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1 reliability Handbook UG-311 One Technology Way P. O . Box 9106 norwood , MA 02062-9106, Tel: Fax: reliability Handbook INTRODUCTION Analog Devices, Inc., would like to thank its customers for making Analog Devices a leading supplier of high quality LSI, VLSI, and ULSI integrated circuits by choosing its products for their design solutions. Analog Devices products are innovative and leading edge from a design perspective. In addition, based on Analog Devices reliability data, they are exceptionally robust and meet industry standards due to their high reliability . The broad range of applications of integrated circuit technology has driven Analog Devices customers IC quality and reliability requirements to extremely high levels, and Analog Devices has met these challenges.

2 With an extensive variety of programs to ensure high quality and reliability , Analog Devices meets the existing and emerging needs of customers in the true spirit of total quality management (TQM). This reliability Handbook introduces customers and potential customers to the research, technological developments, quality/ reliability philosophy, and programs employed by Analog Devices. We hope readers find it informative and that the manual becomes a standard reference they find helpful should they wish to set up similar procedures. Analog Devices reserves the right to modify this handbook at any time. This handbook is published as a reference guide and is in no way to be interpreted as a guarantee that certain products meet the criteria defined here.

3 For specific information regarding dedicated products, refer to the applicable data specification sheet. BATHTUB CURVEUSEFUL LIFEYEARS AFTER SHIPMENTSTEADY STATERETURN RATERETURN RATE (MTBR)USEFUL LIFE ENDS WHEN FAILURE RATE STARTSTO INCREASE DUE TO WEAR-OUT FAILURESWEAR-OUTEARLY LIFE10137-101 Figure 1. Bathtub Curve PLEASE SEE THE LAST PAGE FOR AN IMPORTANT WARNING AND LEGAL TERMS AND CONDITIONS. Rev. D | Page 1 of 110 UG-311 reliability Handbook TABLE OF CONTENTS Introduction .. 1 Revision History .. 3 Overview .. 4 Purpose .. 4 Analog Devices reliability Charter .. 4 New Product Philosophy .. 6 Introduction .. 6 Feasibility .. 7 Implementation .. 8 Wafer Fabrication Phase .. 8 Design Validation .. 8 Test Validation Phase.

4 8 Release Phase .. 8 Qualification 9 Test Generation Method .. 10 Product reliability Monitoring and Prediction .. 11 Introduction .. 11 Product/Process reliability .. 11 reliability Goals .. 11 Product reliability Stressing .. 11 reliability Testing at Analog 12 Device Testing .. 13 Te m perature Acceleration .. 13 Voltage Acceleration .. 14 Sample Failure Rate 14 Weibull Distribution .. 16 Normal Distribution .. 17 Log-Normal Distribution .. 17 Autoclave .. 18 Temperature Humidity Bias (85 C/85%RH) .. 18 Highly Accelerated Stress Testing .. 19 Temperature Cycle .. 20 High Temperature Storage .. 21 Low Temperature Storage .. 21 Low Temperature Operating Life .. 21 reliability Monitoring Program .. 21 Wafer Fabrication Process Families.

5 21 Assembly Package Families .. 21 Sample Plans .. 22 Process reliability .. 23 Introduction .. 23 BIR Monitors .. 23 Building in reliability (BIR) .. 23 Time-Dependent Dielectric Breakdown (TBBD) .. 23 Background Theory .. 24 Test Structures/Devices .. 24 Equipment .. 24 Test Conditions .. 25 Data Analysis/Modeling .. 25 26 Testing Methodology .. 27 Process Monitor Results .. 27 EM Testing and Analysis .. 28 MOS Hot Carrier Injection .. 29 Test Method .. 30 Lifetime Prediction .. 30 Data Analysis .. 30 DMOS Hot Carrier Injection .. 31 DMOS Characterization .. 31 Rule of Thumb .. 32 Bipolar Hot Carriers .. 32 Test Method .. 32 Bipolar Lifetime Calculation .. 33 Stress Migration .. 34 Process Background Theory .. 34 Stress Migration Testing and Analysis.

6 35 35 Circuit Impact .. 35 Why Now? .. 36 What is the NBTI Mechanism? .. 36 reliability Stress Test Method .. 37 Managing NBTI at Device Level .. 39 The Future for Bias Temperature Stress .. 39 High Voltage Endurance .. 39 Background Theory .. 39 Data Analysis .. 40 Details on Building in reliability .. 41 Summary .. 46 Rev. D | Page 2 of 110 reliability Handbook UG-311 Package reliability .. 47 Introduction .. 47 Thermal Issues .. 47 reliability Implications .. 47 Derating Factor .. 49 Enhancing The Heat Dissipation .. 50 Similarities Between Manufacturers .. 51 Effect of Component Mounting on Thermal Resistance .. 51 Socket vs. Board Mounting .. 51 Thermal Gap Fillers .. 51 Component Selection .. 51 Forced Air Cooling and Heat Sinks.

7 52 Board Construction and Mounting .. 52 Moisture Effects .. 53 Additional Moisture-Related Failure Mechanisms .. 57 Stress Migration .. 59 Thermal-Induced Gold Wire Failure .. 59 Package Cracking .. 60 Thin Film Cracking and Wire Bond Failures .. 60 Nature of the Forces .. 61 Wire Bond 62 Thin Film Cracking .. 63 Board-Level reliability .. 65 Introduction .. 65 Solder Joint reliability .. 65 Mechanical Shock/Drop Test .. 66 PCB Bend Test .. 67 Vi b r a t i o n Te s t .. 69 Summary .. 70 MEMS reliability .. 71 MEMS Failure Mechanisms .. 71 Qualification Planning .. 74 MEMS reliability Tests .. 74 Summary .. 76 Electrical Overstress .. 77 Introduction .. 77 ESD 77 ESD Models/Test Methods .. 77 Importance of Understanding Pin Combinations Zapped.

8 79 Charged Device Model (CDM) .. 81 Analog Devices Targets for ESD Robustness .. 83 ESD Failure Modes and Failure 84 Board-Level and System-Level EOS/ESD Protection .. 88 Summary .. 92 Product Analysis .. 93 Introduction .. 93 Definitions .. 93 Sources of Failure .. 93 Customer Returns Procedure .. 93 Internal Product Analysis Requests .. 94 Product Analysis Tracking .. 94 Product Analysis Sequence .. 94 Product Analysis 95 Background Information .. 96 Current and Future Expectations for reliability .. 105 Introduction .. 105 Bibliography .. 106 REVISION HISTORY 11/14 Rev. C to Rev. D C h a ng e s t o Voltage Acceleration Section .. 14 Changes to Sample Failure Rate Calculation Section .. 15 Added MEMS reliability Section and Figure 96 to Figure 101; Renumbered Sequentially.

9 71 Changes to Human Body Model (HBM) Section .. 77 Changes to Importance of Understanding Pin Combinations Zapped Section .. 79 Changes to Charged Device Model (CDM) Section .. 81 Changes to Board-Level and System-Level EOS/ESD Protection Section .. 88 Changes to Bibliography Section ..110 1/ 13 Rev. B to Rev. C Updated Format .. Universal Reorganized Layout .. Universal Modified Existing and Added New Sections, Tables, and Figures .. Universal Rev. D | Page 3 of 110 UG-311 reliability Handbook OVERVIEW PURPOSE This document focuses on the activities and criteria that Analog Devices uses to produce very reliable and high quality products that meet customers requirements. This document is also designed to convey the embedded philosophies on quality and reliability that are embodied in every step of the manufacturing process and in all personnel.

10 Also discussed is Analog Devices commitment to customer needs and its quest for excellence through continuous improvement at all levels in the design, manufacturing, and support areas of the compa ny. Using the Bibliography A Bibliography section is found at the end of this handbook. Numbers in square brackets, such as [1 8], indicate references to major topics in reliability . Keeping with this example, [1 8] when seen in the text indicates that references 1 through 8 in the bibliography provide more information on the subject under discussion. ANALOG DEVICES reliability CHARTER Analog Devices has always placed the highest emphasis on delivering products that meet the customer s total requirements and, as a result, generate complete customer satisfaction critical for success and survival in today s integrated circuit industry.