Rework, Modification and Repair of Electronic Assemblies

1 IPC-7711C/7721 CRework, Modification and Repairof Electronic AssembliesDeveloped by the Repairability Subcommittee (7-34) of the Product AssuranceCommittee (7-30) of IPCU sers of this publication are encouraged to participate in the development offuture :IPCS upersedes:IPC-7711/7721 withChanges 1 and 2 Revision B - November 2007 Change 1 - February 2013 Change 2 - March 2014 IPC-7711A/7721A -October 2003 IPC-R-700C -January 1988 Table of ContentsPART 1 General Information and Common Procedures1 of Requirements .. Terms and of Product .. Types .. Level .. Applicability, Controls and of Conformance .. of Conformance .. Basic Workstations, Tools, Materials Discharge (ESD) and ElectricalOverstress (EOS) Controls .. Systems .. Extraction .. Tools .. Heating Methods .. (by contact) Heating Methods .. (hot gas) and IR (radiant)Heating Methods .. (Auxiliary) Heating.

2 Held Drilling and Grinding Tool .. Drill/Mill System .. and Eyelet Press System .. Plating System .. and Supplies .. Conductors and Lands .. and Coloring Agents .. Goals and Guidelines .. Component Removal .. Mount Components .. Components .. Removal Using SolderFountain Method .. Installation .. Preparation .. Mount Components .. Components .. Station/System .. Removal and Installation .. Coating Area .. a Process .. Temperature Profile (TTP) .. Lead 9 January 2017 IPC-7711C/7721 CvHandling/CleaningProcedureDescriptionB oard TypeSkillLevelLevel Electronic AssembliesN/AN/ RemovalProcedureDescriptionIllustrationB oard TypeSkillLevelLevel Removal, Identification ofConformal CoatingR, F, W, Removal, Solvent MethodR, F, W, Removal, Peeling MethodR, F, W, Removal, Thermal MethodR, F, W, Removal, Grinding/ScrapingMethodR, F, W, Removal, Micro BlastingMethodR, F, W, CAdvancedHighIPC-7711C/7721 CJanuary 2017viCoating ReplacementProcedureDescriptionIllustrat ionBoard TypeSkillLevelLevel Replacement, Solder ResistR, F, W, Replacement, ConformalCoatings/EncapsulantsR, F, W, CIntermediateHighConditioningProcedureDe scriptionIllustrationBoard TypeSkillLevelLevel and PreheatingR, F, W, CIntermediateHighEpoxy Mixing and HandlingProcedureDescriptionIllustration Board TypeSkillLevelLevel Mixing and HandlingR, F, W.

3 CIntermediateHighLegends/MarkingsProcedu reDescriptionIllustrationBoard TypeSkillLevelLevel , Stamping MethodR, F, W, , Hand LetteringMethodR, F, W, , Stencil MethodR, F, W, CIntermediateHighTip Care and MaintenanceProcedureDescriptionIllustrat ionBoard TypeSkillLevelLevel Care and MaintenanceN/AN/AN/AJanuary 2017 IPC-7711C/7721 CviiTable of ContentsPART 2 Rework3 Through-Hole DesolderingProcedureDescriptionRound LeadBoard TypeSkillLevelLevel Vacuum MethodR,F, Vacuum Method - Partial ClinchR,F, Vacuum Method - Full ClinchR,F, Clinch Straightening MethodR,F, Clinch Wicking MethodR,F, PGA and Connector RemovalProcedureDescriptionBoard TypeSkillLevelLevel Fountain MethodR,F,W, Chip Component RemovalProcedureDescriptionBoard TypeSkillLevelLevel tipR,F,W, MethodR,F,W, Bottom Termination - Hot Air MethodR,F,W, Leadless Component RemovalProcedureDescriptionBoard TypeSkillLevelLevel Wrap Method - TweezerR,F,W, Application Method - TweezerR,F,W, Gas (Air) Reflow MethodR,F,W,CAdvancedHighIPC-7711C/7721 CJanuary SOT RemovalProcedureDescriptionBoard TypeSkillLevelLevel Application MethodR,F,W, Application Method - TweezerR,F,W, Air PencilR,F,W, Gull Wing Removal (two-sided)ProcedureDescriptionBoard TypeSkillLevelLevel Fill MethodR,F,W, Wrap MethodR,F,W, Application MethodR,F,W, Fill Method - TweezerR,F,W, Wrap Method - TweezerR,F,W, Application Method - TweezerR,F,W, Gull Wing Removal (four-sided)

4 ProcedureDescriptionBoard TypeSkillLevelLevel Fill Method - Vacuum CupR,F,W, Fill Method - Surface TensionR,F,W, Wrap Method - Vacuum CupR,F,W, Wrap Method - Surface TensionR,F,W, Application Method - Vacuum CupR,F,W, Application Method - Surface TensionR,F,W, Fill Method - TweezerR,F,W, Wrap Method - TweezerR,F,W, Application Method - TweezerR,F,W, Gas (Air) Reflow MethodR,F,W,CAdvancedHighJanuary 2017 IPC-7711 J-Lead RemovalProcedureDescriptionBoard TypeSkillLevelLevel Fill Method - TweezerR,F,W, Fill Method - Surface TensionR,F,W, Wrap Method - TweezerR,F,W, Wrap Method - Surface TensionR,F,W, Application Method - TweezerR,F,W, & Tin Tip OnlyR,F,W, Gas Reflow SystemR,F,W, BGA/CSP RemovalProcedureDescriptionBoard TypeSkillLevelLevel Gas Reflow SystemR,F,W, IR Reflow Systems (with integral preheater)R,F,W, MethodR,F,W, PLCC Socket RemovalProcedureDescriptionBoard TypeSkillLevelLevel Fill MethodR,F,W, Wrap MethodR,F,W, Application MethodR,F,W, Air Pencil MethodR,F,W, Bottom Terminated Component RemovalProcedureDescriptionBoard TypeSkillLevelLevel Air MethodR,F,CExpertMedium4 Pad/Land PreparationProcedureDescriptionBoard TypeSkillLevelLevel Mount Land Preparation - Individual MethodR,F,W, Mount Land Preparation - Continuous MethodR,F,W, Solder Removal - Braid MethodR,F,W, Releveling - Using Blade TipR,F,W, Land Tinning - Using Blade TipR,F,W, SMT Lands - Using Blade Tip and Solder BraidR,F,W,CIntermediateHighIPC-7711C/77 21 CJanuary 2017x5 Through-Hole InstallationProcedureDescriptionInstall following the requirements of J-STD-001 PGA and Connector InstallationProcedureDescriptionBoard TypeSkillLevelLevel Fountain Method with PTH PrefilledR,F,W.

5 Chip InstallationProcedureDescriptionBoard TypeSkillLevelLevel Paste Method/Hot Air PencilR,F,W, MethodR,F,W, Leadless Component InstallationProcedureDescriptionBoard TypeSkillLevelLevel Gas (Air) Reflow MethodR,F,W, Gull Wing InstallationProcedureDescriptionBoard TypeSkillLevelLevel Method - Top of LeadR,F,W, Method - Toe TipR,F,W, MethodR,F,W, Paste Method/Hot Air PencilR,F,W, Tip w/Wire LayoverR,F,W, Tip with WireR,F,W, Backed Stencil, Solder Paste Methof/Hot AirR,F,W,CAdvancedHighJanuary 2017 IPC-7711 J-Lead InstallationProcedureDescriptionBoard TypeSkillLevelLevel Wire MethodR,F,W, MethodR,F,W, Paste Method/Hot Air PencilR,F,W, MethodR,F,W, BGA/CSP InstallationProcedureDescriptionBoard TypeSkill LevelLevel Solder Wire to Prefill LandsR,F,W, IR Reflow System (with integral preheater)R,F,W, Solder Paste to Prefill LandsR,F,W, StencilR,F, Reballing Procedure - Fixture MethodR, Reballing Procedure - Paper Carrier MethodR, Reballing Procedure - Polyimide Stencil MethodR, Solder Ball Stencil CarrierR, Bottom Terminated DeviceProcedureDescriptionBoard TypeSkill LevelLevel Pre-bump and placeR,F, Pre-bump and place with stay in place stencilR,F, Pre-Hand soldering plus centered ground bumpR,F,CExpertMedium6 Removing ShortsProcedureDescriptionBoard TypeSkill LevelLevel - Draw Off MethodR,F,W, - Respread MethodR,F,W, - Braid MethodR,F,W, - Draw Off MethodR,F,W, - Respread MethodR,F,W, - Braid MethodR,F,W,CIntermediateHighIPC-7711C/7 721 CJanuary 2017xiiTable of ContentsPART 3 Modification and RepairBlisters and DelaminationProcedureDescriptionIllustra tionBoard TypeSkillLevelLevel Repair .

6 InjectionMethodRAdvancedHighBow & TwistProcedureDescriptionIllustrationBoa rd TypeSkillLevelLevel and Twist RepairR, WAdvancedMediumHole RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Repair , Epoxy MethodR, Repair ,Transplant MethodR, WExpertHighKey and Slot RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel and Slot Repair , Epoxy MethodR, and Slot Repair , TransplantMethodR, WExpertHighJanuary 2017 IPC-7711C/7721 CxiiiBase Material RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Material Repair , Epoxy MethodR, Material Repair , Area TransplantMethodR, Material Repair , EdgeTransplant MethodR, WExpertHighLifted ConductorsProcedureDescriptionIllustrati onBoard TypeSkillLevelLevel Conductor Repair , Epoxy SealMethodR, Conductor Repair , FilmAdhesive MethodR, FIntermediateHighIPC-7711C/7721 CJanuary 2017xivConductor RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Repair , Foil Jumper, EpoxyMethodR, F, Repair , Foil Jumper, FilmAdhesive MethodR, F, Repair , Welding MethodR, F, Repair , Surface WireMethodR, F, Repair , Through BoardWire Repair / Modification ,Conductive Ink MethodR, F, Repair , Inner LayerMethodR, FExpertHighConductor CutProcedureDescriptionIllustrationBoard TypeSkillLevelLevel Cut, Surface ConductorsR, Cut, Inner LayerConductorsR, Inner Layer Connection at aPlated Hole, Drill Through MethodR, Inner Layer Connection at aPlated Hole, Spoke Cut MethodR, FAdvancedHighJanuary 2017 IPC-7711C/7721 CxvLifted Land RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Land Repair , Epoxy MethodR, Land Repair , Film AdhesiveMethodR, FAdvancedMediumLand RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Repair .

7 Epoxy MethodR, Repair , Film Adhesive MethodR, FAdvancedHighEdge Contact RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Contact Repair , Epoxy MethodR, F, W, Contact Repair , Film AdhesiveMethodR, F, W, Contact Repair , Plating MethodR, F, W, CAdvancedHighIPC-7711C/7721 CJanuary 2017xviSurface Mount Pad RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Mount Pad Repair , EpoxyMethodR, F, Mount Pad Repair , FilmAdhesive MethodR, F, Mount, BGA Pad Repair ,Film Adhesive MethodR, F, Mount, BGA Land withIntegral Via Repair Film AdhesiveMethodR, Mount Pad with Integral ViaRepair Film Adhesive Method - NoConductor BendR, Mount, BGA Land withIntegral Via Repair Circuit ExtensionFilm Adhesive MethodR,F,CExpertHighPlated Hole RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Hole Repair , No Inner LayerConnectionR, F, Hole Repair , Double WallMethodR, F, Hole Repair , Inner Hole Repair , No Inner LayerConnection, Clinched Jumper WireMethodR,F,WIntermediateMediumJanuary 2017 IPC-7711C/7721 CxviiJumpersProcedureDescriptionIllustra tionBoard TypeSkillLevelLevel WiresR, F, W, Wires, BGA Components, FoilJumper MethodR, Wires, BGA Components,Through Board MethodR, FExpertHighComponent AdditionsProcedureDescriptionIllustratio nBoard TypeSkillLevelLevel Modifications andAdditionsR, F, W, CAdvancedN/AFlexible Conductor RepairProcedureDescriptionIllustrationBo ard TypeSkillLevelLevel Conductor RepairFExpertMedium8 SplicingProcedureDescriptionBoard TypeSkill LevelLevel SpliceN/AIntermediateLowIPC-7711C/7721 CJanuary 2017xviiiGeneral Information and Common ScopeThis document covers procedures for Repair -ing and reworking printed board Assemblies .

8 It is an aggre-gate of information collected, integrated and assembled bythe Repairability Subcommittee (7-34) of the ProductAssurance Committee of the IPC. This revision includesexpanded coverage for lead free processes, and additionalinspection guidelines for operations such as Repair that maynot have other published document does not limit the maximum number ofrework, Modification or Repair actions to a Printed PurposeThis document prescribes the proceduralrequirements, tools, materials and methods to be used inthe rework, Repair , Modification , overhaul or restoration ofelectronic products. Although this document is based inlarge part on the Product Class definitions used in IPCdocuments such as J-STD-001 or IPC-A-610, this docu-ment should be considered applicable to any type of elec-tronic equipment. When invoked by contract as the control-ling document for the rework, Repair , Modification ,overhaul or restoration of products, the requirements flow-down has identified the most common equipment and pro-cess in order to perform a specific Repair or rework.

9 It ispossible that alternate equipment and processes can be usedto make the same Repair /rework. If alternate equipment orprocesses are used, it is up to the user to ensure theequipment/processes do not damage the assembly and meetthe intent of Section (Levels of Conformance) forthe alternate equipment/processes Definition of RequirementsThis document isintended to be used as a guide and there are no specificrequirements or criteria unless separately and specificallycalled out in a user s contractual or other statements such as must, should or need tobe are used, they are stressing an important point. If thesestrong recommendations are not followed, the end resultmay not be satisfactory and additional damage could in the rework procedures are either up or downdescribing the type of rework procedure being up arrow means removal and a down arrow BackgroundToday s Electronic Assemblies are morecomplex and smaller than ever before.

10 Despite this, theycan be successfully reworked, repaired or modified if theproper techniques are followed. This manual is designed tohelp users rework, Repair and/or modify Electronic assem-blies with minimum impact on end use functionality orreliability. The procedures in this document have beenobtained from assemblers, printed board manufacturers andusers who recognize the need for documenting commonlyused rework, Repair and Modification techniques. Thesetechniques have, in general, been proven to be acceptablefor the class of product indicated through testing andextended field functionality. Procedures contained hereinwere submitted for inclusion by commercial and militaryorganizations too numerous to list individually. The Repair -ability Subcommittee has, where appropriate, revised pro-cedures to reflect Terms and DefinitionsThe following definitionsapply to the use of this Printed Circuit AssemblyRework the act of reprocessing noncomplying articles,through the use of original or equivalent processing, in amanner that assures full compliance of the article withapplicable drawings or the revision of the functional capability of aproduct in order to satisfy new acceptance are usually required to incorporate designchanges which can be controlled by drawings, chang