 Figure A4-SS2 XRF Spectra of ENEPIG Plated on Cu(No Epoxy) vs. 1/2 oz Cu/Epoxy .. 29 Figure A4-SS3 XRF Spectra of ENEPIG Plated on Cu(No Epoxy) vs. ENEPIG Plated on 1 ozCu/Epoxy .. 30 Figure A4-SS4 XRF Spectrum of ENEPIG Plated on1 oz Cu/Epoxy .. 31 Figure A5-1 Example of the Wetting Balance CouponUsed for the Testing of ENEPIG .. 32 Figure A5-2 XRF Measurements of Gold andPalladium Thicknesses Suppliedas Nominal micron ElectrolessPalladium.

5 33 Figure A5-3 XRF Measurements of Gold andPalladium Thicknesses Suppliedas Nominal micron ElectrolessPalladium .. 33 Figure A5-4 XRF Measurements of Gold andPalladium Thicknesses Suppliedas Nominal micron ElectrolessPalladium .. 33 Figure A5-5 Metronelec ST88 Wetting BalanceUsed for the Testing .. 33 Figure A5-6 Example of the Wetting Performance fora Nominal 4 in Electroless PalladiumTested with SnPb Solder .. 34 Figure A5-7 Example of the Wetting Performance fora Nominal 8 in Electroless PalladiumTested with SnPb Solder .. 34 Figure A5-8 Example of the Wetting Performance fora Nominal 20 in Electroless PalladiumTested with SnPb Solder .. 35 Figure A5-9 Example of the Wetting Performance fora Nominal 4 in Electroless PalladiumTested with SAC305 Solder .. 35 Figure A5-10 Example of the Wetting Performance fora Nominal 8 in Electroless PalladiumTested with SAC305 Solder.

6 36 Figure A5-11 Example of the Wetting Performance fora Nominal 12 in Palladium Tested withSAC305 Solder .. 36 Figure A5-12 Example of a Nominal 4 in ElectrolessPalladium ENEPIG Post Temperature andHumidity Stressing, Tested with SnPb -Showing Excellent Robustness .. 37 Figure A5-13 Example of a Nominal 4 in ElectrolessPalladium ENEPIG, with Very ThinImmersion Gold after Temperature andHumidity Stressing & Tested with SnPb .. 38 Figure A5-14 Example of a Nominal 6 in ENEPIGD eposit Tested with SAC305 PostStressing Showing ExcellentRobustness of Deposit .. 38 Figure A5-15 Performance of Sample Group 20 (withthin gold) with SAC305 Post Stressing .. 39 Figure A6-1 Layout of Test Board Used for SolderSpread and Wetting Balance Testing .. 41 Figure A6-2 Solder Spread Pattern and Paste Stencil .. 41 Figure A6-3An Actual Solder Spread Result Showingthe Deposits Counted for Each Line ofthe Pattern.

7 42 Figure A6-4 Solder Spread Results Using an ROL1Sn/Pb/Ag Solder Paste on ENEPIGD eposits .. 43 Figure A6-5 Solder Spread Results Using an ROL0Pb-free Solder Paste of the SAC 300 Family on ENEPIG Deposits .. 44 Figure A6-6 Solder Spread for Lowest Spread ENEPIGS ample Showing Evidence of High ContactAngle and Dewetting for Some Areas ofthe Printed Board .. 45 Figure A6-7 Solder Spread Results for Pb-free SolderPaste as a Function of the EN LayerThickness in the ENEPIG Deposit .. 46 Figure A7-1 Shear Test Coupon .. 48 Figure A7-2 DAGE 5000 Shear Test System .. 49 Figure A7-3 Solderball Shear Results .. 49 Figure A7-4Sn63Pb37 Test Coupon 19 .. 52 Figure A7-5Sn63Pb37 Test Coupons1& 52 Figure A7-6Sn63Pb37 Test Coupons3& 52 IPC-4556 January 2013viFigure A7-7Sn63Pb37 Test Coupons5& 53 Figure A7-8Sn63Pb37 Test Coupons7& 53 Figure A7-9Sn63Pb37 Test Coupon 18 .. 53 Figure A7-10Sn63Pb37 Test Coupon 19.

8 54 Figure A7-11 SAC305 Test Coupons1& 54 Figure A7-12 SAC305 Test Coupons3& 54 Figure A7-13 SAC305 Test Coupons5& 55 Figure A7-14 SAC305 Test Coupons 16 & 17 .. 55 Figure A7-15 SAC305 Test Coupon 18 .. 55 Figure A7-16 SAC305 Test Coupon 19 .. 56 Figure A7-17 Solderball Shear Force as a Function ofPalladium Plating Thickness .. 56 Figure A8-1 wire Bond Test Vehicle Showing pin #1,quadrants 1, 2, 3 and 4 .. 58 Figure A8-2 Example of 6 inx8inPanel Containing1 in x 1in ENEPIG wire Bond Coupons .. 60 Figure A8-3 Visual Evaluation of wire BondingShowing Classical Crescents Resultingin Neck Breaks .. 61 Figure A8-4(Top) Summary of 1 mil Gold WireENEPIG Destructive Pull Test (DPT)Results and (Lower) Comparison ofX-Y Directional DPT Values .. 62 Figure A11-1a Meniscometer .. 70 Figure A11-1bWetting Balance .. 70 Figure A11-2 ENEPIG with Thin and Thick Pd fromVendors1& 71 Figure A11-3 Wetting Rate as a Function of BattelleClass 2 Aging.

9 72 TablesTable 3-1 Requirements of Electroless Nickel ElectrolessPalladium Immersion Gold (ENEPIG) Plating .. 4 Table 4-1 Suggested Fabricator Qualification Plan .. 10 Table 4-2C=0 Sampling Plan (Sample Size for SpecificIndex Value1) .. 11 Table A3-1 Comparison of the Accuracy of MeasurementsRelative to the C Readings for All ThreeDeposits .. 21 Table A4-1 Summary of XRF Configuration SolutionsOffered for Measurement of ENEPIGP lating on PCB s with Advantages andDisadvantages .. 27 Table A5-1 XRF Measurements of the micron Electroless PalladiumSamples .. 32 Table A6-S1 Preconditioning and Solder Paste MatrixUsed for Solder Spread Testing for aGiven ENEPIG Chemistry and ElectrolessPalladium Thickness .. 40 Table A7-1 Test Coupon Serial Number and PalladiumThickness .. 48 Table A7-2Sn63Pb37 Solderball Shear Test ResultsCoupon Set 1 (grams) .. 50 Table A7-3Sn63Pb37 Solderball Shear Test ResultsCoupon Set 2 (grams).

10 50 Table A7-4 SAC305 Solderball Shear Test ResultsCoupon Set 1 (grams) .. 51 Table A7-5 SAC305 Solderball Shear Test ResultsCoupon Set 2 (grams) .. 51 Table A8-ITwenty-one Panels Marked (a) WholePanel, (b) Array and (c) Hand Cut .. 59 Table A8-IIDestructive wire Bond Pull Test Force(grams) Results for All 21 ENEPIGTest Groups .. 60 Table A8-III Summary of Plating Finish Thicknesses forSamples wire Bonded .. 63 Table A9-1 XRF Detectors and Their Limitations atTypical Count Rates .. 64 Table A11-1 Relative Wettability Guideline, UsingContact Angle ( C) As General Metric .. 70 January 2013 IPC-4556viiSpecification for Electroless Nickel/ Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards1 Statement of ScopeThis Specification sets the requirements for the use of Electroless Nickel/ Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards.


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