Proposal to Flexible PCB Materials

1 ConfidentialMatsushita Electric Works, to Proposal to Flexible PCB MaterialsFlexible PCB MaterialsJune, 2008 June, 2008 ConfidentialMatsushita Electric Works, Core Technology and Capability 1. Core Technology and Capability 2. Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid Flex3. Technology and Product Advantage 3. Technology and Product Advantage 4. Product Offering Availability4. Product Offering Availability5. What5. What s New?s New?ContentsContentsConfidentialMatsushi ta Electric Works, Technology and Capability Technology and Capability ConfidentialMatsushita Electric Works, Resin Design Technology CoreTechnologyProductionProductionEngine eringEngineeringEvaluation Evaluation TechnologyTechnologyExtendedLamination System(Roll type)Batch Press System(Sheet type)Quality Evaluation Technology( with ACF)Stress Analysis SimulationMaterial Material TechnologyCore TechnologyConfidentialMatsushita Electric Works, JapanNon JapanFPC UsersFPC UsersRigid Flex UsersRigid Flex Users90% share90% sharePWB customersmaking Rigid FlexSmall LCDH ingeOverseasPWB customersmakingRigid Flex Total Solution(All HF Materials -Rigid & FCCL) Existing Sales Channel Focus Application Evaluation Technology(Ex.)

2 Bending test method cooperative development withcustomer and OEM)Small LCDH inge11--2. FPC Material Marketing Strategy2. FPC Material Marketing StrategyMulti LayerMulti LayerConfidentialMatsushita Electric Works, (10K m2/Year)*Source: Yano Economy Research Report with modification by MEW11--3. 2 Layer D/S FCCL Market 3. 2 Layer D/S FCCL Market D/S Laminator2L D/S LaminatorProduction Volume by Supplier in 2008 ConfidentialMatsushita Electric Works, Production Capacity4. Production 10K /year 0100200300400500200720082009201018018024 0240360360120120 BPSELSELS(Newly Equiped)ConfidentialMatsushita Electric Works, Ltd. Environmental FriendlyAll Halogen Free Type ISO Koriyama Factory ISO9001 ISO14000 ISO14000 TS16949 Yokkaichi Factory ISO9001TS16949 April 2005 April 2005 May 2007 August 2006 February 2007 March 200711--5.

3 ISO & Environmental Friendly5. ISO & Environmental FriendlyConfidentialMatsushita Electric Works, Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid FlexConfidentialMatsushita Electric Works, Total Solution for FPC 1. Total Solution for FPC Proposal for LCD Module with improved ACF connection Test ConditionTest ConditionSupporting boardTest ICFPCPullAdhesive IC and a FPC base material sideare pasted up by humidity & thermal stress,measure peel strength. ACF Peel StrengthACF Peel StrengthN/mm 80808080 C C C C95%95%95%95% (Hours)(Hours) CPanasonicCompany DR-F785 with Newly Developed CopperNewly developedNewly developedCopper foil by collaboration with copper supplierCopper foil by collaboration with copper supplierConfidentialMatsushita Electric Works, 3 Flexible PCB partFlexible PCB partLow Flow PrepregR-1551 LProposal 1 Proposal 12 Layer FCCL 2 Layer FCCL R-F775R-F785R-F70522--2.

4 Total Solution for Rigid2. Total Solution for Rigid--FlexFlexRigid PCB partRigid PCB partRigidRigidFlexibleRigid-Flex BoardHalogen-free FR-4 CCLR-1566 Proposal 5 Materials for Build-UpARCC R-0582 Proposal 4 NewNewProposal 2 Proposal 2CC--F170,F175F170,F175CC--F176,F156,F16 6F176,F156,F166 NewNewNewNewFCCL based FCCL based MasslamMasslamConfidentialMatsushita Electric Works, and Product and Product AdvantageConfidentialMatsushita Electric Works, ,770F775,770 Polyimide (Polyimide (UpilexUpilex))RR--F785,780F785,780 Polyimide (Polyimide (PixeoPixeo))RR-- f705 ,700F705,700 LCP (LCP (VecstorVecstor))33--11--1. 2 Layer FCCL 1. 2 Layer FCCL (Face Lamination System)(Face Lamination System)ELS(Extended Lamination System)ELSELS(Extended Lamination System)BPS(Batch Press System)BPSBPS(Batch Press System)NewNewNewNewConfidentialMatsushit a Electric Works, of Panasonic ELS- Stable Quality- Uniform lamination by pressing with large area- Class100 clean environment in ELS processing- ELS with various kinds of Films and Copper foils33--11--2.

5 Panasonic ELS 2. Panasonic ELS (Extended Lamination System) Upilex Pixeo Vecstor, etcELS ELS Typical Roll Lamination SystemFilmFilmCopper foilCopper foil RA type (General, Special) ED type (General, Special)Very Thin (9 m, 12 m) ConfidentialMatsushita Electric Works, m PI based FCCL (Rm PI based FCCL (R--F785F) F785F) Copper=Special RA Test method IPC TM 150 After 150 C C C C C C C C30min30minAfter EtchingAfter A Company A R-F785F(ELS)R-F785F(ELS)33--22--1. Excellent Dimensional Stability 1. Excellent Dimensional Stability ConfidentialMatsushita Electric Works, EtchingAfter EtchingAfter 150 After 150 C C C C C C C C30min30minR-F785 FCompany AR-F785 FCompany TDMD TDMD TDMD TD%%33--22--2. Excellent Dimensional Stability 2. Excellent Dimensional Stability 1414 m PI based FCCL (Rm PI based FCCL (R--F785F) F785F) (ELS)(ELS) Copper=Special RA Test method IPC TM 650 ConfidentialMatsushita Electric Works, Excellent Dimensional Stability 3.

6 Excellent Dimensional Stability 2525 m PI based FCCL (Rm PI based FCCL (R--F775) F775) After 150 After 150 C C C C C C C C30min30minAfter EtchingAfter EtchingCompany B Company B R-F775(ELS)R-F775(ELS) Copper=RA Test method Panasonic methodConfidentialMatsushita Electric Works, EtchingAfter EtchingAfter 150 After 150 C C C C C C C TDMD TDR-F775 Company B MD TDMD TDR-F775 Company B (ELS)(ELS)2525 m PI based FCCL (Rm PI based FCCL (R--F775) F775) Copper=RA Test method Panasonic method33--22--4. Excellent Dimensional Stability 4. Excellent Dimensional Stability ConfidentialMatsushita Electric Works, ClosedCrank BendingOpen Closed BendingOpen ClosedSlide BendingFPC FormFPC FormFPC Form33--33--1. Bending Flexibility 1. Bending Flexibility ConfidentialMatsushita Electric Works, ( ,Ad25)Plan view Double sided FCCL R-F775 L/S=100/100um Side view 050000100000150000200000250000 Number of times (time) R-F77518-20-18(General RA) R-F775F18-20-18(Special RA) R-F77518-25-18 (General RA) Test result 33--33--2.

7 Enhanced Flexibility 2. Enhanced Flexibility (( BendingBending))OPENCLOSE170170170170 Angle 0 170 Frequency 60rpm -bending diameter 8 Test machine Test condition Note) CoverNote) Cover--lay ( ,Ad25lay ( ,Ad25 m) was used for the ) was used for the Electric Works, Thin copper 18 m 12 m Analysis Thin Film 25 m 20 m Cu Film ( m) Cu Film ( m) MPastress33--33--3. Finite Element Method (3. Finite Element Method ( BendingBending))ConfidentialMatsushita Electric Works, Enhanced Flexibility 4. Enhanced Flexibility (Slide Bending)(Slide Bending)PatternPatternPatternPattern Test MethodA circuit is an outside-Stroke:50 -Speed:60 pm-Temperature:room temp-Radius of curvature judging:20%UP0100000200000300000400000R- F785F18-14-18(Special RA) Number of times (time) R-F78518-14-18(General RA) R-F77518-20-18(General RA) R-F77518-25-18(General RA) Test result Note) CoverNote) Cover--lay ( ,Ad15lay ( ,Ad15 m) was used for the ) was used for the testing.

8 Test Electric Works, m4 mSpecial RA Special RA General RAGeneral RACrack formation along grain boundary33--33--5. Special RA copper pressed by ELS5. Special RA copper pressed by ELSS pecial RA, pressed by ELS, is reSpecial RA, pressed by ELS, is re--crystallized,crystallized,and features superior performance for slide features superior performance for slide Electric Works, Ltd. Test condition Test result 33--33--6. Enhanced 6. Enhanced Flexibility Flexibility (Crank Bending)(Crank Bending)Test machine Plan view Double siddeFCCL R-F775 L/S=100/100um Side view 170170170170 Angle :0 <=> 170 Frequency : 60rpm Circuit :Both side Judgment Resistance 10%UP050000100000150000 Number of times (time) R-F77518-25-18R-F775F18-25-18R-F77512-25 -12 R-F77512-20-12R-F78512-14-12(General RA)(Special ED)Coverlay( ,Ad25)Note) CoverNote) Cover--lay ( ,Ad25lay ( ,Ad25 m) was used for the ) was used for the testing.

9 (Special RA)R-F77518-25-18 ConfidentialMatsushita Electric Works, EDGeneral EDSpecial ED Special ED MD MD TD TD Special ED, pressed by ELS(<300 Special ED, pressed by ELS(<300 C C , is re, is re--crystallized, crystallized, and has the almost same crystal structure as General RAand has the almost same crystal structure as General RA RA General RA 33--33--7. Special ED copper pressed by ELS7. Special ED copper pressed by ELSC onfidentialMatsushita Electric Works, (R-F775/R-F785) CastingTypical Roll (N/mm) Test Method: (ELS) vs (Other system)33--44--1. Excellent Peel Strength 1. Excellent Peel Strength ConfidentialMatsushita Electric Works, Spring Back Performance 5. Spring Back Performance CCLCCLCCLCCL Loop TestLoop Test1gfLoop Dia at no pressureF785, F780F785, F780F775, F770F775, F770000020202020404040406060606080808080 14 m18 m20 m25 mStiffness % F785, F780F785, F780F775, F770F775, F770000020202020404040406060606080808080 14 m18 m20 m25 mStiffness mg Gurley TestGurley TestConfidentialMatsushita Electric Works, Offering Availability Offering Availability ConfidentialMatsushita Electric Works, RF775 R--F770F770RR--F785 RF785 R--F780F78044--1.))

10 Product Offering Availability 1. Product Offering Availability Max 510 250 500 , , 510 RollSheet - - 1414 2020 2525 - 5050 Polyimide ThicknessNewNew1818 -- - Copper foil 99 mm(1/4oz)(1/4oz)1212 mm(1/3oz)(1/3oz)1818 mm(1/2oz)(1/2oz)3535 mm(1oz)(1oz)EDEDRARAP roduct SizeTypeTD (width)Double SidedSingle Sided Part Number ConfidentialMatsushita Electric Works, s News NewConfidentialMatsushita Electric Works, Factor (Df)-Dielectric Constant (Dk)JIS C6471 IPA 23 Cfor 5 minNaOH 2mol/l 23 Cfor 5 minNo abnormalityNo abnormality-HCl 2mol/l 23 Cfor 5minChemical Strength260 CSolder for 5 sec-94V-094 VTM-0-A and E-168/70 Frame Resistant UL JIS C6471No abnormalityNo abnormality-260 Csolder float for 1 minSolder Heat ResistanceInternal MethodNo abnormalityNo abnormality-288 Csolder float for 1 minNo abormalityNo abnormality-C-96/40/90260 Csolder float for 1 minWater AbsorptionSolder Heat C/50h dippingMoisture + m, Cu18 (MD direction) etching (TD direction) etching (MD direction)Dimensional (TD direction) +14 ASurface ResistivityTest MethodR- f705 LCP50 m, Cu18 UnitTest ConditionProperty55--1.