PCB 生產流程 PCB Process Flow Chart - CIRCUITECH

1 PCB PCB Process Flow Chart :2015/08/01 PCB Process Flow ChartPCB Process Flow Chart Final Inspection Shipping Packing Silk Legend Surface metalized Test O/S Router Solder Mask Drilling Dry Film Image Transfer PTH &AOII nspection PatternPlating Material releasing Inner Layer Trace A O I Lamination Pre-EngineeringCircuitech Precision Electronics, Inc. Pre-Engineering Process Flow ChartOP , , .CAM: OP Checking Gerber of customer under PCB processes capability and create suitable processes flow Chart with spec for production line : Uses Gerber file of customer to edit working panel tools for PCB processes, including artwork film and NC program.

2 Detail processes flowOPCAM Key Stage Original GerbercheckingOP Create OP CAM CAM edition NC drillingchecking Net list program VRS programV-CUT Create V-cut drawing Artwork inspection Original GerberCAM CAM edition Release DFM Create NC drilling program scan Artwork scanningCNC Create CNC routing program Create outline drawingCAM CAM workstation Protective film lamination Artwork developer Plotter Film inspector Artwork inspector Material Management Process Flow Chart Material Management: As OP instruction, cut material into suitable working panel size and release toInner layer or drilling Process .

3 Detail processes flow Material incoming & Material releasing Key Stage Material application Material incoming Inspection Material releasing Cutting In store Diamond saw machine Grind machine Round corner machine Inner Layer Process Flow Chart Inner Layer Coating the film of photosensitive ink by roller on the CCL surface, transfer the pattern onCCL with UV light through artwork film, like photo; then have the development, etching and striping stage to finish whole Process .

4 Detail processes flow Film coating / Exposure/EtchingAOI Key Stage Pre-treatment Coating ink Curing Pre-treatment Roller Coating Exposure AOICCD Drill Tooling Holes EtchingCCD Drill tooling holes AOI VRS Exposure Developing Acid etching Striping Lamination Process Flow Chart ( ) Lamination Press Put inner layer, prepreg and copper foil together as stack up construction, then press them through high temperature and pressure to becoming CCL . Detail processes flow Brown Oxidation Stack up Lamination press Key Stage Acid cleaning Cleaner Pre-dip Brownoxidation BakingPP PP CuttingPP PP drilling Stack up Auto Alignment Welding Hot press Cool press UnloadingX-RAY X-ray drillCNC CNC Routing Brown Oxidation Auto Alignment Welding Stack Up PressX-RAY X-RAY drillCNC CNC Routing Drilling Process Flow Chart Drilling As NC program in the Gerber file.

5 Drill all holes for through holes copper plating purpose toconnect each layers as customer s design. Detail processes flow Drilling Laser Drilling Key Stage PINS tack pinning Drilling AOI HoleAOI PINDe-pinning Drilling Unloading Loading AOI10 Low RPM Drilling16 High RPM DrillingX-RAY X-RAY checking Hole Inspector Laser via AOI20 High RPM DrillingX-RAY X-Ray AOIHole AOI Panel Plating Process Flow Chart Panel Plating De-smear first to remove resin residues on holes wall by chemical.

6 Following by electricless for copper metal deposition then doing electric copper plating again to get around mils of copper conductive thickness ; purpose is to let each layer connection. Detail processes flow / De-burr /Immersion Copper Panel plating Automatic grinding machine Key Stage Fluffy Permanganate Counteraction Conditional Pre-dip Activation Electroless copper Loading Brushing Air-blowing Acid dip P T H Rinse Holeplating Micro-etching Rapid De-smear PTH VCP Holeplating Automatic grinding De-burr VCP Hole Inspector Dry Film Process Flow Chart PC Dry Film Press dry film (a sensitive material)

7 On multilayer CCL. Make external layer pattern by UV light through artwork, similar inner layer Process ; next developed by alkaline solution to remove dry film for copper pattern plating. Detail processes flow Pre-treatment Exposure Key Stage Acid cleaning Rinse Brushing Rinse Exposure Press film Rinse Developing Air-blowing Developing Air-blowing Pre-treatment Exposure AOI Press film Developing LDI Pattern Plating Process Flow Chart PC Pattern Plating Increasing external layer pattern conductive thickness through electric copper plating, up to the spec as customer s design and request.

8 Detail processes flow Pattern Plating Etching Key Stage De-grease Micro-etching Pre-dip Electriccopper plating Pure Tin plating Acid-dip Alkaline etching Dry film strip Air-blowing Tin strip Pattern Plating Line width measuring TDR Inspection Etching/Stripping AOI Solder Mask Process Flow Chart PCB PCB Solder Mask Coating solder mask by silkscreen printing on bare PCB; solder mask is one kind of sensitive ink, will form a sensitive film after low temperature pre-curing.

9 Next by photo method with high power UV light to do initial curing, except partial selective pads or holes designed for assembly and solder mask on those selective pads or holes will be removed by alkaline solution under developing, following baking again to do final curing for hardness increasing to protect the pattern. Detail processes flow Pre-treatment Printing Key Stage Loading Brushing Rinse Printing Pre-curing Stencil Exposure Developing Post-curing Developing Air-blowing Pre-treatment Printing Post-Curing Developing Stencil Exposure Hot Air Solder Leveling Process Flow Chart / / / Surface metalized HASL / Lead Free HASL / Chemical Gold / ImmersionGold Detail processes flow Surface metalized Key Stage Loading Surface metalized Visual inspection HASL Lead Free HASL Immersion Gold Chemical Gold

10 Legend Printing Process Flow Chart PCB Legend Printing Print component marks including certain serial numbers on PCB by screen, as customer s design. Detail processes flow Legend Printing Key Stage Stencil Printing Baking Legend PrintingUV UV Curing Stencil Baking Legend Printing Routing Process Flow Chart PCB V-CUT V-CUT PCB CNC Routing Cut out the outline dimension of PCB by NC router machine with router bit or punch machine with punch die, as per customer s design or Pre-cut a line on both sides of PCB, between piece to piece or piece to breakaway tab.