LPDDR3 and Wide I/O DRAM: Interface Changes …

1 Marc Greenberg, Director, Product Marketing - Memcon 2012 San Jose Sept 18, 2012 LPDDR3 and Wide I/O DRAM: Interface Changes that give PC-Like Memory Performance to Mobile Devices 2 2012 Cadence Design Systems, Inc. All rights reserved. What is PC-like Memory Performance? Common PC memory configurations Low-power Alternatives Comparative Metrics How did LPDDR3 evolve? How did Wide I/O evolve? Future low-power memory direction Agenda 3 2012 Cadence Design Systems, Inc. All rights reserved. Memory implementation by manufacturer* Number of bits in DRAM Interface / Interface data rate Computer Type Price Range Company 1 Company 2 Company 3 Company 4 Company 5 Tablet / Small $300-$550 64/800** 128/800** 128/1333** 128/800** Thin & Light $700-$700 64/1600 64/1600 64/1333** 64/1333** Entry Laptop $450-$500 64/1333** 128/1333 128/1333** 128/1333 Power Laptop $1250-$1500 128/1600** 128/1600 128/1600 128/1333** 128/1600 Entry Desktop $275-$330 64/1600 64/1600 128/1333 64/1333 Power Desktop $1200-$2500 256/1333 256/1600 192/1333 128/1333 128/1600 What is PC-Like Memory Performance?

2 * Computers selected are the author s opinion of indicative computers within the price range by a survey of websites of five large computer manufacturers in September 2012 and do not necessarily indicate the best, lowest cost, or most representative computer in the price range from each manufacturer ** Exact specification not available on manufacturer website; this number is estimated 4 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations 5 2012 Cadence Design Systems, Inc.

3 All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations All the Top PC manufacturers have a machine in the 100 Gbit/s range today 6 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations The majority of computing jobs are now in the 150-200 Gbit/sec range 7 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations Longer-term, mobile devices are going to be expected to perform like gaming PCs of today 8 2012 Cadence Design Systems, Inc.

4 All rights reserved. Mobile devices are becoming like our PC devices + Megapixel (approximately 1280*720) or better resolution now common in high-end smartphones 300+ pixels per inch 3+ Megapixel (approximately 2000*1600) tablets appearing The 22 LCD monitor on my desk is only 1680*1050 Consumers beginning to expect mobile entertainment experience to be like their wired entertainment experience 4K Video (8+ Megapixels - 3840*2160) and 3D are coming A small number of 4K TVs already for sale A 10 tablet with 480 pixels per inch could display 4K video Approximately 25-50 Gbit/s of video traffic to DRAM for video decode High-end desktop graphics cards capable of 4K operation have 250-300 Gbit/s of memory bandwidth Mobile Devices become like our PCs 9 2012 Cadence Design Systems, Inc.

5 All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations 10 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Company 1 Company 2 Company 3 Company 4 Company 5 Common PC Memory Configurations Current Generation Tablets Next Generation Smartphone Current Generation Smartphone Next Generation Tablets 11 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Low Power Memory - Today Current Generation Tablets Next Generation Smartphones Current Generation Smartphones Now In design now Shipping 2013-2015 Next Generation Tablets Concept Phase Shipping 2015+ 12 2012 Cadence Design Systems, Inc.

6 All rights reserved. 0 50 100 150 200 250 300 350 400 450 Current Generation Tablets Next Generation Smartphones Current Generation Smartphones Next Generation Tablets Low Power Memory - Today Now In design now Shipping 2013-2015 Concept Phase Shipping 2015+ 13 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 0 50 100 150 200 250 300 350 400 450 Current Generation Tablets Next Generation Smartphones Current Generation Smartphones Next Generation Tablets Current Generation Tablets Next Generation Smartphones Current Generation Smartphones Low Power Memory - Today Next Generation Tablets Now In design now Shipping 2013-2015 Concept Phase Shipping 2015+ 14 2012 Cadence Design Systems, Inc.

7 All rights reserved. 0 50 100 150 200 250 300 350 400 450 0 50 100 150 200 250 300 350 400 450 Current Generation Tablets Next Generation Smartphones Current Generation Smartphones Low Power Memory - Today Next Generation Tablets Now In design now Shipping 2013-2015 Concept Phase Shipping 2015+ 15 2012 Cadence Design Systems, Inc. All rights reserved. 0 50 100 150 200 250 300 350 400 450 Current Generation Tablets Current Generation Smartphones Low Power Memory - Today Next Generation Smartphones 32bit LPDDR2-800 32bit LPDDR2-1066 64bit LPDDR2-800 64bit LPDDR2-1066 128bit LPDDR2-800 Now In design now Shipping 2013-2015 Concept Phase Shipping 2015+ Next Generation Tablets DDR3L now appearing in some tablets 16 2012 Cadence Design Systems, Inc.

8 All rights reserved. 0 50 100 150 200 250 300 350 400 450 Current Generation Tablets Current Generation Smartphones Low Power Memory Future - Parallel Next Generation Smartphones 32bit LPDDR2-800 32bit LPDDR2-1066 64bit LPDDR2-800 64bit LPDDR2-1066 128bit LPDDR2-800 64bit LPDDR3 -1600 Now In design now Shipping 2013-2015 Concept Phase Shipping 2015+ 32bit LPDDR3 -1600 Next Generation Tablets 64bit DDR-3200 Possible Future Standard DDR3L now appearing in some tablets 128bit LPDDR3 -1600 64-bit Possible LPDDR3 speed extension 17 2012 Cadence Design Systems, Inc. All rights reserved. Low Voltage Low I/O Capacitance Unterminated I/Os Typically X16 or X32 data width per die Often contained in multi-die packages No DLL Fast low-power entry and exit Very low standby (self-refresh) power Temperature Compensated Self-Refresh mode Deep Power Down mode Partial Array Self-Refresh Low Power DRAM Typical Features 18 2012 Cadence Design Systems, Inc.

9 All rights reserved. DDR3L is a lower-voltage version of PC DRAM Appearing in many laptops and some tablets Low Power LPDDR vs Low Voltage DDR3L Attribute LPDDR2/ LPDDR3 DDR3L Target Market Mobile Devices Laptop, Desktop, Server IO Specification HSUL SSTL Command/Addressing 10 pin DDR bus ~22 pin SDR bus Target system Point-to-point DIMM Max I/O Capacitance Max Frequency 1066 MTs/1600MT/s 1600MT/s Typical Idle Power* 103mW 115mW Typical self-refresh Power* 5mW 16mW * Comparison of two 2 Gbit DDR-800 X16 parts from the same manufacturer 19 2012 Cadence Design Systems, Inc. All rights reserved.

10 Compared to packaged parts on PCB, PoP can reduce power, area, and volume Short paths with relatively good signal integrity properties Saves PCB area by using vertical direction May lead to thermal issues if die underneath is generating heat LPDDR2 and LPDDR3 (PoP) Package-on-Package (PoP) offers low power and area Upper die (for example, DRAM) Flipchip bumps to upper package PCB Upper package PCB Package balls connect upper and lower PCBs Lower die (for example, CPU or app processor) Lower Package PCB with landing pads on top Package balls System PCB Example cross-section - Not to scale 20 2012 Cadence Design Systems, Inc.