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Reliability of Staked Surface Mount Packages - ieee-astr.org

Accelerated Stress Testing and Reliability Conference Reliability of Staked Surface Mount Packages Deng Y. Chen and Dr. Michael Osterman Center for Advanced life cycle Engineering (CALCE) University of Maryland, College Park, MD 20742 Email: ASTR 2016, Sep 28-30, Pensacola, FL January-4-17 1 Accelerated Stress Testing and Reliability Conference CALCE Facilities and Capabilities September 28- 30 2016, Pensacola Beach, Florida 2 Non-Destructive Evaluation 3D X-ray Imaging System Scanning Acoustic Microscope (SAM) Fourier Transform Infrared Spectroscopy (FTIR) Automated Contact Resistance Probe (ACRP) X-Ray Fluorescence Spectroscopy (XRF) Electronic Testing and Analysis Semiconductor Parameter Analyzer Impedance Analyzer ( ) Microcircuit Probe High Power Curve Tracer LCR meter Dynamic Signal Analyzer Event Detectors Electrometer LCZ Meter Thermal Inducing System (-80oC to 225oC)

Accelerated Stress Testing and Reliability Conference Reliability of Staked Surface Mount Packages Deng Y. Chen and Dr. Michael Osterman Center for Advanced Life Cycle Engineering (CALCE)

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Transcription of Reliability of Staked Surface Mount Packages - ieee-astr.org

1 Accelerated Stress Testing and Reliability Conference Reliability of Staked Surface Mount Packages Deng Y. Chen and Dr. Michael Osterman Center for Advanced life cycle Engineering (CALCE) University of Maryland, College Park, MD 20742 Email: ASTR 2016, Sep 28-30, Pensacola, FL January-4-17 1 Accelerated Stress Testing and Reliability Conference CALCE Facilities and Capabilities September 28- 30 2016, Pensacola Beach, Florida 2 Non-Destructive Evaluation 3D X-ray Imaging System Scanning Acoustic Microscope (SAM) Fourier Transform Infrared Spectroscopy (FTIR) Automated Contact Resistance Probe (ACRP) X-Ray Fluorescence Spectroscopy (XRF) Electronic Testing and Analysis Semiconductor Parameter Analyzer Impedance Analyzer ( ) Microcircuit Probe High Power Curve Tracer LCR meter Dynamic Signal Analyzer Event Detectors Electrometer LCZ Meter Thermal Inducing System (-80oC to 225oC)

2 Time Domain Reflectometer Analog Oscilloscopes Power Supplies High Speed Digital Oscilloscope up to 20 GS/sec Digital Communication Analyzer Arbitrary Wave Form Generator Function Generator Contact Resistance Tester Noise Figure Analyzer Vector Network Analyzer High Resistance Meter Digital Multimeters Automated Data Acquisition Systems Cascade Probe Station with RF probing capability Automatic Battery Testers (Four and Sixteen Channel Systems) Ripple Current Tester Thermal Assessment and Management Liquid Crystal Thermography Hot Wire Anemometer Flow Visualization System High Speed Video Camera Thermal Conductivity Testing System Flow/Velocity Measurement Facilities Pressure Measurement Facilities Materials Characterization Differential Scanning Calorimeter (DSC) Micro-Mechanical Materials Tester Dynamic Mechanical Analyzer (DMA) Nanoindentation Creep Testing Equipment MTS servo-hydraulic mechanical test system (5 grams to 200 kg) High-strain rate characterization (100/sec) Tests can be conducted in vacuum, inert or reactive atmospheres (-125oC to 300oC)

3 Micro-Hardness Tester Micro-Fatigue Tester Adhesion Tester 1D Electrodynamic Shaker 6D Electrodynamic Shaker Drop Towers Torsion Tester Opto-Mechanics Experimentation Geometric Moire Microscopic and Shadow Moire Interferometry Infrared Fizeau Interferometry Twyman-Green Interferometry Luminous Flux Measurement System 40 Integrating Sphere Spectroradiometer Sample Preparation Diamond Saw Polishing and Grinding Station Plasma Etching Ultrasonic Cleaning Wire Bonder Die Bonder Buehler MPC 2000 Cross-sectioning System Failure Analysis Environmental Scanning Electron Microscope (ESEM) (25x-2500000x) Energy Dispersive Spectroscopy (EDS) In-situ Heating/Mechanical Testing Focused Ion Beam (FIB) Stereoscopes (10x-63x) Optical Microscopes (25x-1000x, Inverted and Upright) Image Analysis Software Transmission Electron Microscope (TEM) Wire Pull, Bond Shear, Cold Bump Pull and Die Strength Automatic Chemical Decapsulator Ion Chromatograph Virtual Qualification Lab calcePWA CADMP-II calceFAST Defects Webbook PEMs Webbook Accelerated Test Webbook PWA Assembly Webbook Integral Passives Webbook PWA Failure Mechanism Webbook Sensor Technology Webbook Environmental/Accelerated Testing Temperature-Humidity Chambers HALT Temperature-Vibration Chamber Thermal Shock Chambers Liquid to Liquid Air to Air HAST Temperature-Humidity Chambers High Altitude Simulation Chamber Pressure, Humidity, and Temp.

4 Cycling High Temperature Aging Chambers Mixed Flowing Gas (MFG) Chamber Electrodynamic Vibration Chamber Impact and Drop Test Apparatus SIR Testing Hollow Fiber Assessment Acoustic Anechoic Chamber Accelerated Stress Testing and Reliability Conference Lead Free Solder Reliability The European legislation, the Restriction of Hazardous Substances (RoHS), limited the use of lead containing solders commercial electronics in 2006. Although military and aerospace electronics are exempted, obtaining lead containing components are becoming more difficult [1]. The exemption of power electronics ends in 2016 [2]. Tin silver copper (SAC) alloys have been the most promising lead free replacement for microelectronics. SAC solders have higher modulus and lower ductility and are prone to shock impact failures.

5 September 28- 30 2016, Pensacola Beach, Florida 3 [1] Army works to decrease lead-free electronic components, , accessed May 1, 2016 [2] RoHS Substances and Exemptions List, , accessed May 1, 2016 Accelerated Stress Testing and Reliability Conference Possible Failure Mitigation Strategies Change mechanical design of the electronic system to reduce the stress transmitted to the solder joints. Board level underfill can be used for ball grid arrays (BGAs) to reduce the failure of BGAs under drop impact loadings. The thermal mechanical Reliability of BGAs with underfill can be reduced [3]. Staking provides an alternative to underfill. September 28- 30 2016, Pensacola Beach, Florida 4 [3] Shi, Hongbin, Cuihua Tian, Michael Pecht, and Toshitsugu Ueda.

6 "Board-level shear, bend, drop and thermal cycling Reliability of lead-free chip scale Packages with partial underfill: a low-cost alternative to full underfill." In Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th, pp. 1-12. IEEE, 2012. Accelerated Stress Testing and Reliability Conference Literature Review Study has shown that corner staking improves drop impact Reliability of BGAs with corner staking [4]. Shi s study showed corner staking can improve the thermomechanical Reliability of the BGAs [5]. Shi Investigated the Reliability of BGAs with edge bond and corner staking under -40 C to 125 C temperature cycling. BGAs with corner staking had the highest mean time to failure. While one of the studies claimed that corner staking may reduce the Reliability of BGAs under temperature cycling [6].

7 Lee et al., compared the thermomechanical Reliability of BGAs with and without underfill and corner staking and found that BGAs with corner staking and underfill have reduced life . September 28- 30 2016, Pensacola Beach, Florida 5 [4] Guoyun Tian et al., "Corner bonding of CSPs: processing and Reliability ," in IEEE Transactions on Electronics Packaging Manufacturing, vol. 28, no. 3, pp. 231-240, July 2005. [5] H. Shi, D. Yu and T. Ueda, "Systematic studies of second level interconnection Reliability of edge and corner bonded lead-free array-based Packages under mechanical and thermal loading," 2012 IEEE 62nd Electronic Components and Technology Conference, San Diego, CA, 2012, pp. 965-976 [6] J. Y. Lee et al., "Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill," 2007 Proceedings 57th Electronic Components and Technology Conference, Reno, NV, 2007, pp.

8 1905-1910. Accelerated Stress Testing and Reliability Conference Motivation Literature presents discrepancy on the effects of staking on the thermomechanical Reliability of BGAs No study has been done on the vibrational Reliability of Staked Packages . Majority of the studies in the literature focused on the Reliability of BGAs with corner staking. September 28- 30 2016, Pensacola Beach, Florida 6 Accelerated Stress Testing and Reliability Conference Research Objective To examine the Reliability of Staked Surface Mount components under temperature cycling, vibration, and drop impact. September 28- 30 2016, Pensacola Beach, Florida 7 Accelerated Stress Testing and Reliability Conference Approach September 28- 30 2016, Pensacola Beach, Florida 8 Design and Manufacturing of Test Vehicle Stake the Assembly Temperature Cycling -55 to 125oC, 15 mins dwell Harmonic Vibration 3G and 4G acceleration Drop Testing 3000G Failure Data Comparison Accelerated Stress Testing and Reliability Conference Test Vehicle Specifications September 28- 30 2016, Pensacola Beach, Florida 9 Board Details Components Count 4 Layers 9" " " ImAg Surface Finish SAC305 CTEx ppm/ C CTEy C BGA 4 QFP 4 QFN 4 Resistor (50% Pad Width) 4 Resistor (50% Pad Length)

9 4 Y X Accelerated Stress Testing and Reliability Conference Staking on Test Vehicle September 28- 30 2016, Pensacola Beach, Florida 10 Accelerated Stress Testing and Reliability Conference Temperature Cycling Test September 28- 30 2016, Pensacola Beach, Florida 11 Resistance monitoring is carried out for all components on the board to determine failure. Failure is defined based on the IPC-9701 standard, 20% increase in initial resistance value for five consecutive scans. (-55 to 125oC, 15 min dwell) [7] JEDEC Solid State Technology Association. Temperature Cycling, JESD22-A104D. JEDEC Solid State Technology Association, 2009. Accelerated Stress Testing and Reliability Conference Failure Distribution of BGAs September 28- 30 2016, Pensacola Beach, Florida 12 It is observed that staking enhances the Reliability of BGA under thermal cycling loadings.

10 The characteristic life of Staked BGAs is about twice the characteristic life of nonstaked BGAs . Temperature Cycling Test (-55 to 125oC, 15min dwell) Accelerated Stress Testing and Reliability Conference Failure Distribution of QFNs September 28- 30 2016, Pensacola Beach, Florida 13 Results indicates that the QFN with corner staking has a higher characteristic life than without. Distribution is wider for the Staked QFNs indicating there may be multiple failure modes Temperature Cycling Test (-55 to 125oC, 15 min dwell) Accelerated Stress Testing and Reliability Conference Harmonic Vibration Test Setup September 28- 30 2016, Pensacola Beach, Florida 14 3G and 4G base excitation vibration were exerted on the fixture The resonant frequencies of the boards are about 190Hz At the resonant frequency, a transmissibility of ~ 28 was observed on the test vehicle.


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