IPC-HDBK-001F: Handbook and Guide to …

1 IPC- hdbk -001 FHandbook and Guide toSupplement J-STD-001 Developed by the IPC- hdbk -001 Task Group (5-22F) of the Assemblyand Joining Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPCS upersedes:IPC- hdbk -001E - February 2012 IPC- hdbk -001 w/Amendments1 & 2 - October 2005 IPC- hdbk -001 w/Amendment 1 -December 2000 IPC- hdbk -001 - March 1998 Table of Contents 1 Scope .. 1 Purpose .. 1 (Using This Handbook ).. Units and Applications .. Verification of Dimensions .. of Requirements .. Hardware Defects and Process Indicators .. Material and Process Nonconformance .. Requirements .. of Precedence .. Conflict .. Clause References .. Appendices .. and Definitions .. Disposition.

2 Electrical Clearance .. FOD (Foreign Object Debris) .. High Voltage .. Manufacturer (Assembler) .. Objective Evidence .. Process Control .. Proficiency .. Solder Destination Side .. Solder Source Side .. Supplier .. User .. Overwrap .. Overlap .. Flowdown .. Proficiency .. Requirements .. Assembly Requirements .. Requirements .. and Safety .. for Specialized Technologies .. 72 APPLICABLE .. Discharge Association .. 93 MATERIAL, COMPONENTS, AND .. Solder Lead Free .. Solder Purity Maintenance .. Flux Application .. Paste .. 23 Solder Powder .. 24 Particle Shape Effects .. 24 Solder Particle Size Effects .. 24 Oxide Content in Solder Paste .. 24 Metals Content .. 24 Paste Viscosity.

3 25 Determination of Correct Paste Volume .. Preforms .. Strippers .. Component and Seal Damage .. Coating Meniscus .. Tools and Equipment .. 274 GENERAL SOLDERING AND Discharge (ESD) .. Environmental Controls .. Temperature and Humidity .. Lighting .. Assembly Operations .. Maintenance .. of Component Surface Finishes .. Removal .. Metallic Surface Finishes Removal .. Protection .. of Nonsolderable Parts .. Cleanliness Requirements .. Part Mounting Requirements .. Requirements .. 32 February Lead Deformation Limits .. Hole Obstruction .. Metal-Cased Component Isolation .. Adhesive Coverage Limits .. Mounting of Parts on Parts (Stacking ofComponents) .. Connectors and Contact Areas .. Handling of Parts.

4 Preheating .. Controlled Cooling .. Drying/Degassing .. Holding Devices and Materials .. Machine (Nonreflow) Soldering .. Machine Controls .. Solder Bath .. Reflow Soldering .. Intrusive Soldering (Paste-in-Hole) .. 46 Selective Soldering .. Solder Connection .. Exposed Surfaces .. Solder Connection Anomalies .. Partially Visible or Hidden SolderConnections .. Heat Shrinkable Soldering Devices .. 495 WIRES AND TERMINAL and Cable Preparation .. Insulation Damage .. Strand Damage .. Tinning of Stranded Wire .. Terminals .. , Turret and Slotted TerminalInstallation .. Shank Damage .. Damage .. Flange Angles .. Mounting Mechanical .. Mounting Electrical .. Mounting Soldering .. to Terminals.

5 Requirements .. and Straight Pin Terminals .. Terminals .. Terminals .. Terminals .. Pierced or Perforated Terminals .. Cup and Hollow Cylindrical Terminals Placement .. to Terminals .. Bifurcated Terminals .. Slotted Terminal .. Cup and Hollow Cylindrical Terminals Soldering .. Wires (See Figure 5-19) .. Insulation .. Wire Routing .. Wire Staking .. Land .. Supported Holes .. SMT .. 606 THROUGH-HOLE MOUNTING Terminations General .. Lead Forming .. Termination Requirements .. Lead Trimming .. Interfacial Connections .. Coating Meniscus in Solder .. Holes .. Solder Application .. Through-Hole Component Lead Soldering .. Holes .. Lead Termination Requirements forUnsupported Holes.

6 697 SURFACE MOUNTING OF Mount Device Lead .. Plastic Components .. Forming .. Unintentional Bending .. Flat Pack Parallelism .. Surface Mount Device Lead Bends .. Flattened Leads .. Parts Not Configured for Surface Mounting .. Component Body Clearance .. Axial-Leaded Components .. Configured for Butt/I Lead Mounting .. Down of Surface MountLeads/Components .. Requirements .. Misaligned Components .. 72 IPC- hdbk -001 FFebruary Unspecified and Special Requirements .. Bottom Only Chip ComponentTerminations .. Rectangular or Square End Chip Components 1, 3 or 5 Side Termination .. Cylindrical End Cap Terminations .. Castellated Terminations .. Flat Gull Wing Leads .. Round or Flattened (Coined) GullWing Leads.

7 J Lead Terminations .. Butt/I Terminations .. Flat Lug Leads .. Tall Profile Components Having BottomOnly Terminations .. Inward Formed L-Shaped Ribbon Leads .. Surface Mount Area Array Packages .. Bottom Termination Components (BTC) .. Components with Bottom Thermal PlaneTerminations (D-Pak) .. Flattened Post Connections .. P-Style Terminations .. SMT Terminations .. 758 CLEANING PROCESS 75 Process Residues and Their Impact onProduct Reliability .. 76 Historical Perspective on Cleaning andCleaning Processes .. 76 Magnification and Visual Inspection forCleanliness .. 77 J-STD- 001f Section 8 Demystified .. Exemptions .. Cleaning .. Solder Cleanliness .. Foreign Object Debris (FOD) .. Flux Residue and Other Ionic or OrganicContaminants.

8 Post Soldering Cleanliness Designator .. Cleaning Option .. for Cleanliness .. 80 Asked Questions on Cleanliness .. 839 PCB Circuit Board Damage .. Exposure/Cut Fibers .. Haloing .. Edge Delamination .. Land/Conductor Separation .. Land/Conductor Reduction in Size .. Flexible Circuitry Delamination .. Flexible Circuitry Damage .. Burns .. Non-Soldered Edge Contacts .. Measles .. Crazing .. and Twist (Warpage) .. 9010 COATING, ENCAPSULATION AND STAKING(ADHESIVE).. 90 Conformal Coating General .. 90 Conformal Coating Adhesion .. 91 Substrate Preparation .. Conformal Coatings Materials .. 94 Acrylic (AR) .. 96 Epoxy (ER) .. 96 Silicone (SR) .. 96 Polyurethane (UR) .. 96 Paraxylylene (XY).

9 96 Two-Part Systems (Acrylic/Polyurethaneand Other Combinations) .. 97 Other Types of Conformal Coatings .. Conformal Coating Masking .. Conformal Coating Application .. Conformal Coating on Components .. Thickness .. Uniformity .. Transparency .. Bubbles and Voids .. Delamination .. Foreign Objects Debris .. Other Visual Conditions .. Inspection .. Rework or Touchup of Conformal Coating .. Encapsulation .. Application .. Performance Requirements .. Rework of Encapsulant Material .. Encapsulant Inspection .. Staking .. 103 February Staking Application .. Staking Adhesive .. Staking Inspection .. 10311 WITNESS (TORQUE/ANTI-TAMPERING) 10312 PRODUCT Hardware Defects Requiring Disposition.

10 Inspection Methodology .. Process Verification Inspection .. Visual Inspection .. Sampling Inspection .. Process Control Requirements .. Opportunities Determination .. Statistical Process Control .. 10613 REWORK AND Rework .. Repair .. Post Rework/Repair Cleaning .. 106 APPENDIX 107 APPENDIX AGuidelines for Soldering Toolsand 108 APPENDIX BMinimum Electrical Clearance Electrical Conductor 110 APPENDIX CJ-STD-001 Guidance onObjective Evidence ofMaterial 111 APPENDIX DCross Reference Listingby 112 ACRONYM 119 FiguresFigure 3-1 Phase Diagram for Eutectic Solder .. 11 Figure 3-2 Eutectic Solder Microstructure .. 11 Figure 3-3 Eutectic Solder Microstructure .. 11 Figure 3-4 Solder Wire Core Flux Comparison .. 13 Figure 3-5 Solder Alloy Fracture ToughnessTesting Results.