LFM-48TM-HP Solder Paste - almit.com

1 ALMIT Pb-Free Solder PasteLFM-48 TM-HPALMIT TECHNOLOGY Long Stencil Life The biggest defect with Pb-Free Solder Paste is the short stencil life. This problem has already been solved by ALMIT TM flux. However, there are improvements that can be made to improve first time pass rates. ALMIT TM-TSFlux has the combination of long stencil lifeand excellent printability. ALMIT TM-HPFlux has the same characteristics as TM-TS, and can be used at high preheat temperatures(200 degree C).2 Printability Constant Constant Constant speed11th Print3rd PrintClogging Level (After 11th)Snap off SpeedPrinted ShapeMask Aperture Squeegee Speed 15mm/sec Each snap off speed Printing Machine:Kyusyu Matsushita SP10 PTerms:Mask / 125 m Pressure / ~ / Clogging. Excellent Printability. 3 Printability -2120mm/sec90mm/sec30mm/sec11th print3rd print Clogging LevelSqueegee speedPrinted ShapeMask ApertureSnap off speed Each squeegee speed Terms:Mask / 125 m Pressure / ~ / Machine:Kyusyu Matsushita SP10 PNo Clogging.

2 Excellent Printability. 4 Tack ForceTack Force0501001502000 4 812162024 Leaving period hr gf TM-HPUsed machine: Malcom TK-1 Leaving term: Leave the Solder Paste on the laboratory table after printing, then refit lid to Paste method: JIS Z 3284 compliantStable Tack Force5 Stencil LifeStencil Life050100150200250024681012141618202224 262830323436384042444648505254 hr Pa s TM-HPUsed machine: Malcom PCU-2 Atmosphere: 25 C, 85%RHStable Stencil PlateNi Method: JIS Z 3197 (1986): Put Solder Paste on each test board.: Put on 240 Chot platefor Test at HeatingNo Method : JIS Z 3284 Printed thickness 200 mPut on 190 Chot plate for 1min. TM-HPSolder Ball Test Rank 1 Rank 1 Rank 1 Rank 10 hr24 hrTest Method:JIS Z 3284 Storage condition is room temp and room C, 1minPH 240 C, 30sec9 Wetting on ChipSn100 coated 2125 CSn100 coated 1608 CTest Method: Print thickness 150 m Mount AirReflowReflow Temp Preheat 150~170 C,2min Reflow upper 220 C, 40secPeak 238 C10 High Temp Preheat Test 1 11 Reflow termReflow oven: Eitec tectronARS 330 WNAir 4 zone9035234172190 Term(1) PH170~190/90secUpper 220/ 35secPeak 234 Term(2) PH180~190/120secUpper 220/51secPeak 24012051240180190 High Temp Preheat 212 Term(3) PH constant 200/120secUpper 220/ 54secPeak 237 Term(4) PH constant 200/180secUpper 220/75secPeak 237 Reflow termReflow oven.

3 Eitec tectronARS 330 WNAir 4 zone1205423720018075237200 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 (1) PH 170~190/90sec patternOverall view of JIS-1 1 dotLFM-48 W TM-HP13 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(2) PH 180~190/120secLFM-48 W TM-HP14 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(3) PH constant 200/120secLFM-48 W TM-HP15 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(4) PH constant 200/180secLFM-48 W TM-HP16 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(1) PH170~190/90secCompetitor17 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(2)PH180~190/120secCompetitor18 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(3) PH constant 200/120secCompetitor19 Dot spreadabilitySurface FinishCoalescenceSolder ballMelt1 dotFlat patternJIS-2 JIS-1 patternOverall view of JIS-1 1 dotTerm(4)

4 PH constant 200/180secCompetitor20 Component Self-AlignmentSn62V14 LLFM-48 X TM-HPCompetitor Sn62 off set of pad width 10 Degree tilt2125 Chip21Sn62V14 LLFM-48 X TM-HPCompetitor Sn6230 Degree tilt20 Degree tilt2125 Chip22Sn62V14 LLFM-48 X TM-HPCompetitor Sn62 off set of pad width 10 Degree tilt1608 Chip23Sn62V14 LLFM-48 X TM-HPCompetitor Sn6230 Degree tilt20 Degree tilt1608 Chip24 Conclusion Based on the results of these test, ALMIT TM-HP fluxhas excellent wettabilityand printability. The great printed shapehelps prevent Solder ballsby eliminating slumping, and bridgesby reducing bleeding. TM-HP flux is ideal for high preheat temperatures. TM-HP fluxmakes Pb-Free SMT easier by reducing print defects & opening the reflow process window2526 Thank youFor more information please check our web site at