Open Loop Phase Control Circuit - SP-Elektroniikka

1 U208 BTELEFUNKEN SemiconductorsRev. A1, 28-May-961 (7) open Loop Phase Control CircuitDescriptionThe integrated Circuit , U208B, is designed as a Phase con-trol Circuit in bipolar technology with internalsupply-voltage monitoring. As the voltage is built up, un-controlled output pulses are avoided by internalmonitoring. Furthermore, it has internal-current and volt-age synchronisation. It is recommended as a low costopen-loop retriggeringDTriggering pulse typ. 125 mADVoltage and current synchronisationDInternal supply voltage monitoringDCurrent requirement mAPackage: DIP8 Block Diagram236N95 11224R3220 kW/R4470 kW/ VS10 nFGNDC122 mF/25 VR7180 WMR118 kW/BYT77D12 WTICLNVM =230 V ~SupplyvoltagelimitationOutputpulsePhase Control unit521 VoltagedetectorAutomaticretriggering783= f (V6)C2100 WR2180 kWR618 kWR5120 kW46 Figure 1. Block diagram for simple Phase Control systemU208 BTELEFUNKEN SemiconductorsRev.

2 A1, 28-May-962 (7)DescriptionMains SupplyThe U208B is fitted with voltage limiting and can there-fore be supplied directly from the mains. The supplyvoltage between Pin 1 (+ pol/ ) and Pin 2 builds upacross D1 and R1 and is smoothed by C1. The value of theseries resistance can be approximated using figure 1:R1+VM VS2 ISFurther information regarding the design of the mainssupply can be found in the data sheets in the using an externally stabilized DC voltage is the supply cannot be taken directly from the mainsbecause the power dissipation in R1 would be too large,then the Circuit shown in the following figure 2 should V~~95 10362 Figure 2. Supply voltage for high current requirementsPhase ControlThe function of the Phase Control is largely identical tothat of the well known component TEA1007. The phaseangle of the trigger pulse is derived by comparing theramp voltage, which is mains synchronized by the voltagedetector, with the nominal value predetermined at thecontrol input Pin 6.

3 The slope of the ramp is determinedby C2 and its charging current. The charging current canbe varied using R2 on Pin 4. The maximum Phase angleamax can also be adjusted using the potential on Pin 5 reaches the given value ofPin 6, then a trigger pulse is generated whose width tp isdetermined by the value of C2 (the value of C2 and hencethe pulse width can be evaluated by assuming 8 ms/nF).The current sensor on Pin 8 ensures that, for operationwith inductive loads, no pulse will be generated in a newhalf cycle as long as the current from the previous halfcycle is still flowing in the opposite direction to the sup-ply voltage at that instant. This makes sure that Gaps inthe load current are prevented. The Control signal on Pin6 can be in the range 0 V to 7 V (reference point Pin 1).If Vpin6 = 7 V then the Phase angle is at maximum = , the current flow angle is a minimum. The minimumphase angle amin is when Vpin6 = MonitoringAs the voltage is built up, uncontrolled output pulses areavoided by internal voltage surveillance.

4 At the sametime, all of the latches in the Circuit are reset. Used witha switching hysteresis of 300 mV, this system guaranteesdefined start up behavior each time the supply voltage isswitched on ,or after short interruptions of the Output StageThe pulse output stage is short Circuit protected and cantypically deliver currents of 125 mA. For the design ofsmaller triggering currents, the function IGT = f (RGT) hasbeen given in the data sheets in the appendix. In contrastto the TEA1007, the pulse output stage of the U 208 B hasno gate bypass RetriggeringThe automatic retriggering prevents half cycles withoutcurrent flow, even if the triacs is turned off earlier dueto a collector which is not exactly centered (brush lifter)or in the event of unsuccessful triggering. If it is neces-sary, another triggering pulse is generated after a timelapse of tpp = tp and this is repeated until either thetriac fires or the half cycle SemiconductorsRev.

5 A1, 28-May-963 (7)General Hints and Explanation of TermsTo ensure safe and trouble free operation, the followingpoints should be taken into consideration when circuitsare being constructed or in the design of printed connecting lines from C2 to Pin 5 and Pin 1 shouldbe as short as possible, and the connection to Pin 1should not carry any additional high current such the load selecting C2, a low temperature coefficient 10716 VVGTVLILp/2p3/2p2ptptpp = tpMainsSupplyTriggerPulseLoadVoltageLoad Current FFigure 3. Explanation of terms in Phase relationshipAbsolute Maximum RatingsReference point Pin 1, unless otherwise specifiedParametersSymbolValueUnitCurren t requirementPin 2 IS30mAqt 10 ms is100 Synchronisation currentPin 8 Pin 7t < 10 msPin 8t < 10 msPin 7 IsyncIIsyncV"iI"iV553535mAPhase controlInput voltagePin 6 Input currentPin 6 Pin 4 VI"IIII0 to 75001 VmAmAPower dissipationTamb = 45 CTamb = 80 CPtot530300mWStorage temperature rangeTstg 40 to +125 CJunction temperatureTj125 CAmbient temperature rangeTamb 10 to +100 CU208 BTELEFUNKEN SemiconductorsRev.

6 A1, 28-May-964 (7)Thermal ResistanceParametersSymbolValueUnitJunct ion ambientDlP8SO8: on boardSO8: on ceramicRthJA120220140K/WElectrical Characteristics VS = V, Tamb = 25 C, reference point pin 1, unless otherwise specifiedParametersTest Conditions / voltage for mainsoperationsPin 2 voltage limitation IS = 3 mAPin 2 IS = 30 mA supply current VS = 13 VPin 2 monitoringTurn-on thresholdPin 2 thresholdPin 2 Control currentsCurrent synchronisationPin synchronisationPin limitation"II = 5 mAPin 8 Pin 7"VI" rampfigure 4 Load currentIS = f(R4)Pin 5I5120mAR -reference voltagePin 4, 2V coefficientPin 4 TCV Ref outputOutput pulse currentR7= 0, VGT = VPin 3Io100125150mAReverse currentPin pulse widthC = 10 nFPin 5-1tp80msAutomatic retriggeringRepetition ratePin 3, SemiconductorsRev. A1, 28-May-965 (7) Angle ( )R ( MW ) 10302a ControlReference Point Pin /t= Figure 4. 03 6 9 12012346P ( W )(R1)Itot ( mA )1595 10317 Mains Supply5 Figure 5.

7 Design Calculations for Mains SupplyThe following equations can be used for evaluating theseries resistor R1 for worst case conditions:R1max+ VMmin VSmax2 ItotR1min+VMmax VMmin2 ISmaxP(R1max)+(VMmax VSmin)22R1where:VM= Mains voltageVS= Supply voltage on Pin 4 Itot= Total DC current requirement of the Circuit =IS + Ip + IxIS= Current requirement of the IC in mAIp= Average current requirement of the triggering pulsesIx= Current requirement of other peripheral componentsR1 can be easily evaluated from figures 6 and 80102030R1 ( kW )4095 10316 Mains Supply012346P ( W )(R1)5 Figure 6. 0200400600800020406080100I ( mA )GTRGT ( W )100095 10313 Pulse OutputVGT = 7. 0481201020304050R ( k )1 Itot ( mA )1695 10315 WMains SupplyFigure 8. U208 BTELEFUNKEN SemiconductorsRev. A1, 28-May-966 (7)Application87651234U208 BMR1518 WR4470 kWD11N4004220 nF/63 V1 mF/25 VC3R547 kW100 kWR6150 kWR2470 kW22 mF/25 VC1LN230 V~95 11225 TIC236 NFigure 9.

8 Phase Control (power Control ) for electric toolsDimensions in mmPackage: DIP894 8873U208 BTELEFUNKEN SemiconductorsRev. A1, 28-May-967 (7)Ozone Depleting Substances Policy StatementIt is the policy of TEMIC TELEFUNKEN microelectronic GmbH to1. Meet all present and future national and international statutory Regularly and continuously improve the performance of our products, processes, distribution and operating systemswith respect to their impact on the health and safety of our employees and the public, as well as their impact onthe is particular concern to Control or eliminate releases of those substances into the atmosphere which are known asozone depleting substances ( ODSs ).The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs andforbid their use within the next ten years. Various national and international initiatives are pressing for an earlier banon these TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy ofcontinuous improvements to eliminate the use of ODSs listed in the following Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.

9 Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency ( EPA ) in the USA3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) can certify that our semiconductors are not manufactured with ozone depleting substances and do not containsuch reserve the right to make changes to improve technical design and may do so without further can vary in different applications. All operating parameters must be validated for each customerapplication by the customer. Should the buyer use TEMIC products for any unintended or unauthorizedapplication, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,directly or indirectly, any claim of personal damage, injury or death associated with such unintended orunauthorized TELEFUNKEN microelectronic GmbH, 3535, D-74025 Heilbronn, GermanyTelephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423