IPC-Association Connection Electronic Industries

1 Standards Manager Web Standards ListIPC- association Connection Electronic Industries IdNumberTitleYearOrganizationPage1 IPC-WHMA-A-620 DRequirements and Acceptance for Cable and Wire Harness Assemblies2020 IPC 21791 Trusted Electronic Designer, Fabricator and Assembler Requirements2020 IPC 32223 DSectional Design Standard for Flexible Printed Boards2020 IPC 42591 Connected Factory Exchange (CFX)2020 IPC 56012 EQualification and Performance Specification for Rigid Printed Boards2020 IPC 68921 Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, ConductiveYarns and/or Wires2019 IPC 7WP-021 Considerations of New Classes of Coatings for IPC-CC-830 Revision C2019 IPC 8WP-026PC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State ofBlockchain Technology and Its Potential Applications in Electronics Manufacturing2019 IPC 91754 WAM 1 2019 IPC0101791 AM1 Trusted Electronic Designer, Fabricator and Assembler Requirements2019 IPC0112231 DFX Guidelines2019 IPC0122591 Connected Factory Exchange (CFX)

2 2019 IPC0139111 Troubleshooting for Printed Board Assembly Processes2019 IPC014 HDBK-620 Handbook and Guide to IPC-D-620 & IPC/WHMA-A-6202019 IPC015 HERMES-9852 The Global Standard for Machine-to-Machine Communication in SMT Assembly2019 IPC016WP-025PC White Paper on A Framework for the Engineering and Design of E-Textiles2018 IPC0179301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability2018 IPC018CC-830 CQualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies2018 IPC0194591 ARequirements for Printed Electronics Functional Conductive Materials2018 IPC0201791 Trusted Electronic Designer, Fabricator and Assembler Requirements2018 IPC0214203 BCover and Bonding Material for Flexible Printed Circuitry2018 IPC0227095 DDesign and Assembly Process Implementation for Ball Grid Arrays (BGAs)2018 IPC023WP-024 IPC White Paper on Reliability and Washability of Smart Textile Structures Readiness for the Market2018 IPC0246903 ATerms and Definitions for the Design and Manufacture of Printed Electronics2018 IPC0254204 BFlexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards2018 IPC026J-STD-001 GSSpace and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electricaland Electronic Assemblies2018 IPC027 IPC/JEDEC-9707-AM1 Spherical Bend Test Method for Characterization of Board Level Interconnects2018 IPC028 IPC/JEDEC J-STD-033 DHandling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices2018 IPC029 PERM-WP-022 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow Results of an Industry Round-Robin Final Report2018 IPC030J-STD-001 GSFRENCHA nnexe des produits _lectroniques des applications spatiales et militaires la norme J-STD-001G.

3 Exigences desAssemblages _lectriques et _lectroniques Bras _s2018 IPC0316013D AMD 1 Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards2018 IPC0321754 Materials Declaration Standard for Aerospace and Defense - Includes Access to Additional Content2018 IPC0339121-AM1 Troubleshooting for PCB Fabrication Processes Amendment 12018 IPC0342292 Design Standard for Printed Electronics on Flexible Substrates2018 IPC035WP-023 IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain ContinuityReflow Test: The Hidden Reliability Threat - Weak Microvia Interface2018 IPC0367094 ADesign and Assembly Process Implementation for Flip Chip and Die-Size Components2018 IPC0372221 BAPPENDIX AGeneric Standard on Printed Board Design - Version Applications Electronic Hardware Addendum to IPC/WHMA-A-620C2018 IPC0397621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by LowPressure Molding with Thermoplastics2018 IPC0404412B AMD 2 Specification for Finished Fabric Woven from __ __E __ __ Glass for Printed Boards2018 IPC041J-STD-001 GAMD 1 Requirements for Soldered Electrical and Electronic Assemblies2018 IPC042WP-019 AAn Overview on Global Change in Ionic Cleanliness Requirements2018 IPC043 PERM-2901Pb-free Design & Assembly Implementation Guide2018 IPC0444552 ASpecification for Electroless Nickel/Immersion Gold (ENIG)

4 Plating for Printed Circuit Boards2017 IPC0454921 ARequirements for Printed Electronics Base Materials (Substrates)2017 IPC0466012D-AM1 Qualification and Performance Specification for Rigid Printed Boards2017 IPC0476013 DNULL2017 IPC0487091 NULL2017 IPC0497530 AGuidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)2017 IPC0507711C-7721 CNULL2017 IPC0519204 2017 IPC0521072-AM1 NULL2017 IPC0531401 2017 IPC0542226 ASectional Design Standard for High Density Interconnect (HDI) Printed Boards2017 IPC0554101 ESpecification for Base Materials for Rigid and Multilayer Printed Boards2017 IPC0564103 BSpecification for Base Materials for High Speed/High Frequency Applications2017 IPC0579505 2017 IPC058A-600FC ADDNULL2017 IPC059A-640 NULL2017 IPC060 IPC-WHMA-A-620 CNULL2017 IPC061J-STD-001 FSSpace Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical andElectronic Assemblies2017 IPC062J-STD-002 ENULL2017 IPC063J-STD-006 CAMD 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic SolderingApplications2017 IPC064WP-019 2017 IPC065A-600 NULL2016 IPC0664202 BFlexible Base Dielectrics for Use in Flexible Printed Circuitry2016 IPC0672581B-WAM1 NULL2016 IPC0689241 2016 IPC0699262 2016 IPC0701071B 2016 IPC0711601A 2016 IPC0724556 AMD 1 Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG)

5 Plating for Printed Circuit Boards2016 IPC0736012DA 2016 IPC0749121 2016 IPC075A-600 HAcceptability of Printed Boards2016 IPC076 HDBK-001F 2016 IPC077J-STD-609B 2016 IPC078J-STD-609 BNULL2016 IPC0791782 NULL2016 IPC0802223 DNULL2016 IPC0819252 BNULL2016 IPC0829691 BNULL2016 IPC0836018 CNULL2016 IPC0846018 CSNULL2016 IPC085A-610-AMD 1 NULL2016 IPC086D-640 NULL2016 IPC087J-STD-001 AND 1 NULL2016 IPC088J-STD-046 NULL2016 IPC089D-620 NULL2015 IPC090 HDBK-4691 NULL2015 IPC091 JEDEC-9702 AMD1 NULL2015 IPC0926903 NULL2015 IPC0934103A-WAM1 AMD2 NULL2015 IPC0941072 NULL2015 IPC095J-STD-001 FSSpace Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical andElectronic Assemblies2015 IPC096 IPC/JEDEC J-STD-020 EMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices2015 IPC0976012 DSSpace and Military Avionics Applications Addendum to IPC-6012D Qualification and Performance Specification for RigidPrinted Boards2015 IPC0986012 DQualification and Performance Specification for Rigid Printed Boards2015 IPC0997092 Design and Assembly Process Implementation for Embedded Components2015 IPC01007801 Reflow Oven Process Control Standard2015 IPC0101 IPC/JPCA-6901 Application Categories for Printed Electronics2015 IPC0102T-50 MTerms and Definitions for Interconnecting and Packaging Electronic Circuits2015 IPC0103TM-650 , Manual and Semi or Automatic Method2015 IPC0104 IPC/JEDEC J-STD-033C-Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices2014 IPC0105J-STD-001 FRequirements for Soldered Electrical and Electronic Assemblies2014 IPC0106J-STD-003 CSolderability Tests for Printed Boards - Incorporates Amendment 1.

6 May 20142014 IPC0107J-STD-030 AJOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials2014 IPC0108SM-817 AGeneral Requirements for Dielectric Surface Mounting Adhesives2014 IPC0109TM-650 Strength, Flexible Dielectric Tear Strength, Flexible Insulating Current Induced Thermal Cycling Test2014 IPC01124101 DNULL2014 IPC0113J-STD-030 ANULL2014 IPC01141071 ABest Industry Practices for Intellectual Property Protection in Printed Board Manufacturing - Effective Date: 6/21/20102014 IPC01151755 Conflict Minerals Data Exchange Standard2014 IPC01164101 DSpecification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendment 1: July 20152014 IPC01174103 ASpecification for Base Materials for High Speed/High Frequency Applications - Incorporates Amendment 12014 IPC01187711B/7721 BAMD2 REWORK, MODIFICATION AND REPAIR OF Electronic ASSEMBLIES2014 IPC01198701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly2014 IPC0120A-610 FAcceptability of Electronic Assemblies2014 IPC0121FC-234 APressure Sensitive Adhesive (PSA)

7 Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards2014 IPC0122 HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures2014 IPC01234203A-AMD 1 NULL2014 IPC01244204A AMD 1 NULL2014 IPC01254412B AMD 1 NULL2014 IPC0126J-STD-003 CAMD1 NULL2014 IPC0127 WHMA-A-620B AMD 1 NULL2013 IPC01284204A-AMD 1 NULL2013 IPC01292581 BNULL2013 IPC01304203 ACover and Bonding Material for Flexible Printed Circuitry2013 IPC01314412 BSpecification for Finished Fabric Woven from "E" Glass for Printed Boards2013 IPC01324556 Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards2013 IPC01335703 Cleanliness Guidelines for Printed Board Fabricators2013 IPC01346013 CNULL2013 IPC01357095 CDesign and Assembly Process Implementation for BGAs2013 IPC01369641 High Temperature Printed Board Flatness Guideline2013 IPC01379709 NULL2013 IPC0138A-630 NULL2013 IPC0139 HDBK-830 ANULL2013 IPC0140J-STD-002 DNULL2013 IPC0141 IPC-JEDEC-9706 NULL2013 IPC0142 IPC-WHMA-A-620B-SNULL2013 IPC0143 JPCA-2291 Design Guideline for Printed Electronics2013 IPC0144J-STD-003 CNULL2013 IPC0145J-STD-006 CRequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic SolderingApplications2013 IPC0146T-50 KTerms and Definitions for Interconnecting and Packaging Electronic Requirements for Shipping, Pack and Packing Materials2012 IPC01492221 BGeneric Standard on Printed Board Design2012 IPC01504552 Specification for Electroless Nickel/Immersion Gold (ENIG)

8 Plating for Printed Circuit Boards - Incorporates Amendments1 & 22012 IPC01514921 Requirements for Printed Electronics Base Materials (Substrates)2012 IPC01527527 Requirements for Solder Paste Printing2012 IPC01539151 DProcess Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database2012 IPC01549203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle2012 IPC01559252A AMD 1 NULL2012 IPC01569592 BRequirements for Power Conversion Devices for the Computer and Telecommunications Industries2012 IPC0157AJ-820 AAssembly and Joining Handbook2012 IPC0158 HDBK-001 EHandbook and Guide to Supplement J-STD-0012012 IPC0159 HDBK-850 Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for ElectronicsPrinted Circuit Board Assembly2012 IPC0160J-STD-033 CGERMNULL2012 IPC0161J-STD-033 CHUNGNULL2012 IPC0162J-STD-033 CNULL2012 IPC0163 IPC-JEDEC-9704 ANULL2012 IPC0164 IPC-JPCA-4591 NULL2012 IPC0165 IPC-WHMA-A-620 BGERMANNULL2012 IPC0166 IPC-WHMA-A-620B SPANISHNULL2012 IPC0167 IPC-WHMA-A-620 BNULL2012 IPC0168J-STD-005 ARequirements for Soldering Design Standard for Flexible Printed Boards2011 IPC01772223 CSectional Design Standard for Flexible Printed Boards2011 IPC01784103 ASpecification for Base Materials for High Speed/High Frequency Applications2011 IPC01794204 AFlexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry2011 IPC01806018 BQualification and Performance Specification for High Frequency (Microwave)

9 Printed Boards2011 IPC01817093 Design and Assembly Process Implementation for Bottom Termination Components2011 IPC01827525 BGERMANS tencil Design Guidelines2011 IPC01837525 BStencil Design Guidelines2011 IPC01849202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance2011 IPC01859850 ASurface Mount Placement Equipment Characterization2011 IPC0186CH-65 BCHINESENULL2011 IPC0187CH-65 BGuidelines for Cleaning of Printed Boards and Assemblies2011 IPC0188 CMDDIPC Conflict Minerals Due Diligence Guide2011 IPC0189 IPC-JEDEC-9707 NULL2011 IPC0190 JIG-101 Material Composition Declaration for Electrotechnical Products - Ed 1 NULL2011 IPC01949708 NULL2010 IPC0195A-600 NULL2010 IPC01964821 AMD 1 NULL2010 IPC01971071 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing2010 IPC01981601 Printed Board Handling and Storage Guidelines2010 IPC01991751 AGeneric Requirements for Declaration Process Managemnt - Incorporates Amendment 1: November 20122010 IPC02001752 AMaterials Declaration Management - Incorporates Amendment 1.

10 November 20122010 IPC02011756 Manufacturing Process Data Management - Version Design Standard for Rigid Organic Printed Boards2010 IPC02032611 Generic Requirements for Electronic Product Documentation2010 IPC02042612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology2010 IPC02052612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)2010 IPC02062614 Sectional Requirements for Board Fabrication Documentation2010 IPC02074202 AFlexible Base Dielectrics for Use in Flexible Printed Circuitry2010 IPC02086012 CQualification and Performance Specification for Rigid Printed Boards2010 IPC02097351 BGeneric Requirements for Surface Mount Design and Land Pattern Standard - Includes Access to Additional Content;Includes CD-ROM; Subscription customers can obtain one complimentary copy from IHS by contacting IHS CustomerCare at +1 800 IHS-CARE (+1 8002010 IPC02109631 GERMANU sers Guide for IPC-TM-650, Method , Thermal Stress, Convection Reflow Assembly Simulation2010 IPC02119631 Users Guide for IPC-TM-650, Method , Thermal Stress, Convection Reflow Assembly Simulation2010 IPC0212A-600 HFRENCHA cceptability of Printed Boards2010 IPC0213A-600 HRUSSIANNULL2010 IPC0214A-600 HAcceptability of Printed Boards2010 IPC0215A-610 ECZECHA cceptability of Electronic Assemblies2010 IPC0216A-610 EHEB)