Example: dental hygienist

Physics of Advanced CMOS VLSI Dennis Buss Texas ...

Dennis BussTexas instruments , , Texas USAP hysics of Advanced cmos VLSIP hysics of Advanced cmos VLSIC onclusions For the past 35 years, transistors have been developed using Electrical Engineering Physics , which was codified in the early 60 s As the industry approaches the End of Roadmap , Electrical Engineering Physics is no longer sufficient. Technology development increasingly requires Sophisticated quantum Physics Non-equilibrium Boltzmann transport Material science at the atomic and electron orbital level This has implications for Physics education Career opportunities for physicists in the semiconductor industry For the past 35 years, transistors have been developed using Electrical Engineering Physics , which was codified in the early 60 s As the industry approaches the End of Roadmap , Electrical Engineering Physics is no longer sufficient. Technology development increasingly requires Sophisticated quantum Physics Non-equilibrium Boltzmann transport Material science at the atomic and electron orbital level This has implications for Physics education Career opportunities for physicists in the semiconductor industryAgenda Introduction to cmos vlsi Technology Physics challenges to continued vlsi scaling Conclusion Introduction to cmos vlsi Technology Physics challenges to continued vlsi scaling ConclusionUS Patent # 3,138,743 Filed Feb.

Dennis Buss Texas Instruments, Inc. Dallas, Texas USA Physics of Advanced CMOS VLSI. Conclusions ... Introduction to CMOS VLSI Technology ... Scaling CMOS to the “End of Roadmap” will require sophisticated condensed matter physics.

Tags:

  Texas, Instruments, Subs, Dallas, Cmos, Vlsi, Cmos vlsi, Buss texas instruments

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Transcription of Physics of Advanced CMOS VLSI Dennis Buss Texas ...

1 Dennis BussTexas instruments , , Texas USAP hysics of Advanced cmos VLSIP hysics of Advanced cmos VLSIC onclusions For the past 35 years, transistors have been developed using Electrical Engineering Physics , which was codified in the early 60 s As the industry approaches the End of Roadmap , Electrical Engineering Physics is no longer sufficient. Technology development increasingly requires Sophisticated quantum Physics Non-equilibrium Boltzmann transport Material science at the atomic and electron orbital level This has implications for Physics education Career opportunities for physicists in the semiconductor industry For the past 35 years, transistors have been developed using Electrical Engineering Physics , which was codified in the early 60 s As the industry approaches the End of Roadmap , Electrical Engineering Physics is no longer sufficient. Technology development increasingly requires Sophisticated quantum Physics Non-equilibrium Boltzmann transport Material science at the atomic and electron orbital level This has implications for Physics education Career opportunities for physicists in the semiconductor industryAgenda Introduction to cmos vlsi Technology Physics challenges to continued vlsi scaling Conclusion Introduction to cmos vlsi Technology Physics challenges to continued vlsi scaling ConclusionUS Patent # 3,138,743 Filed Feb.

2 6, 1959 Integrated Circuit 1958 SiO21200 AGate LengthOxide ThicknessGate MaterialJunction DepthInterconnectMask LevelsGate LengthOxide ThicknessGate MaterialJunction DepthInterconnectMask LevelsMOS ScalingLate 60'sLate 60'sLate 60's2000200010 m120 mAl510 m120 mAl5120 nm12 Apoly-Si25/70 nmCu25 - 35120 nm12 Apoly-Si25/70 nmCu25 - 35 Metal Gate10 m1200 mModern CMOSM odern CMOSB eginning ofSubmicron CMOSB eginning ofSubmicron CMOSDeep UV LithoDeep UV Litho90 nm in 200490 nm in 2004 Presumed Limitto ScalingPresumed Limitto ScalingMoore's Law10 um1 um100 nm10 nm1 nm19701980199020002010202034 Years of Scaling History Every generation Feature size shrinks by 70% Transistor density doubles Wafer cost increases by 20% Chip cost comes down by 40% Generations occur regularly On average every years over the past 34 years Recently every 2 yearsFeature SizeTransistor DensityChip SizeTransistors/ChipClock FrequencyPower DissipationFab CostWW

3 IC RevenueWW Electronics RevenueFeature SizeTransistor DensityChip SizeTransistors/ChipClock FrequencyPower DissipationFab CostWW IC RevenueWW Electronics Revenue19701970 TodayToday6 um~10 mm21000100 kHz~100 mW~$10 M$700 M$70 B6 um~10 mm21000100 kHz~100 mW~$10 M$700 M$70 BChangeChange34 Years of History90 nm~400 mm2200 M> 1 GHz~100 W>$1 B$170 B$ T90 nm~400 mm2200 M> 1 GHz~100 W>$1 B$170 B$ T70x Reduction5000x Increase40x Increase200,000x Increase>10,000x Increase~1000x Increase>100x Increase240x Increase16x Increase70x Reduction5000x Increase40x Increase200,000x Increase>10,000x Increase~1000x Increase>100x Increase240x Increase16x IncreaseElectrical Engineering Physicsf(E) = f(E) = 1e(E - E )/kT + 1Fp = Nv e (F -E )/kTp = Nv e (F -E )/kTpv= = ( p - n + Nd-Na ) = = ( p - n + Nd-Na ) d2V(x)dx2+ (x) q-n = Nc e (E -F )/kTn = Nc e (E -F )/kTcnJn(x) = q nn(x) (x) + qDnJn(x) = q nn(x) (x) + qDndn(x)dxJp(x) = q p p(x) (x) - qDpJp(x) = q p p(x) (x) - qDpdp(x)dxEgElectronMassValenceBandCondu ctionBandHoleMass High Performance Processor@ 90nm 256 million transistors 37nm gate length PNO gate: 10 nm EOT NiSi2/Poly gate 8 levels Cu with low-k interlevel dielectric 0204060801002004200620082010201220142015 Heading for ChangeGate Length (nm)Heading for ChangeGate Length (nm)020406080100200420062008201020122014 2015 ChallengesChallenges Push cmos as far as we can (to "end of roadmap") Invent next generation electronics Push cmos as far as we can (to "end of roadmap") Invent next generation electronicsLithographyYear of ProductionResolution ( m)Lithography will not ultimately limit IC feature size!

4 = 436nmi-line = 365nmDUV = 248nm193 = 193nm157 = = EUV nmi-193 = 133nmAgenda Introduction to cmos vlsi Technology Physics Challenges to Continued vlsi Scaling Gate insulator Gate electrode Carrier scattering Quantum behavior of carriers in the presence of stress Non-equilibrium Boltzmann transport Tunneling Discrete positioning of dopant atoms Electrostatics Simulation Conclusion Introduction to cmos vlsi Technology Physics Challenges to Continued vlsi Scaling Gate insulator Gate electrode Carrier scattering Quantum behavior of carriers in the presence of stress Non-equilibrium Boltzmann transport Tunneling Discrete positioning of dopant atoms Electrostatics Simulation ConclusionVoltage Reduction Achieved by Reduction in tox 10A in 2004 Increase in oxusing Plasma Nitrided Oxide (PNO)Gate InsulatorDelay~Power 1/2 CV2 FcCVIdriveInversion LayerChargeQinv Dox= oxEox oxVddtoxGate Leakage Oxide Thickness (A)nMOS Gate Current (A/cm2)SiONSiO2 Supply Voltage (Vdd)1980199020001 V5 VClock Frequency (MHz) 198019902000101001,00010,000 Gate InsulatorBad NewsDielectic ConstantBreakdown Strength (MV/cm)TiO2(k=60-95) (k= )HfO2(k=21), ZrO2(k=29)Si3N4(k= ), Al2O3(k=9)Ta2O5(k=19-26), La2O3(k=27), Pr2O3(k=31)SrTiO3(k=50-200)Hi-k also degrades channel mobilityGood NewsEOT (nm) SiSC '02 HfSiON/TI HfSiON/Toshiba vlsi '03 HfSiON/Toshiba IWGI '03 SiO2trendlineSiONNovel SiON/Toshiba vlsi '04 101 HfSiO/TI SiSC '02 HfSiON/TI HfSiON/Toshiba vlsi '03 HfSiON/Toshiba IWGI '03 SiO2trendlineSiONNovel SiON/Toshiba vlsi '04 Gate LeakageWork Function (eV)

5 GateMid-GapOptimum for NMOSO ptimum for PMOSV alence BandConduction Oxide10 nmTi GateSiElectrons in SiModern CMOSV ertical Field E MV/cmStark Quantization results in E 75 meV Vt 50 mVModern CMOSV ertical Field E MV/cmStark Quantization results in E 75 meV Vt 50 mVStark EffectE7E2E1E0 2E21E11E01E31 E= E10- E0 4 4 2[001][010][100]Effect of StrainBi-axial tensile strain of GPa results in Estrain 135 meVMobility increase 80%Idriveincrease 20%Bi-axial tensile strain of GPa results in Estrain 135 meVMobility increase 80%Idriveincrease 20%E7E2E1E0 2E21E11E01E31210 meV 4 Holes in [110] Uniaxially Compressed SiSikxky| px,py>Unstrained Heavy Hole (HH)Unstrained Heavy Hole (HH)[110]kxkyStrained Heavy Hole (HHS)Strained Heavy Hole (HHS)LH,HHHHSLHS| s,px,py,pz>Mobility ImprovesMobility DegradesDiscrete Channel Dopants Introduce IOFFF luctuationsand IOFFD egradationW = 40nmECCurrent DensityOff-CurrentFilamentIDSVGSD iscreteAverageContinuumChannel DopingL = 20nm5 XDiscreteDopingDiscrete Channel DopantsMyth of the MOSFET SwitchLog IoffVGVt s In the Off StateID~ eIn the Off StateID~ e-q s kT log ID VGqkT=Cox+ CPCoxlog10e s VGSub-Threshold Slope 60 - 100 mV/decadeFor Vt= 300mV 5 - 3 decadesIon 1 mA/umIoff 10 nA/um - 1 uA/umSub-Threshold Slope 60 - 100 mV/decadeFor Vt= 300mV 5 - 3 decadesIon 1 mA/umIoff 10 nA/um - 1 uA/umElectrostaticsCritical Scaling ParametersLWtoxxjunxdepMulti-Gate FETs show promise of extending scaling for several generations beyond planar cmos toxand xdepare encountering scaling limits.

6 This results in .. Degraded sub-threshold slope Increased drain induced barrier lowering (DIBL)kTqCox+ CPCoxConclusion Scaling cmos to the End of Roadmap will require sophisticated condensed matter Physics . Gate stack: Atomic and electron orbital understanding of this complex material system Quantum behavior of carriers High perpendicular E field Stress Non-equilibrium Boltzmann transport Tunneling: Gate insulator and Drain-to-Substrate Simulation Sophisticated condensed matter Physics will also be required to invent and develop electronics beyond cmos Single Electron Transistor (SET) Carbon Nano-tube (CNT) Molecular Electronics Spintronics Quantum Computing Scaling cmos to the End of Roadmap will require sophisticated condensed matter Physics . Gate stack: Atomic and electron orbital understanding of this complex material system Quantum behavior of carriers High perpendicular E field Stress Non-equilibrium Boltzmann transport Tunneling: Gate insulator and Drain-to-Substrate Simulation Sophisticated condensed matter Physics will also be required to invent and develop electronics beyond cmos Single Electron Transistor (SET) Carbon Nano-tube (CNT) Molecular Electronics Spintronics Quantum Computing


Related search queries