NIKAPLEX - nikkan-ind.co.jp

1 NIKAPLEX . Glass epoxy ( ). L- C . W - Sided copper clad Laminates [ UV L-6504C2 UV ]. W - sided copper clad Laminates of UV shielding type:L-6504C2 UV. L- C . S - Sided copper clad Laminates P- . Prepreg Glass fabric base epoxy resin copper - clad laminates,prepreg ( ). Characteristic Use applications For industrial equipment Good Electrical properties and mechanical strength . For automotive components For amusement components Excellent dimensional stability. OA For office automation equipment,others Specification copper clad laminates Thickness tolerance .. Products Standard size ( Lw Cw ) copper foil thickness Nominal thickness W / S - sided CCL For multi-layer CCL. 12 m 18 m +10 +10 35 m 70 m L-6504C2 1,020 1,020 mm - 0 - 0 105 m 140 m 175 m 210 m 18 m L-6504C1 1,020. +10. 1,220. +10. mm 35 m - 0 - 0 - 70 m - The nominal thickness of less than thickness does not include the copper foil thickness. Please contact us separately concerning the thickness of the other than the above.

2 Prepreg mm 1 mm 2. Products Type Nominal thickness Glass croth Resin content Resin flow Gel time Volatile matter Theoretical thickness 0565 1080 65 3 50 5 140 30 1053 2116 53 3 35 5 140 30 1550 1501 50 2 30 5 140 30 P-6504. 1844 7628 44 2 27 5 140 30 1850 7628 50 2 35 5 120 30 1852 7628 52 2 35 5 120 30 1 IPC It is a IPC style. 2 0 In the case of the resin flow is 0%. Properties . Item Treatment Unit Actual value 10 /min Tg TMA Heating rate:10 /min 130. Glass transition temp DSC 20 /min Heating rate:20 /min 130. X 1 ppm/ 17. Y 1 ppm/ 13. TMA. Coefficient of thermal expantion 1 ppm/ 55. Z. 2 ppm/ 285. Td TG/DTA 5 ) 20 /min Decomposition temp (5% weight loss) Heating rate:20 /min 330. Thermal conductivity LF Laser flash method A W/(m K) Specific heat capacity LF Laser flash method A J/(g K) 260 Solder heat resistance at 260 A sec. 120. T288 Time to delamination TMA TMA min 10. A 18 m S4 N/mm Peel strength A 35 m S4 Flexural strength Lw / Cw A MPa 530 / 465. Flexural modulus Lw / Cw A GPa 20 / 18.

3 1 MHz - C-96/20/65. Dielectric constant (Dk) 1GH 1 MHz - C-96/20/65. Disspation factor (Df) 1GH Volume resistivity C-96/20/65 M m 1 108. Surface resistance C-96/20/65 M 1 109. Insulation resistance C-96/20/65 M 1 109. (CTI ) Comparative tracking index (CTI) A V 175. Water absorption E-24/50 + D-24/23 3 NaOH Alkali resistance(3% NaoH aq) 40 /3min . Dip No remarkable change UV UV UV-35 A UV transmittance of UV shieldeing type UV-42 A UL94 Flammability UL94 E-24/125 94V-0. JIS C 6481 IPC TM650 IEC-60112 UL . *1 The abobe tests are in accordance with JIS C6481, IPC TM650, IEC-60112, and UL.. *2 The sample thickness is *3 The abobe data is actual values and not guaranteed values. L-6504C/P-6504. P-6504 Standard press program of P-6504. 120 . Vacuum:Until the products temp. reaches 120 .. Program of temp. Molding pressuer MPa . MPa .. Temp.. 160 50 . Hold time of product temp. : at least 50 above 160 . Product temp. /min. The heating rate of products temp.:about /min . Molding pressure Molding 70 100.

4 Pressurization timing:at the products temp. is 70 100 . min . Molding time min . 1 4 10 / . 1 Press composition : of 4layer 10set/1step 2 . 2 Above condition is affected by jig, cushion, products thichness. Please really confirm it on the occasion of use.