MSL Ratings and Reflow Profiles - Texas Instruments

1 ApplicationReportSPRABY1 relationshipof MSLratingto floorlife and surfacemountreflowtemperaturesfor TI MoistureSensitivityLevel(MSL).. of Figures1 Exampleof ComponentMSLR atingand PeakReflowof PeakReflowLabelingon Representationof a of Tables1 FactoryFloorLife @ 30 (Tc) Basedon trademarksare the propertyof February2015 MSLR atingsand ReflowProfilesSubmitDocumentationFeedbac kCopyright 2015,TexasInstrumentsIncorporated TI surfacemountICs havea moisturesensitivityleveland informationisdisplayedon (seeFigure1) and on the reel and box showsanexampleof a box Exampleof ComponentMSLR atingand PeakReflowof MSLR atingand PeakReflowLabelingon Box2 Applyingthe MoistureSensitivityLevel(MSL)The MSLratingof an IC determinesits floorlife beforethe boardmountingonceits dry bag has the electronicsindustrystandardfor definingMSLratingsversusfloorlife at30 C, as shownin FactoryFloorLife @ 30 CMSLF loorLifeMoistureRelativeHumidity1 Unlimited85%RH21 year2a4 weeks3168 hours472 hours60%RH548 hours5a24 hours6 Bakebeforeuse and reflowwithintime on labelMostsemiconductorproductsare ratedMSL3or is the highestratingwhereit is consideredas beingnot moisturesensitiveevenat 85%RH and componentsratedMSL1do not requiredry MSLratingis givenafterproductqualificationand determinedby the materialsusedin its ICpackagingand assemblyprocessis basedon a constant30 C and practice,the absorptionof moistureinto an IC packageis proportionalto temperatureand.

2 Floorlife can generallybe increasedwith exposureto temperatureslowerthan30 C or lowerhumiditylevelsthan60% ReflowProfilesSPRABY1 February2015 SubmitDocumentationFeedbackCopyright 2015, ,exposingit to higherhumidityconditionsor highertemperaturespotentiallyshortensthe IPC/JEDECJ-STD-033 Cprovidesguidanceonfloorlife for differingtemperatures(20 C to 35 C) and a rangeof relativehumidity(5% to 95%)fordifferentpackagetypesand exceedtheirfloorlife can be re-workedwith a baketo driveout bakingprocedureand whereyou shouldtake careto ensurethat the plastichousing(trays,tapeand reel or tubes)can withstandthe PeakReflowClassification(Tc) Basedon PackageDimensionsPackageThicknessVolume< 350 mm3 Volume350 2000mm3 Volume>2000mm3< mm260 mm mm260 C250 C245 C> C245 CTable2 is an extractfromthePb-FreeProcess- ClassificationTemperatures(Tc)tablein a definedbasedon packagethicknessand volumewherethe toleranceforpeaktemperatureis +0/-5 Lead-FreeSolderingFigure3.

3 TI Representationof a industrystandardfor a lead-freereflowprofilethat TI componentsare capableof illustratesthe key temperatureand timesassociatedwith the February2015 MSLR atingsand ReflowProfilesSubmitDocumentationFeedbac kCopyright 2015, can impactIC reliabilityare: Soaktime ts Soaktemperatures:min(Tsmin) and max (Tsmax) Luquidous(Liquidus)temperature(TL) for lead-freesoldering;this is approximately217 C. This variesaccordingto the alloy. The Peaktemperature(Tp) for reflowat top of the package. For a user,Tp shouldnot exceedTc Timethat definesthe peaktemperate(tp) starts-5 C belowTc. Rampup rate fromTL to TP Cooldownrate fromTP to TLNOTE:J-STD-020 Ddefinesa broadstandardfor moreinformation,see thedevice-specificdatasheetof the solderpastefor specificrecommendationsor limitationsonreflowrampratesand IPC/JEDECJ-STD-033C: JointIPC/JEDEC standardfor handling,packing,shipping,and use ofmoistureand reflowsensitivesurface-mountdevices.

4 JointIPC/JEDEC standardfor moistureand reflowsensitivityclassificationfornonher meticsolidstatesurface-mountdevicesBothd ocumentsare availableon ReflowProfilesSPRABY1 February2015 SubmitDocumentationFeedbackCopyright 2015,TexasInstrumentsIncorporatedIMPORTA NTNOTICET exasInstrumentsIncorporatedand its subsidiaries(TI) reservethe rightto makecorrections,enhancements,improvement sand otherchangesto its semiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis semiconductorproducts(alsoreferredto hereinas components ) are sold subjectto TI s termsand conditionsof salesuppliedat the time of warrantsperformanceof its componentsto the specificationsapplicableat the time of sale,in accordancewith the warrantyin TI s termsand conditionsof sale of otherqualitycontroltechniquesare usedto the extentTI deemsnecessaryto supportthis applicablelaw, testingof all parametersof eachcomponentis not assumesno liabilityfor applicationsassistanceor the designof Buyers responsiblefor theirproductsandapplicationsusingTI minimizethe risksassociatedwith Buyers productsand applications,Buyersshouldprovideadequate designand doesnot warrantor representthat any license,eitherexpressor implied,is grantedunderany patentright,copyright,maskworkright,orot herintellectualpropertyrightrelatingto any combination,machine.

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