IPC-TM-650 TEST METHODS MANUAL

1 1 ScopeThis test method defines the procedure for deter-mining the adhesion of solder resists (masks) used over melt-ing metals, (such as solder plated and reflowed solder printedboards both prior to and after soldering), nonmelting metals,and printed board Applicable DocumentsJ-STD-003 Solderability Test METHODS for Printed Standard for Rigid Printed Test SpecimensThe test specimen used shall be thetest coupon shown in Figure 1, which has the plated metalsurface that is applicable, and coated with solder Apparatus or TapeA roll of pressure sensitive self-adhesive film cm [ in] wide exhibiting an adhesive strength of at least44 N/100 mm [40 oz-force/in] but no more than 66 N/100 mm[60 oz-force/in] as tested per ASTM D3330, as amended.

2 Ifthe tape has an advertised expiration date or shelf life it shallnot be used after the expiration date. If no such date exists,the product may be used up to one year from date of pur-chase. A noncomprehensive list of tapes meeting this require-ment can be found at Pull Test Tapes under TechnicalResources at the IPC web site: qualification testing, test specimens are to be pre-pared by processing m [1,339 in], double clad epoxyglass laminate through the standard plating process for themetal coatings that are applicable. For production testing, thecoupons shall be representative of the 1 Test Coupon G of IPC-2221, mm [in]3000 Lakeside Drive, Suite 309 SBannockburn, IL 60015-1249 IPC-TM-650 TEST METHODS Mask Adhesion - Tape Test MethodDate03/07 RevisionFOriginating Task GroupSolder Mask Performance Task Group (5-33B)Material in this Test METHODS MANUAL was voluntarily established by Technical Committees of IPC.

3 This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of thismaterial. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent referenced is for the convenience of the user and does not imply endorsement by CONNECTINGELECTRONICS INDUSTRIES preproduction qualification, test specimens are tobe cleaned using cleaning METHODS as recommended by thesolder resist manufacturer and standard production methodsfor comparison purposes prior to solder resist specimens are to be coated and cured by thestandard production is to be conducted on specimens before andafter soldering in accordance with J-STD-003, METHODS A, B,C, or D with no accelerated a strip of pressure sensitive tape, 50 mm[ in] minimum in length, firmly across the surface of thetest area removing all air entrapment.

4 The time between appli-cation and removal of tape shall be less than one the tape by a rapid pull force applied approximatelyperpendicular (right angle) to the test area. An unused strip oftape must be used for each examine the tape and test area for evidence ofany portion of the material tested having been removed fromthe report should note any evidence of materialremoved by this 1 illustrates the coupon that is used for black squares indicate metal. The white squares indicatethe base material. solder mask is applied over the entire con-ductor foreign material (oil, grease, etc.) is present on the testsurface the results may be of 3M Brand 600 1/2 inch tape to CID-A-A-113 is not required.

5 The 3M Brand 600 1/2 inch tape is avail-able through most office supply Mask Adhesion - Tape Test MethodDate03/07 RevisionFPage2of2