Product Safety Information Datasheet - AVX …

1 Product Safety Information DatasheetMaterial Data and HandlingThis should be read in conjunction with the Product to observe the ratings and the Information on this sheetmay result in a Safety Material ContentSolid tantalum and OxiCap capacitors do not contain liquid hazardous operating section contains: tantalum /Niobium Graphite/carbon tantalum /Niobium oxide Conducting paint/resins Manganese dioxide Fluoropolymers (not TAC)The encapsulation contains.

2 TAC - epoxy molding compound, solder/tin coated terminalpadsTAJ, TMJ, TPS, TPM, TRJ, TRM, TLJ, TLN, TCJ, TCM, TCN, J-CAPTM,TCQ, TCR, NLJ, NOJ, NOS and NOM - epoxy molding compound, tin/solder coated terminal padsTHJ - may contain Antimony trioxide and Bromide compoundsas fire - solder, solder coated terminal wires, epoxy dipped resinThe capacitors do not contain PBB or PBBO/PBBE. The solderalloys may contain Physical FormThese capacitors are physically small and are either rectangularwith solderable terminal pads, or cylindrical or bead shaped withsolderable terminal Intrinsic PropertiesOperatingBoth tantalum and OxiCap capacitors are polarized devicesand operate satisfactorily in the correct mode.

3 They willwithstand a limited application of reverse voltage as stated in thedatasheets. However, a reverse application of the rated voltagewill result in early short circuit failure and may result in fire orexplosion. Consequential failure of other associated componentsin the circuit diodes, transformers, etc. may also occur. Whenoperated in the correct polarity,a long period of satisfactory operation will be obtained but failure may occur for any of thefollowing reasons: normal failure rate temperature too high surge voltage exceeded ripple rating exceeded reverse voltage exceededIf this failure mode is a short circuit, the previous conditionsapply.

4 If the adjacent circuit impedance is low, voltage or current surges may exceed the power handling capability of thecapacitor. For this reason capacitors in circuits of below 1 /Vshould be derated by minimum 50% for tantalum and 20% forOxiCap . Precautions should be taken to prevent reverse voltage spikes. Where capacitors may be subjected to fastswitched, low impedance source voltages, the manufacturersadvice should be sought to determine the most suitable capacitors for such tantalum and OxiCap capacitors contain no liquids ornoxious gases to leak out.

5 However, cracking or damage to theencapsulation may lead to premature failure due to ingress ofmaterial such as cleaning fluids or to stresses transmitted to thetantalum Fire CharacteristicsPrimaryAny component subject to abnormal power dissipation may self ignite become red hot break open or explode emitting flaming or red hotmaterial, solid , molten or from burning components will vary in compositiondepending on the temperature, and should be considered to behazardous, although fumes from a single component in a wellventilated area are unlikely to cause ignition may occur from an adjacent burning or red hotcomponent.

6 Epoxy resins used in the manufacture of capacitorsgive off noxious fumes when burning as stated above. Whereverpossible, capacitors comply with the following: BS EN 60065 UL LOI (ASTM D2863-70) as stated in the StorageAVX tantalum dielectric chip capacitors are unaffected by the fol-lowing storage condition for 2 years: Temperature: -10 C +50 C Humidity: 75% RH maximum Atmospheric pressure: 860 mbar ~ 1060mbarTantalum and OxiCap capacitors exhibit a very low random fail-ure rate after long periods of storage and apart from this thereare no known modes of failure under normal storage capacitors will withstand any environmental conditions withintheir ratings for the periods given in the detail for longer periods under high humidity conditions mayaffect the leakage current of resin protected of solder coated surfaces may be affected by stor-age of excess of 2 years.

7 If F-series capacitors should be storedmore than 1 year please contact AVX for advice. 6. Moisture Sensitivity LevelMSL is defined in J-STD-020. It is applicable to non-hermeticsurface mount devices, and is focussed on parts in plasticpackages. The basic concept is that a plastic package may contain mois-ture, which can become a high pressure vapour during solderreflow. If this occurs, the vapor pressure may cause internalcracking or damage to the device. It can also result in externalsteam jets from the package, and these may displace othernearby components on the circuit board during the solderprocess.

8 A common industry reference for this is popcorning .AVX solid tantalum and OxiCap chips which are consideredMSL 1 are molded in plastic packages, and are packaged instandard packaging, not including a moisture barrier unlessdry pack MSL 3 special option is used (special character Vin part number).AVX solid electrolyte chips (standard tantalum , conductive polymer, OxiCap ), which are considered MSL 3, MSL 4 orMSL 5 (ref. Product Datasheet ) are molded in plastic packages,and are distributed in packaging including a moisture Safety Information DatasheetMaterial Data and HandlingAVX solid tantalum TACmicrochip (TAC, TPC) are consid-ered MSL 1 and supplied in packaging with a moisture bar-rier.

9 TLC series is considered MSL 3 and is distributed inpackaging including a moisture DisposalIncineration of epoxy coated capacitors will cause emission ofnoxious fumes and metal cased capacitors may explode due tobuild up of internal gas pressure. Disposal by any other meansnormally involves no special hazards. Large quantities may havesalvage Unsafe UseMost failures are of a passive nature and do not represent asafety hazard. A hazard may, however, arise if this failure causesa dangerous malfunction of the equipment in which the capaci-tor is employed.

10 Circuits should be designed to fail safe underthe normal modes of failure. The usual failure mode is anincrease in leakage current or short circuit. Other possiblemodes are decrease of capacitance, increase in dissipation fac-tor (and impedance) or an open-circuit. Operations outside theratings quoted in the datasheets represents unsafe HandlingCareless handling of the cut terminal leads could result in scratchesand/or skin punctures. Hands should be washed after handling solder coated terminals before eating or smoking, to avoid ingestionof lead.