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˘ ˇˆ ˘ ˙˝ˆ - Scanditron

! LiTEZenith LiTE 3D AOI with RevolutionaryNew 3D MeasurementThe Zenith LiTE 3D AOI system provides full 3D inspection of components,patterns, holes and even foreign material on assembled PCBs with true 3D measurement. Koh Young Technology offers accurate and fast 3D inspection overcoming the shortcomings and vulnerabilities of conventional 2D 3D measurement values to program and to set inspection conditions, Zenith LiTE 3D AOI system provides users with intuitive and user friendly software. Results can be reviewed together with Koh Young s 3D SPI inspection results, to enable easier verification and analysis of and Quantifies All DefectsMissing, Offset, Rotation, Polarity, Upside Down, OCV, Solder Fillet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

Zenith LiTE 3D AOI with Revolutionary New 3D Measurement The Zenith LiTE 3D AOI system provides full 3D inspection of components,patterns, holes and even foreign material on assembled PCBs with true 3D measurement.

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Transcription of ˘ ˇˆ ˘ ˙˝ˆ - Scanditron

1 ! LiTEZenith LiTE 3D AOI with RevolutionaryNew 3D MeasurementThe Zenith LiTE 3D AOI system provides full 3D inspection of components,patterns, holes and even foreign material on assembled PCBs with true 3D measurement. Koh Young Technology offers accurate and fast 3D inspection overcoming the shortcomings and vulnerabilities of conventional 2D 3D measurement values to program and to set inspection conditions, Zenith LiTE 3D AOI system provides users with intuitive and user friendly software. Results can be reviewed together with Koh Young s 3D SPI inspection results, to enable easier verification and analysis of and Quantifies All DefectsMissing, Offset, Rotation, Polarity, Upside Down, OCV, Solder Fillet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more.

2 Lifted BodyLED Component DefectNo SolderJudging Solder Fillet DefectsUsing 3D Height and Volume Measurement ValuesUsing patented 4-way projection technology and multi-frequency height measurement, Zenith LiTE provides a wide range of measurement while maintaining the high Body(Body Coplanarity)Solder Joint DefectsLifted Lead(Lead Coplanarity)Judge Defect by Measured Component Height ProfileFull 3D Inspection of Solder JointJudge Defect by Measured Lead Shape ProfileMeasured lead height valueexceeds toleranceDynamic PCB EnvironmentFlexible PCBS lopeHeight DifferenceLocal Board Warp/ Rotation/ Shrinkage/ ExpansionThe Perfect Warp Compensation SolutionPCB warp becomes more pronounced during the reflow process in the applications using FPCB or building large boards, due to the high temperature required for reflow process.

3 Zenith LiTE compensates serious FPCB warp in real time while not sacrificing inspection speed and without false calls. Koh Young s KSMART Warp offers a simple and easy solution by teaching bare board prior to inspection to recognize pattern information without PCB CAD data. Y Inspects Connector on FPCB with Serious Warp Fast and Easy Programming Using 3D Measurement ValuesKoh Young s innovative programming tool offers the new concept of easy programming by using 3D measurement value. Koh Young s own 3D Component Library, threshold values and inspection results are all based on true measurement values.

4 Users can eliminate lengthy fine tuning process, and programming is much easier for all user and Accurate Defect JudgementAfter Warp Compensation Koh Young Technology Inc. 2012-2014 , 50cm2/sec, , 30cm2/sec, m 4 MPix High Speed CameraRGB LED Dome Illumination40x40mm ( ) (Basic) PCB Gerber, Placement file, Mounter job file, Mentor Neutral, FabMaster, FabMaster Pin CAD file, Zuken (Optional) ODB++, Allegro, GenCAD Windows 7 Ultimate 64 bit 50mm ( )200-240 VAC, 50/60Hz Single Phase, 5kgf/cm2 Above specifications are subject to change without notice14&15th Floor, Halla Sigma Valley Bldg, 53 Gasan Digital 2-ro, Geumcheon-gu, Seoul, Korea (153-706)Tel.

5 +82-2-6343-6000 / Fax. +82-2-6343-6001 / E-mail. Shadow Free Moir Technology & 4 Way ProjectionMulti Frequency Moir TechnologyPad Referencing + Multi Frequency Moir TechnologyTrue 3D MeasurementFull 3D Inspection of All ComponentsWide Measurement Range + AccuracyReal Time PCB Warp CompensationDark Component & White Body Component LocationLegending and Specular Regions on PCBL ifted Lead MeasurementShallow Polarity Dimple MeasurementInspection ItemsInspection TaskMissing, Offset, Rotation, Polarity, Upside down, OCV, OCR, Coplanarity, Solder fillet, Lifted lead, Lifted body, Billboarding, Tombstone, Bridging.

6 DimensionInspection PerformanceInspection SpeedHeight Accuracy(on a KY Calibration Target)Camera Pixel ResolutionCameraIlluminationFOV SizeConveyor Width Adjustment Conveyor Fix Type AutomaticFront/Rear Fixed (factory setting)PCB Thickness Max. PCB SizePCB HandlingSoftwareSupported Input FormatOperating SystemBarcode Reading Software using System CameraBarcode RecognitionInstallation SpecificationsOptionsMachine WeightMachine SizeTop/Bottom Side ClearanceSupplies Max. PCB Weight + 3%_ ! "# 15 m $' * :' ; $' * :' < = ; 30x30mm ( )M ( ) ( ) ( ) Ring Belt 2kg ( ), Timing Belt 5kg (11lbs) 10kg (22lbs) ( ) 330x330mm (13x13inch)L510x510mm (20x20inch)XL850x690mm ( )Dual 510x320mm ( ) Single 510x580mm ( )MDL550kg (1212lbs) 700kg (1543lbs) 820x1265x1627mm ( ) 1000x1445x1627mm ( )LXL600kg (1322lbs) 850kg (1874lbs) 1000x1265x1627mm ( ) 1350x1445x1627mm ( )


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