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PRODUCT SELECTION - WPG Americas Inc.

PRODUCT SELECTION GUIDEDISPLAYS, MEMORY AND STORAGE1H 2017 CONTACTSDISPLAYSSTORAGEMCPFLASH - PCs/ULTRABOOKS DESKTOP PCs/WORKSTATIONSNETWORKING/ COMMUNICATIONSCONSUMER ELECTRONICSM arketsSERVERSS amsung continues to lead the industry with the broadest portfolio of memory products and display technology. Its DRAM, flash, mobile and graphics memory are found in many computers from ultrabooks to powerful servers and in a wide range of handheld devices such as smartphones and tablets. Samsung is also a leader in display panels for smartphones, TVs and monitors and public information displays. In addition, Samsung provides the industry s widest line of storage products from the consumer to enterprise levels. These include optical disc drives as well as flash storage, such as Solid State Drives, and a range of embedded flash storage Semiconductor, OF CONTENTS//DRAMPAGES 4 DDR4 SDRAM DDR3 SDRAM DDR2 SDRAM Graphics DRAM Mobile DRAM Ordering InfoFLASH - SSDPAGES 14 eMMC Universal Flash Storage (UFS) Solid State Drives (SSD)MULTI-CHIP PACKAGESPAGES eMMC + LPDDR2 eMMC + LPDDR3 STor AGEPAGES 17 Solid State Drives (SSD)DISPLAySPAGES Public Information Display (PID) PRODUCT Classification SNB/UNB Indoor PID E-Board Outdoor PIDCONTACTSPAGES 22 Sales Representatives and 2017 DDR4 SDRAM REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionCo

1H 2017 DRAM SDRAM Density Speed

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Transcription of PRODUCT SELECTION - WPG Americas Inc.

1 PRODUCT SELECTION GUIDEDISPLAYS, MEMORY AND STORAGE1H 2017 CONTACTSDISPLAYSSTORAGEMCPFLASH - PCs/ULTRABOOKS DESKTOP PCs/WORKSTATIONSNETWORKING/ COMMUNICATIONSCONSUMER ELECTRONICSM arketsSERVERSS amsung continues to lead the industry with the broadest portfolio of memory products and display technology. Its DRAM, flash, mobile and graphics memory are found in many computers from ultrabooks to powerful servers and in a wide range of handheld devices such as smartphones and tablets. Samsung is also a leader in display panels for smartphones, TVs and monitors and public information displays. In addition, Samsung provides the industry s widest line of storage products from the consumer to enterprise levels. These include optical disc drives as well as flash storage, such as Solid State Drives, and a range of embedded flash storage Semiconductor, OF CONTENTS//DRAMPAGES 4 DDR4 SDRAM DDR3 SDRAM DDR2 SDRAM Graphics DRAM Mobile DRAM Ordering InfoFLASH - SSDPAGES 14 eMMC Universal Flash Storage (UFS) Solid State Drives (SSD)MULTI-CHIP PACKAGESPAGES eMMC + LPDDR2 eMMC + LPDDR3 STor AGEPAGES 17 Solid State Drives (SSD)DISPLAySPAGES Public Information Display (PID) PRODUCT Classification SNB/UNB Indoor PID E-Board Outdoor PIDCONTACTSPAGES 22 Sales Representatives and 2017 DDR4 SDRAM REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M393A5143DB0-CPB4Gb (512M x8) * 9 Lead Free & Halogen Free, Flip x 72M393A1G40DB0-CPB4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip21331 NowM393A1G40DB1-CRC2400M393A1G43DB0-CPB4 Gb (512M x8)

2 * 1821332M393A1G43DB1-CRC2400M393A1G40EB1- CPB4Gb (1G x4) * 1821331M393A1G40EB1-CRC2400M393A1G43EB1- CPB4Gb (512M x8) * x 72M393A2G40DB0-CPB4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip21332 NowM393A2G40DB1-CRC2400M393A2G40EB1-CPB2 133M393A2G40EB1-CRC2400M393A2K40BB0-CPB8 Gb (2G x4) * 1821331M393A2K40BB1-CRC2400M393A2K43BB1- CPB/CRC8Gb (1G x8) * 182133 x 72M393A4K40BB0-CPB8Gb (2G x4) * 36 Lead Free & Halogen Free, Flip Chip21332 NowM393A4K40BB1-CRC240064GB x 72M393A8G40D40-CRB4Gb 4H TSV (4G x4) * 36 Lead Free & Halogen Free, 4 High TSV21338 NowM393A8K40B21-CRB8Gb 2H TSV (4G x4) * 36 Lead Free & Halogen Free, 2 High TSV21334M393A8K40B21-CTC2400128GB x 72M393 AAK40B41-CTC8Gb 4H TSV (8G x4) * 36 Lead Free & Halogen Free, 4 High TSV24008 NowNotes:DDR4 4Gb (D die) based 0 = IDT 2 = Montage 3 = Inphi PB = DDR4-2133(15-15-15) 0 = IDT 4 = Montage RC = DDR4-2400(17-17-17) DDR4 4Gb (E die) based 0 = IDT 4 = Montage 3 = Inphi PB = DDR4-2133(15-15-15) 0 = IDT 4 = Montage 3 = Inphi RC = DDR4-2400(17-17-17) DDR4 (B Die) 8Gb based 0 = IDT 4 = Montage PB = DDR4-2133(15-15-15) 0 = IDT 4 = Montage 3 = Inphi RC = DDR4-2400(17-17-17) DDR4 SDRAM COMPONENTSD ensityVoltageOrganizationPart Number# Pins-PackageComplianceSpeed (Mbps)

3 X 4K4A4G045WD-BCRC/PB78 Ball -FBGALead Free & Halogen Free, Flip Chip2400 x 8K4A4G085WD-BCRC/PB256M x 16K4A4G165WD-BCRC/PB96 Ball x 4K4A4G045WE-BCRC/PB78 Ball x 8K4A4G085WE-BCRC/PB256M x 16K4A4G165WE-BCRC/PB96 Ball x 8K4A8G085WB-BCRC/PB78 Ball FBGALead Free & Halogen Free, Flip Chip2400 x16K4A8G165WB-BCRC/PB96 Ball (8Gb DDP) Ball -FBGALead Free & Halogen Free, Flip Chip2133 SDRAM Load Reduced REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M386A4G40DM0-CPB4Gb DDP (2G x4) * 36 Lead Free & Halogen Free, DDP21334 NowM386A4G40DM1-CRC2400M386A4K40BB0-CRC5 8G (2Gx4)*36 Lead Free & Halogen Free, Flip x 72M386A8K40BM1-CPB/CRC8Gb DDP (4G x4) * 36 Lead Free & Halogen Free, DDP2133 x 72M386 AAK40B40-CUC8Gb 4H TSV (8G x4) * 36 Lead Free & Halogen Free, DDP24008 NowNotes:DDR4 4Gb (D die) based 0 = IDT 2 = Montage PB = DDR4-2133(15-15-15) 5 = IDT 4 = Montage RC = DDR4-2400(17-17-17) DDR4 (B Die) 8Gb based 0 = IDT 4 = Montage PB = DDR4-2133(15-15-15) 5 = IDT 4 = Montage RC = DDR4-2400(17-17-17) 2017 DRAMDDR4 SDRAMDDR4 SDRAM UNBUFFERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 64M378A5143DB0-CPB4Gb (512M x8) *8 Lead Free & Halogen x 64M378A1G43DB0-CPB4Gb (512M x8) *16 Lead Free & Halogen Free21332 NowM378A1G43EB1-CRC2400M378A1K43BB1-CPB8 Gb (1G x8) *82133M378A1K43BB2-CRC24001R x x 64M378A2K43BB1-CPB8Gb (1G x8) * 16 Lead Free & Halogen Free21332 NowM378A2K43BB1-CRC2400M378A2K43CB1-CPB2 133M378A2K43CB1-CRC2400 Notes.

4 PB = DDR4-2133(15-15-15) RC = DD R4-2400(17-17-17)DDR4 SDRAM ECC UNBUFFERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x72M391A5143EB1-CPB/CRCM391A5143EB1-CPB/ CRCLead Free & Halogen Free, Flip Chip2133 x72M391A1G43DB0-CPB/CRCM391A1G43DB0-CPB/ CRCLead Free & Halogen Free, Flip Chip2133/24002 NowM391A1K43BB1-CPB/CRCM391A1K43BB1- x72M391A2K43BB1-CPB/CRCM391A2K43BB1-CPB/ CRC Lead Free & Halogen Free, Flip Chip2133/24002 NowNotes:PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)DDR4 SDRAM ECC SODIMM MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M474A1G43DB0-CPB4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip21332 NowM474A1G43DB1-CRC2400M474A1G43EB1-CPB/ CRC2133 x 72M474A2K43BB1-CPB/RC8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133/24002 NowDDR4 SDRAM SODIMM MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 64M471A5143DB0-CPB4Gb (512M x8) * 8 Lead Free & Halogen Free21331 NowM471A5143EB0-CPB/RC2133/2400M471A5244 CB0- x 64M471A1G43DB0-CPB4Gb (512M x8) * 16 Lead Free & Halogen Free21332 NowM471A1G43EB1-CPB/CRC2133/2400M471A1K4 3BB1-CPB/CRC8Gb (1Gx8)*81M471A1K43CB1- x 64M471A2K43BB1-CPB/RC8Gb (1G x8) * 16 Lead Free & Halogen Free2133/24002 NowM471A2K43CB1-CPB/RCNotes.

5 PB = DDR4-2133(15-15-15) RC = DDR4-2400(17-17-17)DDR4 SDRAM VLP REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M392A4K40BM0-CPB/RC4Gb DDP (2G x4) * 18 Lead Free & Halogen Free, DDP21332 NowM392A2K43BB0-CPB/RC8Gb (1G x8) * 18 Lead Free & Halogen Free, Flip Chip 2133 x 72M392A4K40BM0-CPB/RC8Gb DDP (4G x4) * 18 Lead Free & Halogen Free, DDP2133 2017 DDR3 SDRAMDDR3 SDRAM UNBUFFERED MODULES (ECC)DensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) (512M x8) * 9 Lead Free & Halogen x 72M391B1G73EB0-CMA4Gb (512M x8) * 18 Lead Free & Halogen :YK0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)DDR3 SDRAM VLP REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M392B1G70DB0-CMA 4Gb (1Gx4) * 18 Lead Free & Halogen Free, Flip Chip18661 NowM392B1G73DB0-CMA 4Gb (512M x8) * (1Gx4) * 1816001M392B1G73DB0-YK0 4Gb (512M x8) * x 72M392B2G70DM0-CMA4Gb DDP (2G x4) * 18 Lead Free & Halogen Free, x 72M392B4G70DE0-YH9 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free, QDP13334 NowNotes:2 = IDT 3 = Inphi YK = DDR3-1600 MA = DDR3-1866 (13-13-13)DDR3 Non ECC UNBUFFERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps)Ranks x 64M378B5173DB0-CK0/CMA4Gb (512M x8) * 8 Lead Free & Halogen Free.

6 Flip Chip1600/18661 NowM378B5173EB0-CK0/CMAM378B5173EB0-YK0/ * x 64M378B1G73DB0-CK0/MA4Gb (512M x8) * 16 Lead Free & Halogen Free. Flip Chip1600/18662 NowM378B1G73EB0-CK0 *CMAN otes:YK = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) * is compatible to SDRAM REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M393B1G70EB0-CMA 4Gb (1G x4) * 18 Lead Free & Halogen Free, Flip Chip18661 NowM393B1G73EB0-CMA 4Gb (512M x8) * 4Gb (1G x4) * 1816001M393B1G73EB0-YK04Gb (2R x8) * x 72M393B2G70DB0-CMA4Gb (1G x4) * 36 Lead Free & Halogen Free, Flip Chip18662 NowM393B2G70EB0-CMA 1600M393B2G70EB0-YK0 x 72M393B4G70DM0-YH94Gb DDP (2G x4) * 36 Lead Free & Halogen Free. DDP13334 NowNotes:8 = IDT A1 Evergreen9 = Inphi UVGS022 = IDT (E-die) 3 = Inphi (E-die)YK = DDR3-1600 (11-11-11)MA = DDR3-1866 (13-13-13)DDR3 SDRAM Load Reduced REGISTERED MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M386B4G70DM0-YK04Gb DDP (2G x4) * 36 Lead Free & Halogen Free, x 72M386B8G70DE0-YH9(4)4Gb QDP (4G x4) * 36 Lead Free & Halogen Free, (4)1600 Notes.

7 3 = Inphi iMB GS02B 4 = Montage 2017 DRAMDDR3 & DDR2 SDRAMDDR3 SDRAM SODIMM MODULESD ensityVoltageOrganizationPart NumberCompositionComplianceSpeed (Mbps) x 72M474B5173EB0-YK04Gb (512M x8) * 9 Lead Free & Halogen Free, Flip x 72M474B1G73EB0-CMA4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip SDRAM COMPONENTSD ensity VoltageOrganizationPart Number# Pins- PackageComplianceSpeed (Mbps) x 8K4B1G0846I-BCK0/MA/NB78 Ball -FBGALead Free & Halogen Free, Flip Chip1600/1866 x 16K4B1G1646I-BCK0/MA/NB96 Ball x 8K4B1G0846I-BYK0/MA78 Ball -FBGA1600 x 16K4B1G1646I-BYK0/MA96 Ball x 8K4B2G0846F-BCK0/MA/NB78 Ball -FBGALead Free & Halogen Free, Flip Chip1600/1866 x 16K4B2G1646F-BCK0/MA/NB96 Ball x 8K4B2G0846F-BK0/MA78 Ball -FBGA1600 x 16K4B2G1646F-BK0/MA96 Ball x 8K4B4G0846D-BCK0/MA/NB78 Ball -FBGALead Free & Halogen Free, Flip Chip1600/1866 x 16K4B4G1646D-BCK0/MA/NB96 Ball x 8K4B4G0846E-BCK0/MA/NB78 Ball x 16K4B4G1646E-BCK0/MA/NB96 Ball x 4K4B4G0446D-BYK078 Ball -FBGALead Free & Halogen Free, Flip x x 16K4B4G1646D-BYK0/MA96 Ball -FBGA1600 x 4K4B4G0446E-BYK0/MA78 Ball x 8K4B4G0846E-BYK0 x 16K4B4G1646E-BYK0/MA96 Ball x 16K4B8G1646Q-MCK0/MA96 Ball -FBGALead Free & Halogen Free1600 x 16K4G8G1646D-MCK0/MAK4G8G1646D-MYK0/ (MA)Notes.

8 H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) NB = DDR3-2133 (14-14-14)DDR2 SDRAM COMPONENTSD ensityOrganizationPart Number# Pins-PackageDimensionsPackageSpeed (Mbps)Production512Mb64M x free & Halogen free , Flip chip667/800/1066 Now32M x x free & Halogen free , Flip chip667/800/1066 Now64M x :E6 = DDR2-667 (5-5-5) E7 = DDR2-800 (5-5-5) F7 = DDR2-800 (6-6-6) F8 = DDR2-1066 (7-7-7) 2017 GRAPHICS & MOBILE DRAMGRAPHICS DRAM COMPONENTSTypeDensityOrganizationPart NumberPackageVDD/VDDQS peed Bin (MHz)ProductionGDDR58Gb256M x 32K4G80325FB-HC(03/28/25/22) */9000*NowK4G80325FB-HC(03/28/25/22) x 32K4G41325FE-HC2(03/28/25/22) */9000*K4G41325FE-HC2(03/28/25/22) x 16K4W4G1646E-BC(1A/1B) (1A/1B) :Package & Speed Bin CodesH: FBGA (Halogen Free & Lead Free) (DDR3)B: FCFBGA (Halogen Free & Lead Free) (DDR3)H: FCFBGA (Halogen Free & Lead Free) (GDDR5)F: FBGA (Halogen Free & Lead Free) (GDDR5)22: (9000 Mbps)25: (8000 Mbps)28: (7000 Mbps) 03: (6000 Mbps)04: (5000 Mbps)1B: (2400 Mbps gDDR3)1A: (2133 Mbps gDDR3)11.

9 (1866 Mbps)MOBILE DRAM COMPONENTSTypeDensityOrganizationPart NumberPackagePowerProductionLPDDR38Gb1CH x 32K4E8E324EB-EGCF178-FBGA, , SDP, , 12x12, SDP, 1866 Mbps12Gb1CH x32K4E2E304EA-AGCF168-FBGA, 12x12, DDP, 1866 Mbps16Gb1CH x 32K4E6E304EB-EGCF178-FBGA, , DDP, 1866 MbpsK4E6E304EB-AGCF168-FBGA, 12x12, DDP, 1866 Mbps2CH x 32K3QF2F20BM-AGCF253-FBGA, , DDP, 1866 MbpsK3QF3F30BM-FGCF256-FBGA, 14x14, DDP, 1866 Mbps24Gb1CH x32K4 EHE304EA-AGCF168-FBGA, 12x12, QDP, 1866 Mbps2CH x32K3QF6F60AM-FGCF256-FBGA, 14x14, QDP, 1866 Mbps32Gb1CH x32K4 EBE304EB-EGCF178-FBGA, , QDP, 1866 Mbps2CH x32K3QF4F40BM-AGCF253-FBGA, , QDP, 1866 MbpsK3QF4F40BM-FGCF256-FBGA, 14x14, QDP, 1866 MbpsLPDDR48Gb2CH x16K4F8E304HB-MGCJ200-FBGA, 10x15, SDP, , 10x15, DDP, 3733 Mbps24 GbK4 FHE3D4HM-MFCJ200-FBGA, 10x15, DDP, 3733 MbpsK3RG4G40MM-MGCJ366-FBGA, 15x15, DDP, 3733 Mbps32Gb4CH x16K3RG2G20CA-MGCJ366-FBGA, 15x15, QDP, 3733 MbpsCSK3RG2G20CM-FGCJ432-FBGA, 15x15, QDP.

10 3733 MbpsES48Gb4CH x16K3RG6G60MM-MGCJ366-FBGA, 15x15, QDP, 3733 MbpsNowLPDDR4X32Gb4CH x16K3UH5H50MM-NGCJ366-FBGA, DDP, , QDP, 2017 DRAMDRAM Ordering Information1. Memory (K)2. DRAM: 43. DRAM TypeB: DDR3 SDRAMD: GDDR SDRAMG: GDDR5 SDRAMH: DDR SDRAMJ: GDDR3 SDRAMM: Mobile SDRAMN: SDDR2 SDRAMS: SDRAMT: DDR SDRAM U: GDDR4 SDRAMV: Mobile DDR SDRAM Power Efficient AddressW: SDDR3 SDRAMX: Mobile DDR SDRAMY: XDR DRAMZ: Value Added DRAM4. Density10: 1G, 8K/32ms16: 16M, 4K/64ms26: 128M, 4K/32ms28: 128M, 4K/64ms32: 32M, 2K/32ms50: 512M, 32K/16ms51: 512M, 8K/64ms52: 512M, 8K/32ms54: 256M, 16K/16ms55: 256M, 4K/32ms56: 256M, 8K/64ms62: 64M, 2K/16ms64: 64M, 4K/64ms68: 768M, 8K/64ms1G: 1G, 8K/64ms2G: 2G, 8K/64ms4G: 4G, 8K/64ms5. Bit Organization02: x 2 04: x 406: x 4 Stack (Flexframe)07: x 8 Stack (Flexframe)08: x 815: x 16 (2CS)16: x 1626: x 4 Stack (JEDEC Standard)27: x 8 Stack (JEDEC Standard)30: x 32 (2CS, 2 CKE)31: x 32 (2CS)32: x 326.

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