Transcription of Power Electronic Capacitors - C&H Technology
1 VISHAY INTERTECHNOLOGY, Electronic CapacitorsDATA Technical InformationDC-CapacitorsAC-Filter CapacitorsGTO-CapacitorsCommutation and Damping CapacitorsE 03-02 E/04 PASSIVECOMPONENTSDISCRETESEMICONDUCTORSI NTEGRATEDMODULESMEASUREMENTSENSORSANDEQU IPMENTVISHAY INTERTECHNOLOGY, INTERTECHNOLOGY, OF THE WORLD'S BROADEST LINE OF DISCRETE SEMICONDUCTORS AND PASSIVE COMPONENTSRECTIFIERSS chottky (single, dual)Standard, Fast and Ultra-Fast Recovery (single, dual)Clamper/DamperBridgeSuperectifier SMALL-SIGNAL DIODESS chottky and Switching (single, dual)Tuner/Capacitance (single, dual)BandswitchingPINZENER & SUPPRESSOR DIODESZ ener Diodes (single, dual)TVS (TransZorb, Automotive, Arrays)MOSFETsPower MOSFETsJFETsRF TRANSISTORSB ipolar RF Transistors (AF and RF)
2 Dual Gate MOSFETsMOSMICs OPTOELECTRONICSIR Emitters, Detectors and IR Receiver ModulesOpto Couplers and Solid State RelaysOptical SensorsLEDs and 7 Segment DisplaysInfrared Data Transceiver ModulesCustom productsICsPower ICsAnalog SwitchesCAPACITORST antalum CapacitorsSolid Tantalum CapacitorsWet Tantalum CapacitorsCeramic CapacitorsMultilayer Chip CapacitorsDisc CapacitorsFilm CapacitorsPower CapacitorsHeavy Current CapacitorsAluminum CapacitorsRESISTIVE PRODUCTSFoil ResistorsFilm ResistorsThin Film ResistorsThick Film ResistorsMetal Oxide Film ResistorsCarbon Film ResistorsWirewound ResistorsVariable
3 ResistorsCermet Variable ResistorsWirewound Variable ResistorsConductive Plastic Variable ResistorsNetworks/ArraysNon-Linear ResistorsNTC ThermistorsPTC ThermistorsMAGNETICSI nductorsTransformersDC/DC CONVERTERS STRAIN GAGESS tress AnalysisTransducer-Class Installation AccessoriesINSTRUMENTATIONS train IndicatorsAmplifiers Data SystemsPHOTOSTRESS PRODUCTSP olariscopesPlasticsTRANSDUCERSLoad CellsLinear Displacement Sensors Power Electronic Capacitors Vishay ESTAV ishay Electronic GmbHDivision ESTAH ofmark-Aich-Strasse 36D-84030 LandshutGermany Phone: + 49 871 86-0 Fax: + 49 871 of the products displayed herein are subject to change without notice.
4 Vishay Intertechnology, Inc.,or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, byestoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided inVishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims anyexpress or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating tofitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectualproperty products shown herein are not designed for use in medical, life-saving.
5 Or life-sustaining using or selling these products for use in such applications do so at their own risk and agree to fullyindemnify Vishay for any damages resulting from such improper use or Number: 13017 Revision InformationVishay ESTAP ower Electronic CapacitorsMKP DIELECTRICA metallic layer is vacuum-metallized on one side of thecorresponding polypropylene base film by means of aspecial thickness of the metallic layer varies over the distanceof the film the connection area, the metallic layer is thicker to reducelosses occurring at this point due to high current characteristics and series resistance areoptimized by the metallization arrangement.
6 Thismetallization arrangement principle is shown in Fig. 1. Theactual arrangement however is adapted to thecorresponding capacitor a result of the self-healing effect, the capacitor is fullyoperational after an electrical breakdown. A breakdowngenerates a small electric arc which evaporates themetallization around the area of the breakdown in only afew localized increase in gas pressure caused by the hightemperature, blows off the gaseous metallization away fromthe breakdown point. By means of this process, a metallicfree non-conductive isolation crescent is formed whichenables continuous full operation of the OF SELF-HEALINGCAPACITORSS ince no low resistance short circuit occurs on failure ofself healing Capacitors , line-side fuses cannot offer anyprotection against bursting of the , in addition to segmentation (exclusively for DCcapacitors) there is also a fuse for MKP Capacitors whichreacts to capacitor failure generally occurs due to a weak point inthe dielectric, an overload or degradation.
7 If it is not takenoff line, over-heating of the dielectric occurs at the defectpoint. This over-heating leads to the formation of gas anda quick increase in pressure on the inside of the capacitorcase. In cylindrical cases, this takes the form of anelongation causing a crowning of the cover or stretching ofthe expansion DC Capacitors without tear-off fuses can bemanufactured with a segmented metallized polypropylenefilm. Various segmental designs are available which areapplied in accordance with the mode of application and thespecification.
8 All segmented metallizations being appliedare produced in accordance with the Vishay OF FUNCTIONINGIf a non-self-healing breakdown occurs in the dielectric, thesegment affected by this error will be to the high number of segments per capacitor element,the disconnection of a partial segment causes a practicallynon-measurable change of capacitance. The applicationof this Technology essentially allows the dielectric s fieldstrength to increase and, consequently, reduce to a minimumthe capacitor volume and capacitor healing breakdown on an MKP capacitor1 metallized electrode2 polypropylene film3 point of breakdown4 non-conductive insulating crescentFIG.
9 1 FIG. 2 FIG. 3 FUSEOPEN FUSESEGMENTBREAKDOWN4312143 MKP = METALLIZED InformationVishay ESTAD ocument Number: 13017 Revision 31-Jan-02 OVERPRESSURE SENSORFor Capacitors in rectangular cans, pressure sensors areavailable which can activate a line-side switch via a metallized electrodes2 polypropylene film3 electric contact (schooping)4 non-metallized edgeSCHOPPED METALLIZED FILM (MKP)WINDING ELEMENTP ower Electronic CapacitorsDISTANCE RINGGASING CAUSEDBY A DAMAGETERMINALSOVERPRESSURE TEAR-OFF FUSEOn over-running or on reaching the limits of the expectedcapacitor lifetime, punctures can occur, causing localizedbridging and the formation of gas.
10 An overpressure tear-off fuse disconnects the Capacitors element from the lineside thereby preventing connection of the winding is accomplished by meansof a highly flexible conductive material with low this way the Capacitors are able to fulfill the highestdemands for current carrying capabilities, low inductivecharacteristics and vibration OF THE WINDING ELEMENTFor Capacitors with metallized film winding elements (MKP- Technology ), the contacting of the windings isaccomplishedby a special metal spray method ( schooping ).