Example: dental hygienist

NC7WZ07 SIP6 UDFN6 - ON Semiconductor

DATA Semiconductor Components Industries, LLC, 2000 March, 2022 Rev. 41 Publication Order Number: NC7WZ07 /DTinyLogic UHS Dual Buffer(Open-Drain Outputs) NC7WZ07 DescriptionThe NC7WZ07 is a dual buffer with open drain outputs fromonsemi s Ultra High Speed (UHS) series of TinyLogic. The device isfabricated with advanced CMOS technology to achieve ultra highspeed with high output drive, while maintaining low static powerdissipation over a broad VCC operating range. The device is specifiedto operate over a very broad VCC operating range.

Supply Voltage Data Retention 1.5 5.5 VIN Input Voltage 0 5.5 V VOUT Output Voltage 0 5.5 V tr, tf Input Rise and Fall Times VCC at 1.8 V ±0.15 V, 2.5 V ±0.2 V 0 20 ns/V VCC at 3.3 V ±0.3 V 0 10 VCC at 5.0 V ±0.5 V 0 5 TA Operating Temperature −40 +85 °C JA Thermal Resistance SC−88−6 − 377 °C/W MicroPak−6 − 154 MicroPak2−6 ...

Tags:

  Retention

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Transcription of NC7WZ07 SIP6 UDFN6 - ON Semiconductor

1 DATA Semiconductor Components Industries, LLC, 2000 March, 2022 Rev. 41 Publication Order Number: NC7WZ07 /DTinyLogic UHS Dual Buffer(Open-Drain Outputs) NC7WZ07 DescriptionThe NC7WZ07 is a dual buffer with open drain outputs fromonsemi s Ultra High Speed (UHS) series of TinyLogic. The device isfabricated with advanced CMOS technology to achieve ultra highspeed with high output drive, while maintaining low static powerdissipation over a broad VCC operating range. The device is specifiedto operate over a very broad VCC operating range.

2 The device isspecified to operate over the V to V VCC range. The inputsand outputs are high impedance when VCC is 0 V. Inputs toleratevoltages up to V independent of VCC operating Ultra High Speed: tPZL = ns (Typical) High IOL Output Drive: 24 mA at 3 V VCC Broad VCC Operating Range: V to V Power Down High Impedance Inputs / Outputs Over Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Ultra Small MicroPak Packages These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantA2Y2 Figure 1.

3 Logic SymbolY1A11 IEEC / IEC1 See detailed ordering, marking and shipping information in thepackage dimensions section on page 5 of this data INFORMATIONMARKINGDIAGRAMSSC 88 CASE 419B 02 SIP6 CASE 127 EBUDFN6 CASE 517 DPD3 KKXYZD3 KKXYZPin 1 Pin 1 GGZ07M16D3, Z07= Specific Device CodeKK= 2 Digit Lot Run Traceability CodeXY= 2 Digit Date Code FormatZ= Assembly Plant CodeM= Date Code*G= Pb Free Package(Note: Microdot may be in either location)*Date Code orientation and/or position mayvary depending upon manufacturing :1.

4 AAA represents product code top mark (see Ordering Information).2. Orientation of top mark determines pin one Read the top mark left to right, pin one is the lower left 2. SC 88 (Top View)AAAPin One A1 16 Y1 GND 25 VCC A2 34 Y2 A1Y1 GNDVCC A2Y2123654 Figure 3. MicroPak (Top Through View)Figure 4. Pin 1 Orientation(Top View)PIN DEFINITIONSPin # SC 88 Pin # MicroPakNameDescription11A1 Input22 GND Ground33A2 Input44Y2 Output55 VCC Supply Voltage66Y1 OutputFUNCTION TABLE (Y = A)InputsOutputAYLOW Logic LevelLOW Logic LevelHIGH Logic LevelHIGH Impedance OutputState, Open MAXIMUM RATINGSS ymbolParameterMinMaxUnitVCCS upply Voltage Input Voltage Output Voltage Input Diode CurrentVIN < 0 V 50mAIOKDC Output Diode CurrentVOUT < 0 V 50mAIOUTDC Output Current 50mAICC or IGNDDC VCC or Ground Current 100mATSTGS torage Temperature Range 65+150 CTJJ unction Temperature Under Bias +150 CTLJ unction Lead Temperature (Soldering, 10 Seconds)

5 +260 CPDP ower Dissipation in Still AirSC 88 332mWMicroPak 6 812 MicroPak2 6 812 ESDH uman Body Model, JEDEC: JESD22 A114 4000 VCharge Device Model, JEDEC: JESD22 C101 2000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be OPERATING CONDITIONSS ymbolParameterConditionsMinMaxUnitVCCS upply Voltage Voltage Data , tfInput Rise and Fall TimesVCC at V V.

6 V V020ns/VVCC at V V010 VCC at V V05 TAOperating Temperature 40+85 CqJAThermal ResistanceSC 88 6 377 C/WMicroPak 6 154 MicroPak2 6 154 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyondthe Recommended Operating Ranges limits may affect device Unused inputs must be held HIGH or LOW. They may not ELECTICAL CHARACTERISTICS SymbolParameterVCC (V)ConditionsTA = +25 CTA = 40 to +85 CUnitMinTypMaxMinMaxVIH HIGH Level Input to VCC VCC to VCC VCC VIL LOW Level Input to VCC to VCC VCCILKG HIGH Level Output Leakage to VIN = VIH or VIL, VOUT = VCC or GND 5 10mAVOL LOW Level Output VIN = VIH or VIL.

7 IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA Input Leakage to 0 VIN V Power Off Leakage Current0 VIN or VOUT = V 1 10mAICC Quiescent Supply to VIN = V, GND 1 10mAAC ELECTRICAL CHARACTERISTICSTA = +25 CTA = 40 to +85 CSymbolParameterVCC (V)ConditionsMinTypMaxMinMaxUnittPZL, tPLZP ropagation Delay (Figure 5, 6) = 50 pF, RU = 500 W,RD = 500 W,VI = 2 x VCC = 50 pF, RU = 500 W,RD = 500 W,VI = 2 x VCC Capacitance0 pFCOUTO utput Capacitance0 pFCPDP ower Dissipation Capacitance(Note 5) (Figure 7) 3 4 5.

8 CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) atno output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). 5. AC Test CircuitFigure 6. AC WaveformsAINPUTVCCF igure 7. ICCD Test CircuitVCCCLRDINPUTOUTPUTRUVINOTE:6. CL includes load and stray Input PRR = MHz, tW = 500 :8. Input = AC Waveform; tr = tf = ns;PRR = Variable; Duty Cycle = 50%.

9 ORDERING INFORMATIONPart NumberTop MarkPackageShipping NC7WZ07P6XZ07SC 883000 / Tape & Reel NC7WZ07P6X L22347Z07SC 883000 / Tape & Reel NC7WZ07L6XD3 MicroPak5000 / Tape & Reel NC7WZ07 FHXD3 MicroPak25000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011 and MicroPak2 are trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the UnitedStates and/or other 127 EBISSUE ODATE 31 AUG 2016 MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein.

10 ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 SIP6 Semiconductor Components Industries, LLC, 88 (SC 70 6 Lead), 419AD 01 ISSUE ADATE 07 JUL 2010E1 DALL1L2eebA1A2cTOP VIEWSIDE VIEWEND VIEWq1q1 Notes:(1) All dimensions are in millimeters.


Related search queries