Transcription of 銅線封裝技術 - sanlien.com
1 65.. 1. TANAKA .. (1) TPCW( Cu).. TANAKA Pure Copper Wire .. (2) TOCW( Cu).. TANAKA Oxide-free Copper Wire .. 1.. 30%~90% . 2. 25 . ( ) ( ) ( ) ( ). unit: cm . 3. - - .. 4.. Items Unit Copper Gold Aluminum . Chemical Symbol Cu Au Al Atomic Number 29 79 13. Atomic Mass Crystal Structure fcc fcc fcc Lattice Constant Melting Point 1083 1064 660. Boiling Point 2855 2983 2520. Density g/cm3 Specific Resistance U cm Heat Conductivity W/m K 397 293 238 . Wire Expansion Rate 10-6/K Young's Modulus 1010/N/m2 / / .. 65. 2. FAB . Breaking Load Elongation 1.. Diameter (gf) (%). ( m) (1) . TPCW TOCW TPCW TOCW.. 20 4-9 6-9 5-15 5%UP FAB(Free Air Ball) . 23 6-12 8-12 6-18 5%UP . 25 7-14 10-14 6-18 6%UP . 1000 . 30 11-20 14-20 8-20 7%UP black oxide(II) 2Cu+O2 2 CuO.
2 38 17-33 22-32 8-20 8%UP. 1000 . auburn oxide(I)4 CuO 2Cu2O + O2. 50 30-55 40-55 15-25 12%UP. 3.. (1) Tanaka . 100 . Au FAB Cu FAB Cu FAB . (2) SPARK . N2:91%~95% + H2:9%~5%.. N 2 N 2 .. H 2 H 2 H 2.. (2) . 5%~9% .. N + H . MAIN NOZZLE SPARK ROD CAPILLARY SUB NOZZLE.. 65. N2 (91%)+ N2 (95%)+ (Heat Affect Zone). Inert Gas N2 (100%). H2 (9%) H2 (5%). HAZ . Flow (Main), (Main), (Main), (L/min) (Sub) (Sub) (Sub) 2mil HAZ 400um . Max 125 Max 125 Max 117. FAB min 122 min 120 min 106. Size(um) Ave Ave Ave SD SD SD SEM. MICRO. SCOPE. X. TOCW 0 m, 0mA, 00 s( . D), Aqua regia s X . TOCW m, 1 0mA, 000 s( . D), Nitric acid( 0%) 0s Cu wire: 0um TPCW N 1%+H % (Main nozzle 0. l/min; Sub nozzle 0. l/min). (3) . 1.. US POWER X .. Y .. ~1 lm/cm2 .. 2. 0. lm/cm . US.
3 US-P 90 US-P 120 US-P 150. X Y X Y X Y. 92 75 100 73 105 74. 89 72 98 74 113 73. 88 72 101 72 110 74. lm/cm 91 76 98 73 111 71.. 65. 2. (2) . Yo u n g 's m o d u l u s . 67% .. 5.. TANAKA: um 3.. PAD . PAD .. 4.. (1) .. 65. 6. Advanced Bonding Wire (ABW) . 1. ABW = .. = 4N OFC . Pd m . FIB Wire .. Oxidation prevention layer ~0. m .. Oxygen-Free Copper ~ 0 m . 7. 25um . FB-150D. Cu Wire 25um TPCW (TANAKA). Capillary 41694-1061-339 (Micro Swiss). KAIJO 80P. 200 (L/F . N2(95%)+H2(5%). (um) (um) (gf) X Y. Ave.. (1) 30%. Max. 80 82 20 Min. 76 77 14 . (2) . ABW .. 65.. (3) . BALL BONDER .. (1ST ) PAD .. 2nd .. WIRE SIDE. ABW ABW . 1st Bonding . ABW Au Wire .. 00 . ( ).. 4.. Y ABW .. Resistance value X. ABW X Y X/Y. Au Wire Ave Cu Wire Max Young Ratio Min ABW : avg.)
4 ; 0,000 MPa Wire diameter m Std Unit cm Condition : Room temperature . 65.. ABW . 10mm 20mm 100mm ABW Au Wire Cu Wire Wire diameter m Unit A .. Break tension Stretch ABW Au Wire 10. %. Cu Wire 1 . %.. Pulling speed 1mm/min Sample length 100mm Pad Pitch : 0 m Wire diameter : m Pad size : 0 0 m . Share Strength Pull Strength . ABW . Au Wire . Cu Wire .. ( 0 m pad pitch bonding). Wire diameter . Bonding temperature 10 . Gas N 1. L/min Ball diameter/Ball thickness .. Share is Island bonding . Pitch . 15 ~ 100 m ( ~4mil ) .. KAIJO TANAKA SOHKi AL-4 .. 3,000m.
