顯像型防焊油墨 Photoimageable Solder Resist Ink

1 - 16 - IPC-SM-840C Class T & Class H COMPLY WITH IPC-SM-840C Class T & Class H Property Test Method Requirement Test result Resistance to Solder (J-STD-004 : M , J-STD-006 : Sn60 Sn63 ) 5 260 5 C 10 1 After flux coated, hold at ambient temperature for 5 minutes, preheat and Solder float at 260 5 C for 10 1 seconds. Solder shall not adhere to the Solder mask. PASSED / Hydrolytic stability/Aging IPC-TM-650 97 2 C 90-98%RH 28.

2 97 2 C 90-98%RH 28 days. No irreversible change of state. PASSED Dielectric Strength IPC-TM-650 Determined in accordance with of IPC-TM-650 mm [ inch] 500 VDC Minimum value of 500 VDC per mm [ inch] of thickness. PASSED Insulation Resistance IPC-TM-650 Minimum resistance of show before and after soldering. IPC-B-25 B 5 108 . Minimum 5 108 . IPC-B-25 test pattern B. Before soldering 1013 After soldering 1012 Thermal Shock IPC-TM-650 -65 C /15 ~125 C /15 100 -65 C 15 min +125 C 15 min, 100 cycles.

3 No blistering, crazing or delamination. PASSED IPC-SM-840C Class H COMPLY WITH IPC-SM-840C Class H Property Test Method Requirement Test Result Flammability UL-94 V UL-94 flammability. UL-94 V UL-94 V number shall not be raised. 94 V-0 Moisture and Insulation Resistance IPC-TM-650 25-65 C 85%RH 50 VDC 100 VDC 6 2/3 25-65 C 85%RH Cycling 6 2/3 days Bias voltage 50 VDC and Test voltage 100 VDC. IPC-B-25 B 5 108 at 500 VDC.

4 Minimum 5 108 at 500 VDC. IPC-B-25 test pattern B. Initial 1013 After Treatment 1012 Electrochemical migration IPC-TM-650 85 2 C 90%RH 10 VDC 10 VDC 168 85 2 C 90%RH 168 hours. Bias voltage 10 VDC and Test voltage 10 VDC. 2M None allowed visually >2M resistance PASSED Photoimageable Solder Resist Ink