JANUARY 1995 JOINT INDUSTRY STANDARD

1 JOINTINDUSTRYSTANDARDR equirements forElectronic GradeSolder Alloysand Fluxed andNon-Fluxed SolidSolders for ElectronicSoldering Applications4th INTERIM FINALANSI/J STD-006 JANUARY 1995 INDUSTRESEST. 1924 CINORTCELIEAASSOCITIONAMERICAN NATIONAL STANDARDT able of SCOPE AND APPLICABLE INDUSTRY standards .. standards Organization (ISO) .. for Interconnecting and PackagingElectronic Circuits (IPC) .. Society for Testing andMaterials (ASTM).. of Precedence .. and Type and Residue for Product .. QUALITY ASSURANCE for Inspection and of Inspections .. of Solder Alloy for Test .. PREPARATION FOR , Packing, and Use .. Solder Product for Establishing Short Names forJ-STD-006 Alloys.

2 12 Appendix A Solder 13 FiguresFigure 1 Report form for solder alloy 7 Figure 2 Report form for solder powder tests .. 8 Figure 3 Report form for non-fluxed solder tests .. 9 Figure 4 Report form for fluxed wire/ribbonsolder 10 TablesTable 1 Solder 1 Table 2 Flux Types and Designating 2 Table 3 Flux Percentage .. 2 Table 4 STANDARD Solder Powders .. 4 Table 5 Solder 6 Table A-1 Composition, Short Names, Former Names,and Temperature Characteristics of 13 Table A-2 Cross Reference from Solidus and LiquidusTemperatures to Alloy 15 Table A-3 Cross-Reference from Alloy Short Namesto Alloy Names .. 16 Table A-4 Cross-reference from ISO 9453 AlloyNumbers and Designations toJ-STD-006 Alloy 17J-STD-006 JANUARY 1995iiiRequirements for Electronic grade Solder Alloysand Fluxed and Non-Fluxed Solid Soldersfor Electronic Soldering SCOPE AND ScopeThis STANDARD prescribes the requirements andtest methods for electronic grade solder alloys; for fluxedand non-fluxed bar, ribbon, and powder solders, other thansolder paste, for electronic soldering applications; and for special electronic grade solders.

3 This STANDARD is a qual-ity control document and is not intended to relate directlyto the material s performance in the manufacturing for applications other than electronics should beprocured using ASTM document is one of a set of three JOINT industrystandards which prescribe the requirements and testmethods for soldering materials for use in the elec-tronics INDUSTRY and, when adopted by a Government,for use on that Government s high reliability elec-tronic hardware: J-STD-004 covering solderingfluxes, J-STD-005 covering solder paste, and J-STD-006 (this document) covering solder alloys and solidsolder electronic grade solders include all solderswhich do not fully comply with the requirements ofstandard solder alloys and solder materials listedherein.

4 Some examples of special solders are anodes,ingots, preforms, bars with hook and eye ends,multiple-alloy solder powders, ClassificationSoldering materials covered by thisstandard shall be classified by alloy composition, solderform, flux type, flux percentage, and by other characteris-tics peculiar to the solder material Alloy CompositionThe solder alloys covered bythis STANDARD are the alloys listed in Appendix A, TableA-1, and include pure tin and pure indium. Each alloy isidentified by an alloy name, which is composed of a seriesof alphanumeric characters that identify the component ele-ments in the alloy by chemical symbol and nominal per-centage by mass, and ending with an arbitrarily assignedalloy variation letter (A, B, C, D, E).

5 Alloys are also iden-tified by an alloy short name, which is a five-characteralphanumeric designation composed of the chemical sym-bol for the key element in the alloy (see ), the nominalpercentage of that element in the alloy, and the arbitrarilyassigned alloy variation letter. Appendix A, Table A-1,identifies alloy composition, the alloy short name, andalloy temperature characteristics. Appendix A, Table A-2,cross references solidus and liquidus temperatures to alloynames. Appendix A, Table A-3, cross references alloy shortnames to alloy names. Appendix A, Table A-4, cross refer-ences ISO alloy numbers and designations from ISO 9453to J-STD-006 alloy Solder FormThe forms of solder materials cov-ered by this set of standards are listed with their single-letter designating symbols in Table Flux TypeThe flux types used in/on solders cov-ered by this set of standards are listed in Table 2.

6 Therequirements for fluxes are covered by Flux Percentage and Metal ContentThe nominalpercentage of flux by mass in solid-form solder products isidentified as the flux percentage. The flux percentage in/onsolid solders is identified by a single alphanumeric charac-ter in accordance with Table 3. Metal content refers tothe percentage of metal in solder paste (see J-STD-005). Other CharacteristicsStandard bar solders arefurther classified by unit mass. Wire solders are furtherclassified by wire size (outside diameter) and unit solders are further classified by thickness, widthand unit mass. Powder solders are further classified bypowder particle size distribution and unit APPLICABLE DOCUMENTSThe following documents form a part of this STANDARD tothe extent specified herein.

7 Unless a specific issue is citedherein or in the contract or purchase order, the issue ineffect on the date of invitation for bids or request for pro-posal shall 1 Solder FormsIdentifyingSymbolSolderFormIdentify ingSymbolSolderFormIdentifyingSymbolSold erFormFFlux(only)BBarRRibbonPPaste(Cream )D PowderWWireSSpecialJanuary 1995J-STD-0061