Qualification and Performance Specification of Permanent ...

1 IPC-SM-840 EQualification andPerformance Specificationof Permanent SolderMask and FlexibleCover MaterialsDeveloped by the solder Mask Performance Task Group (5-33B) of theCleaning and Coating Committee (5-30) and the Covercoat MaterialsTask Group (D-13B) of the Flexible Circuits Committee (D-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-SM-840D - April 2007 IPC-SM-840C -Amendment 1 - June 2000 IPC-SM-840C - January 1995 IPC-SM-840B - May 1988 IPC-SM-840A - July 1983 IPC-SM-840 - November 1977 Table of Contents1 SCOPE AND Terms and As Agreed Between User and Supplier(AABUS).. Chalking (Cured solder Mask or CoverMaterial).

2 Color Change (Cured solder Mask or CoverMaterial).. Cover Crazing (Conformal or solder Mask or CoverMaterial).. Delamination (Cured solder Mask or CoverMaterial).. Liquefaction (Cured solder Mask or CoverMaterial).. Peeling (Cured solder Mask).. SAC Softening (Cured solder Mask or CoverMaterial).. solder Swelling (Cured solder Mask or CoverMaterial).. Tackiness ( solder Mask or Cover Material).. Wicking ( solder Mask or Covercoat).. Revision Level APPLICABLE Underwriters Precedence of Material Qualification and Printed Board Process Qualification Formulation Shelf Visual Discoloration (Metallic Surfaces).. Discoloration ( solder Mask or CoverMaterial).

3 Dimensional solder Mask or Cover Material Physical Pencil Chemical Resistance to Fabrication Solvents, CleaningAgents and Hydrolytic Soldering Resistance to Tin-Lead Resistance to Lead Free Electrical Dielectric Insulation Environmental Moisture and Insulation Electrochemical Thermal QUALITY ASSURANCE Responsibility for Initial Qualification Test or Inspection Qualification Sample Inspection Quality Conformance Testing/Inspection of Product for Preparation of Specimens for Standard Laboratory Specimen 2010 IPC-SM-840Ev5 PREPARATION OF solder MASK OR COVERMATERIAL FOR Preservation, Packaging and Specifying solder Mask or Cover Material onPrinted Class FT/FH Test Special 4 1 IPC-B-25A (Note: No solder mask or covermaterial shall be applied to contact fingers).

4 14 Figure 4 2 IPC-2221 Test Coupon E Layer 1( Y Configuration)..14 TablesTable 3 1 Requirements of 3 2 Adhesion to Rigid Printed Boards (IPC-B-25 ATest Board and/or Production Printed Board)..8 Table 3 3 Moisture & Insulation 3 4 Electrochemical 3 5 Thermal Shock 4 1 Sample Requirements/Suggested TestSequence for Table 3 1, Column AIPC-B-25A Standard Test 4 2 Sample Requirements/Suggested TestSequence for Table 3 1, Column B IPC-B-25 ABoards Production Process or ConformanceCoupons Or Production Printed 2010 IPC-SM-840 EviQualification and Performance Specification of PermanentSolder Mask and Flexible Cover Materials1 SCOPE AND ScopeThis specificationshalldefine the criteria for and method of obtaining the maximum information about andconfidence in cured Permanent solder mask and cover material under evaluation with the minimum of test specificationshallestablish the requirements for.

5 The evaluation of solder mask and cover materials The conformance of solder mask and cover material properties The Qualification of the solder mask and cover material via the appropriate test substrate PurposeThis specificationshallestablish the requirements, based on applicable test methods and conditions, for theevaluation of a solder mask and cover material and for the determination of the acceptability of use on a printed board. Thesesamerequirementsshallalsobeusedtoqu alifyaprintedboardproductionprocessbased onconformancecriteriadefinedbythereliabi lity requirements of the end use environment. Acceptability and/or verification criteria of the production printed boardshallbe determined in accordance with the applicable Performance requirements ( , IPC-6012, IPC-6013, IPC-6018, etc.)

6 Thesoldermaskmaterialsdescribedherein,wh enappliedtotheprintedboardsubstratearein tendedtopreventand/orminimizetheformatio nandadherenceofsolderballs,solderbridgin g, solder mask materialshallretard electromigration and other forms of detrimental or conductive cover materials described herein, when applied to the printed board substrate,shallprovide a flexible dielectric ,solderbridging, materialsshallretard electromigration and other forms of detrimental or conductive :Thedeterminationofcompatibilitybetweens oldermaskandcovermaterialsandpostsolderi ngproductsandprocessesis beyond the scope of this Specification . The use of Test Methods specified herein to determine the compatibility and therequirement to do soshallbe as agreed between user and supplier (AABUS). and cover materialshallbe cured per the manufacturer s recommended process in accordance with those conditionsspecified for that product.

7 Additional requirements or deviations from these requirementsshallbe ClassesThis Specification provides four classes of requirements, T, FT, H, and FH to reflect functional performancerequirements and testing severity based on industry/end use requirements. Qualification to a particular classshall notbeextended to cover any other :The reference of a single class does not preclude invoking or allowing specific requirements defined in other TelecommunicationThis includes computers, telecommunication equipment, sophisticated business machines, instru-ments, is not life High Reliability/MilitaryThis includes that equipment where continued Performance is critical, equipment down- for applications where high levels of assurance are required and uninterrupted service is Flexible Printed Board Applications (Telecommunications)This applies to cover materials for flexible printed boardapplications used in Telecommunications 2010 IPC-SM-840E1