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NCSU033B(T) - Nichia

Nichia STS-DA1-2394I < >. Nichia CORPORATION SPECIFICATIONS FOR UV LED. ncsu033b (T). Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant Nichia STS-DA1-2394I < >. SPECIFICATIONS. (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Unit Forward Current IF 700 mA. Pulse Forward Current IFP 1000 mA. Allowable Reverse Current IR 85 mA. Power Dissipation PD W. Operating Temperature Topr -10~85 C. Storage Temperature Tstg -40~100 C. Junction Temperature TJ 130 C. * Absolute Maximum Ratings at TS=25 C. * IFP conditions with pulse width 10ms and duty cycle 10%. (2) Initial Electrical/Optical Characteristics Item Symbol Condition Typ Max Unit Forward Voltage VF IF=500mA - V. Radiant Flux e IF=500mA 450 - mW. Peak Wavelength p IF=500mA 365 - nm Spectrum Half Width IF=500mA - nm Thermal Resistance R JS - C/W. * Characteristics at TS=25 C. * Radiant Flux value as per CIE 127:2007 standard. * R JS is the thermal resistance from the junction to the TS measurement point.

NICHIA STS-DA1-2394I <Cat.No.161031> SPECIFICATIONS FOR UV LED NICHIA CORPORATION NCSU033B(T) Pb-free Reflow Soldering Application Built-in ESD Protection Device

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Transcription of NCSU033B(T) - Nichia

1 Nichia STS-DA1-2394I < >. Nichia CORPORATION SPECIFICATIONS FOR UV LED. ncsu033b (T). Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant Nichia STS-DA1-2394I < >. SPECIFICATIONS. (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Unit Forward Current IF 700 mA. Pulse Forward Current IFP 1000 mA. Allowable Reverse Current IR 85 mA. Power Dissipation PD W. Operating Temperature Topr -10~85 C. Storage Temperature Tstg -40~100 C. Junction Temperature TJ 130 C. * Absolute Maximum Ratings at TS=25 C. * IFP conditions with pulse width 10ms and duty cycle 10%. (2) Initial Electrical/Optical Characteristics Item Symbol Condition Typ Max Unit Forward Voltage VF IF=500mA - V. Radiant Flux e IF=500mA 450 - mW. Peak Wavelength p IF=500mA 365 - nm Spectrum Half Width IF=500mA - nm Thermal Resistance R JS - C/W. * Characteristics at TS=25 C. * Radiant Flux value as per CIE 127:2007 standard. * R JS is the thermal resistance from the junction to the TS measurement point.

2 * It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics. 1. Nichia STS-DA1-2394I < >. RANKS. Item Rank Min Max Unit H Forward Voltage M V. L P34d22 590 640. P34d21 540 590. P33d22 495 540. Radiant Flux mW. P33d21 455 495. P32d22 415 455. P32d21 380 415. Peak Wavelength Ua 360 370 nm * Ranking at TS=25 C. * Forward Voltage Tolerance: * Radiant Flux Tolerance: 6%. * Peak Wavelength Tolerance: 3nm * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia . 2. Nichia STS-DA1-2394I < >. OUTLINE DIMENSIONS. * RoHS NCSU033x This product complies with RoHS Directive. No. STS-DA7-0454B. ( Unit: ). ( Unit: mm, Tolerance: mm). Item Description . Die Heat Sink . Package Materials Ceramics / . Glass Materials Hard Glass/Kovar . Electrodes Materials Au-plated .. Die Heat Sink Au-plated Cathode Mark Materials . Weight (TYP).

3 Cathode Anode K A.. Protection Device . Die Heat Sink 3. Nichia STS-DA1-2394I < >. SOLDERING. Recommended Reflow Soldering Condition(Lead-free Solder). 1 to 5 C per sec 260 CMax 10sec Max Pre-heat 180 to 200 C. 60sec Max Above 220 C. 120sec Max Recommended Soldering Pad Pattern 7. ( Unit: mm). * This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Repairing should not be done after the LEDs have been soldered. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * The Die Heat Sink should be soldered to customer PCB.

4 If it is difficult or impossible, use high heat-dissipating adhesive. * When soldering, do not apply stress to the LED while the LED is hot. * When using a pick and place machine, choose an appropriate nozzle for this product. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Make sure that there are no issues with the type and amount of solder that is being used. 4. Nichia STS-DA1-2394I < >. PACKAGING - BULK. IC Nxxxxxxx Anti-static IC packs are shipped with desiccants No. STS-DA7-1108B. in heat-sealed moisture-proof bags. IC Label anti-static IC Pack bag . Desiccants UV LED.

5 TYPE Nxxxxxxx **. LOT YMxxxx-RRR. QTY. PCS. RoHS. Seal Nichia CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN. Warning and Explanatory Labels UV LED. Moisture-proof bag LE LED. LED LED RADIATION. D RADIATION.. AVOID. AVOID EXPOSURE. EXPOSURE TO. TO BEAM.. BEAM. E CLAS 3B LED PRODUCT. CLASS LED. 3B LLED . 3B. D . 3B T. S PRODUC.. Moisture-proof bags are packed in cardboard boxes with shock absorbing materials to fill empty spaces. Label UV LED. TYPE Nxxxxxxx **. RANK RRR. QTY. PCS. RoHS. Nichia CORPORATION. 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN. * ** .. ** is the customer part number. Nichia LED If not provided, it will not be indicated on the label. * .. For details, see "LOT NUMBERING CODE". in this document. * IC . Products shipped in anti-static IC packs are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation. * . Do not drop or expose the box to external forces as it may damage the products.

6 * . Do not expose to water. The box is not water-resistant. * . Using the original package material or equivalent in transit is recommended. 5. Nichia STS-DA1-2394I < >. TAPE AND REEL DIMENSIONS. Nxxx033x Tape No. STS-DA7-0181A. 2 4 ( Unit: mm). + -0 12 Cathode 12+ + -0.. Embossed Carrier Tape / Trailer and Leader . Top Cover Tape . Feed Direction 160mm LED 100mm . Trailer 160mm MIN(Empty Pockets) Loaded Pockets Leader with Top Cover Tape 100mm MIN(Empty Pocket). 400mm Leader without Top Cover Tape 400mm MIN. Reel 180+0. -3 1. 13+1. -0. * 1 500 . Reel Size: 500pcs * JIS C 0806 .. 21.. The tape packing method complies with JIS C 0806. 0. 8. (Packaging of Electronic Components on Continuous Tapes). 60+1. -0. * . (10N ) . LED ..2. When the tape is rewound due to work interruptions, 0. 13 . no more than 10N should be applied to the embossed carrier tape.. The LEDs may stick to the top cover tape. Label 6. Nichia STS-DA1-2394I < >. PACKAGING - TAPE & REEL.

7 Nxxxxxxx Reels are shipped with desiccants in heat-sealed moisture-proof bags. No. STS-DA7-1109B. Label . Desiccants Reel UV LED. TYPE Nxxxxxxx **. LOT YMxxxx-RRR. QTY. PCS. RoHS. Seal Nichia CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN. Warning and Explanatory Labels . Moisture-proof Bag UV LED. LE LED. LED LED RADIATION. D RADIATION.. AVOID. AVOID EXPOSURE. EXPOSURE TO. TO BEAM.. BEAM. E CLAS 3B LED PRODUCT. CLASS LED. 3B LLED . 3B. D . 3B T. S PRODUC.. Moisture-proof bags are packed in cardboard boxes with corrugated partitions. Label UV LED. TYPE Nxxxxxxx **. RANK RRR. QTY. PCS. RoHS. Nichia CORPORATION. 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN. * ** .. ** is the customer part number. Nichia LED If not provided, it will not be indicated on the label. * .. For details, see "LOT NUMBERING CODE". in this document. * . Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation.

8 * . Do not drop or expose the box to external forces as it may damage the products. * . Do not expose to water. The box is not water-resistant. * . Using the original package material or equivalent in transit is recommended. 7. Nichia STS-DA1-2394I < >. LOT NUMBERING CODE. Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR. Y - Year Year Y. 2015 F. 2016 G. 2017 H. 2018 I. 2019 J. 2020 K. M - Month Month M Month M. 1 1 7 7. 2 2 8 8. 3 3 9 9. 4 4 10 A. 5 5 11 B. 6 6 12 C. xxxx- Nichia 's Product Number RRR-Ranking by Wavelength, Ranking by Radiant Flux, Ranking by Forward Voltage 8. Nichia STS-DA1-2394I < >. DERATING CHARACTERISTICS. ncsu033b . No. STS-DA7-2588A. - ( )- . Ambient Temperature vs Solder Temperature(Die Heat Sink) vs Allowable Forward Current Allowable Forward Current Derating1 R JA =35 C/W Derating2. 1000 1000. 800 800. (25, 700) (85, 700). Allowable Forward Current(mA). Allowable Forward Current(mA).

9 600 600.. 400 400. (85, 300). 200 200. 0 0. 0 20 40 60 80 100 120 0 20 40 60 80 100 120. ( ). Ambient Temperature( C) Solder Temperature(Die Heat Sink)( C). - . Duty Ratio vs Allowable Forward Current Duty T A =25 C. 10000. Allowable Forward Current(mA).. 1000. 700. 100. 1 10 100.. Duty Ratio(%). 9. Nichia STS-DA1-2394I < >. OPTICAL CHARACTERISTICS. * ncsu033b . All characteristics shown are for reference only and are not guaranteed. No. STS-DA7-2589.. Spectrum TA =25 C. Spectrum IFP=500mA. Relative Emission Intensity( ).. 300 350 400 450 500 550 600.. Wavelength(nm). Directivity1.. Directivity TA =25 C. IFP=500mA. -10 0 10 . -20 20 . -30 30 . -40 40 . -50 50 . Radiation Angle . -60 60 . -70 70 . -80 80 . -90 90 . 1 0 1.. Relative Radiant Intensity( ). 10. Nichia STS-DA1-2394I < >. FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS. * ncsu033b . All characteristics shown are for reference only and are not guaranteed. No.

10 STS-DA7-2590. - - . Forward Voltage vs Ambient Temperature vs VfIf TaVf Forward Current Forward Voltage TA =25 C IFP=500mA. 1000 500. Forward Current(mA). Forward Voltage(V).. 100. 10 -60 -40 -20 0 20 40 60 80 100 120.. Forward Voltage(V) Ambient Temperature( C). - - . Forward Current vs Ambient Temperature vs IfIv TaIv Relative Radiant Flux Relative Radiant Flux IFP=500mA. TA =25 C. Relative Radiant Flux( ). Relative Radiant Flux( ).. 0 200 400 600 800 1000 1200 -60 -40 -20 0 20 40 60 80 100 120.. Forward Current(mA) Ambient Temperature( C). 11. Nichia STS-DA1-2394I < >. FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS. * ncsu033b . No. STS-DA7-2591. All characteristics shown are for reference only and are not guaranteed. - . Forward Current vs Peak Wavelength If D TA =25 C. 371. 369. Peak Wavelength(nm). 367.. 365. 363. 361. 359. 10 100 1000.. Forward Current(mA). - . Ambient Temperature vs Peak Wavelength IFP= 500mA.


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