New Logic Packaging - TI

1 New Logic Packaging4Q 2003 RELIABLE. Logic . INNOVATION. Instruments New Logic PackagingWCSP Introduction (NanoStarTM/NanoFreeTM)NanoStarTMand NanoFreeTMis the smallest industry standardlogic package with proven world-class reliability designed fortoday's high-volume manufacturing environment. TexasInstruments now offers 5, 6, and 8-ball NanoStarTM(YEP/YZP),the smallest single-gate Logic package available. NanoStarTM, achip scaled package technology, is a major breakthrough in ICpackaging concepts, using the die as the package. At mm2,it has a footprint that is 70% smaller than the industry standardSC-70 (DCK) and 13% smaller than any other Logic packageavailable. NanoStarTMpackaging allows manufacturers to placemore functions in a tighter space while improving systemperformance.

2 The end products are smaller sized, more richlyfeatured, portable electronics demanded by consumers. Idealapplications for NanoStarTMLittle Logic include mobile phones,pagers, DVD/CD ROM's, MD/MP3/CD players, VCR's, DVC,Digital STB, DSC, notebook computers, PC cards, and PersonalDigital a ball pitch and package height of NanoStarTM/NanoFreeTMallows designers to easily mount and fit in tight,space constrained Logic Products5-Ball Package6-Ball Package 8-Ball PackageSC-70US8SM85/6/8-Ball WCSP Package 5-Ball Package6-Ball Package8-Ball PackageTexas Instruments New Logic Instruments New Logic PackagingSmall PackageThin PackageLight PackageHigh Reliability/Quality 5 / 6 / 8 - ballTestabilityIndustry's Small Leading PackageFootprint Area (mm2)Max Heights (mm)Weights (g)*JEDEC 1S2P R0ja (c/w) *JESD 51-7 SOT-23 (DBV)SC-70 (DCK)US8 (DCT)SM8 (DCU)NanoStarTM/NanoFreeTM5 (Pins/Balls)

3 (Pins/Balls) (Pins/Balls) (DBV)SC-70 (DCK)US8 (DCT)SM8 (DCU)NanoStarTM/NanoFreeTM5 (Pins/Balls) max6 (Pins/Balls) max8 (Pins/Balls) maxSOT-23 (DBV)SC-70 (DCK)US8 (DCT)SM8 (DCU)NanoStarTM/NanoFreeTM5 (Pins/Balls) (Pins/Balls) (Pins/Balls) (DBV)SC-70(DCK)US8 (DCT)SM8 (DCU)NanoStarTM/NanoFreeTMMoisture Level (msl@250)L1-L2L1-L2L1-L2L1L1 Thermal Performance Theta Ja (c/w) *Solder bumps provideeasy access due to theideal placement of thesolder bumps along theouter edge of the package,probe tips can easily createa dedicated contact to theindividual Instruments New Logic LineLittle Logic product LinesPackage SymbolizationSN74 Standard Prefix: 74= CommercialAHCP roduct families : AHC, AHCT, AUC, CBT, CBTD, CBTLV, LVC1G1G= Single Gate 2G= Dual Gate 3G= Triple Gate00 Logic FunctionYEAP ackage Type: RTape & Reel:R = 3000 pc, T= 250 pc (excepte NanoStarTM/NanoFreeTM)Part Number DefinitionLogics (Gates MSI Octals)SN74 AHC1G FamilySN74 AHCT1G FamilySN74 AUC1G / 2G / 3 GSN74 LVC1G / 2G / 3 GSN74 LVC1G57 / 58 / 97 / 98 CONFIGURABLE MULTIPLE-FUNCTION GATEBus-SwitchSN74 CBT1G FamilySN74 CBTD1G FamilySN74 CBTLV1G FamilyAnalog-SWLVC1G66 / LVC2G66 LVC2G53, LVC1G3157 YMD FF SOY: YearM: MonthD: DayFF: Technology + Function S: Manufacturing Sites O.

4 Pin-1 IDDBV= SOT-23 packageDCK= SC-70 package DCU= US-8 package DCT= SM-8 packagePackage DesignatorsYEP= SnPb YZP= Pb Free *CBT, CBTD, CBTLV offered in lead-frame packages LightTop LightNanoFreeTMSymbol(YZA)NanoStarTMSymb ol(YEA) Instruments New Logic PackagingDevice Information for the NanoStarTM/NanoFreeTMPackageWCSP Package (NanoStarTM/NanoFreeTM)Texas Instruments New Logic ConfigurationWCSP Packaging Tape and Reel (NanoStarTM/NanoFreeTM)Pocket Width, A0(mm)1,10 0,051,10 0,05 Pocket Length, B0(mm)1,60 0,052,10 0,05 Pocket Depth, K0(mm)0,56 0,050,56 0,05 Pocket Pitch, P1(mm)4,0 0,14,0 0,1 Sprocket Hole-to-Pocket Centerline, F (mm)3,50 0,053,50 0,05 Sprocket Hole-to-Pocket Offset, P2(mm)2,0 0,052,0 0,05 Sprocket Hole Pitch, P0(mm)4,00 0,14,00 0,1 Tape Width, W (mm)8,00 0,38,00 0,3 Reel Diameter (mm) Instruments New Logic PackagingQFN IntroductionAdvancing the Logic industry trend towards smaller packagingtechnologies, Texas Instruments (TI) has introduced20 / 16 / 14 pin Quad Flat No-Lead Packaging for gate andoctal bit width Logic devices.

5 The QFN is the smallestquad flat no-lead package establishing the industry standardfor the broadest array of technologies while providingnext generation design solutions. The QFN (RGY)* packagehas the same pin out as the thin-scale small-outline packages(TSSOP), however, it is up to 62% smaller than the to QFN modeling data, thermal performance isimproved up to 55% and electrical performance (inductanceandcapacitance) improved up to 60% and up to 30%,respectively, over the TSSOP package. Designers can takeadvantage of reduced form factors in personal digitalassistants, cell phones, and other portable consumerelectronics by using this LogicQFN FamilyTVSOP(14)TSSOP(20)TSSOP(14)TVSOP(2 0)TSSOP(16)TVSOP(16)QFN14-RGY16-RGY20-RG YT exas Instruments New Logic QFN Package 14-Pin Package16-Pin Package20-Pin Instruments New Logic PackagingSmall PackageThin PackageLight PackageTestabilityWorld's Leading PackageMax Height (mm)weight (g)High Reliability/QualityFootprint Area (mm2)TSSOP (PW)TVSOP (DGV)QFN (RGY)14 (Pins/Balls) (Pins/Balls) (Pins/Balls) (PW)TVSOP (DGV)QFN (RGY)14 (Pins/Balls) (Pins/Balls) (Pins/Balls) (PW)TVSOP (DGV)QFN (RGY)14 (Pins/Balls) (Pins/Balls) (Pins/Balls) (PW)TVSOP (DGV)QFN (RGY)Moisture Level (msl@250)L1L1L2 Thermal Performance Theta Ja (c/w)

6 * *16 Pin RGY *JESD 51-7 Peripheral solder joints may beprobed, and grounded exposedpads can be probed at the side ofthe package where the tie bar hasbeen Instruments New Logic LineQFN product LinesSN74 Standard Prefix: 74= CommercialAHCP roduct families : AHC, AHCT, AUC, ALVC, CBT, CBTLV,PCF, GTLP, LV-A,LVC, LVT, 00 Logic FunctionRGY= QFN -14 RGY= QFN -16 RGY= QFN -20 RDWR / DBR / PWR / DGVR= 2000 pcGQNR= 1000 pcRGYR= 1000 pcPart Number DefinitionLogic (Gates MSI Octals)SN74 ABT/H familySN74 AHC familySN74 AHCT familySN74 ALVC familySN74 AVC familySN74 GTLP familySN74LV-A familySN74 LVC/H familySN74 LVT/H familyBus-SwitchSN74 CBT familySN74 CBTLV familyAnalog-SWSN74LV-A familyI2C-Bus I/O ExpanderPCF familyD, DW= SOICDB= SSOPPW= TSSOP DGV= TVSOPGQN= ~ V2 ~ V ~ V ~ VVCC= V SupportYNYN loff(Power Down)NYYY5 V Tolerant (Input)NYYY5 V Tolerant (Output) nsIOH/IOL24/ 24824/2432/64 ICC (Static)10 A20 A10 A190 ~ V2 ~ ~ VVCC= V SupportNYNloff(Power Down)YNN5 V Tolerant (Input)YYY5 V Tolerant (Output) nsIOH/IOL32/6488 ICC (Static)

7 250 A40 A40 ~ ~ VVCC= V SupportNYloff(Power Down)NY5 V Tolerant (Input)YN5 V Tolerant (Output) nsIOH/IOLN/AN/AICC (Static)3 A10 APackage SymbolizationLSYMY: YearM: MonthDevice: Technology & FunctionS: Sites L: Lot Instruments New Logic PackagingDevice Information for the QFN PackageQFN PackageTexas Instruments New Logic PackageDevice Information for the QFN Instruments New Logic PackagingQFN PackageDevice Information for the QFN PackageTexas Instruments New Logic Packaging Tape and Instruments New Logic PackagingBGA IntroductionIn support of customer demand and the industry's trend towardsmaller, more compact designs, Texas Instruments (TI ), PhilipsSemiconductors and IDT (Integrated Device Technology, Inc.)have agreed to source Logic devices with the same functionalityand pin-outs (JEDEC Standard No.)

8 75, JESD75) in aspace - saving, low-profile, fine-pitch ball grid array (LFBGA )package. The ball grid array package reduces board space byincreasing I /O density while offering the broadest portfolio oflogic technologies. These JEDEC-approved (JC-11 Committee,MO-205) LFBGA and VFBGA packages mark the firstimplementation of BGA Packaging in Logic 96 BGA offers a one chip Vs two chipadvantage for widebus functions. By usingthe 96-GKE users will save over 50%.BGA LogicBGA FamilyMicroStar JuniorTMBGAM icroStar BGATM20-GQN56-GQL96-GKE114-GKFTVSOP(48)T SSOP(20)TSSOP(48)TVSOP(20)TVSOP(56)TSSOP (56)48 TSSOP48 TSSOP96 -GKET exas Instruments New Logic Package 56-Ball Package114-Ball Package96-Ball Package20-Ball Package48-Ball Package (8-Ball NC)Small PackageThin PackageLight PackageHigh Reliability/QualityMicroStar BGA - One Chip SolutionBGA PackagingFootprint Area (mm2)TSSOP (PW/DGG)TVSOP (DGV)MicroStar JuniorTMBGA20 (Pins/Balls) (Pins/Balls) (mm)48 DGG96 -GKEThe 96-ball GKE offers a single chipsolution for Widebus functions providingover a 50% board savings vs.

9 The two48-pin (PW/DGG)TVSOP (DGV)MicroStar JuniorTMBGA20 (Pins/Balls) (Pins/Balls) (PW/DGG)TVSOP (DGV)MicroStar JuniorTMBGA20 (Pins/Balls) (Pins/Balls) (PW/DGG)TVSOP (DGV)MicroStar JuniorTMBGAM oisture LevelL1L1L2 Thermal Performance Instruments New Logic Packaging *JESD 51-7 product LineBGA product LinesPackage SymbolizationSN74 Standard Prefix: 74= CommercialAHCP roduct families : ALVC, CBT, LVC 245 Logic FunctionGQLP ackage Type: RTape & Reel: R = 3000 pc, T= 250 pcPart Number DefinitionLogics(Gates MSI Octals)SN74 ALVC32xxx SN74 CBT32xxxSN74 LVC32xxxGQN= 20-ball BGAGQL= 56-ball BGAGKE= 96-ball BGAGKF= 114-ball BGAY: YearM: MonthDevice: Technology & FunctionS: Sites L: Lot codeDeviceLSYMT exas Instruments New Logic Instruments New Logic PackagingDevice Information for the BGA PackageBGA PackageTexas Instruments New Logic PackageDevice Information for the BGA Instruments New Logic PackagingDevice Information for the BGA PackageBGA PackageTexas Instruments New Logic Packaging Tape and ReelTI Worldwide Technical SupportInternetTI Semiconductor product InformationCenter Home Semiconductor KnowledgeBase Information CentersAmericasPhone+1(972) 644-5580 Fax+1(972) 927-6377 Internet , Middle East, and AfricaPhoneBelgium (English)+32 (0) 27 45 55 32 France (English)+358 (0) 9 25173948 France+33 (0) 1 30 70 11 64 Germany+49 (0) 8161 80 33 11 Israel (English)1800 949 0107 Italy800 79 11 37 Netherlands (English)+31 (0) 546 87 95 45 Spain+34 902 35 40 28 Sweden (English)+46 (0)

10 8587 555 22 United Kingdom+44 (0) 1604 66 33 99 Fax+49 (0) 8161 80 +81-3-3344-5317 Domestic0120-81-0036 Internet /EmailInternational Logic . Innovation. ; the black/red banner istrademark of Texas Notice:The products and services of Texas Instruments andits subsidiaries described herein are sold subject to TI s standard termsand conditions of sale. Customers are advised to obtain the most currentand complete information about TI products and services before placingorders. TI assumes no liability for applications assistance, customer sapplications or product designs, software performance, or infringementof patents. The publication of information regarding any other company sproducts or services does not constitute TI s approval, warranty orendorsement thereof.