Sectional Design Standard for Rigid Organic …

1 IPC-2222 Sectional Design Standard forRigid Organic printed BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax 1998A Standard developed by IPCS upersedes IPC-D-275 September 1991 FOREWORDThis Standard is intended to provide information on the detailed requirements for Organic Rigid printed board Design . Allaspects and details of the Design requirements are addressed to the extent that they can be applied to the unique require-ments of those designs that use Organic Rigid (reinforced) materials or Organic materials in combination with inorganic mate-rials (metal, glass, ceramic, etc.)

2 To provide the structure for mounting and interconnecting electronic, electromechanical, andmechanical information contained herein is intended to supplement generic engineering considerations and Design requirementsidentified in IPC-2221. When coupled with the engineering Design input, the complete disclosure should facilitate the appro-priate selection process of the materials and the detailed Organic Rigid structure fabrication technology necessary to meet theengineering Design selected component mounting and interconnecting technology for the printed board should be commensurate with therequirements provided and the specific focus of this Sectional s documentation strategy is to provide distinct documents that focus on specific aspect of electronic packaging this regard document sets are used to provide the total information related to a particular electronic packaging topic.

3 Adocument set is identified by a four digit number that ends in zero (0).Included in the set is the generic information which is contained in the first document of the set and identified by the fourdigit set number. The generic Standard is supplemented by one or many Sectional documents each of which provide specificfocus on one aspect of the topic or the technology selected. The designer of the printed board, needs as a minimum, thegeneric, the Sectional of the chosen technology, the generic engineering considerations, and the engineering description ofthe final to have all information available prior to starting a Design may result in a product that is difficult to manufacture orexceeds the cost predictions or expectations of the printed technology changes, specific focus standards will be updated, or new focus standards added to the document set.

4 TheIPC invites input on the effectiveness of the documentation and encourages user response through completion of Sugges-tions for Improvement forms located at the end of each documentHIERARCHY OF IPC Design SPECIFICATIONS(2220 SERIES)IPC-2222 RIGIDIPC-2223 FLEXIPC-2224 PCMCIAIPC-2225 MCM-LIPC-2226 HDISIPC-2227 DISCRETE WIREIPC-2221 GENERIC DESIGNT able of .. of Products .. Types .. for Interconnecting and PackagingElectronic Circuits (IPC) .. Laboratories .. Selection .. Base Materials (IncludingPrepregs and Adhesives).. Laminates .. Laminates .. Clad Materials .. of Dielectric Properties.

5 Laminates .. Materials .. Protective Coatings .. and Legends .. Requirements .. Configuration .. Geometries .. Requirements .. and Systems .. , Cutouts and Notches .. AND ASSEMBLY Attachment of Wires/Leads to Terminals .. Extractors .. Requirements for Lands with Holes .. Requirements .. Relief in Conductor Area in Pattern Feature LocationTolerance .. Holes .. Holes .. Size Recommendations forPrinted CIRCUIT Spacing .. Conductors .. Conductors for Rotating or Finishes for Flush Characteristics .. for Interfacial Connection Vias.

6 Lands .. Pattern Feature LocationTolerance .. Conductive Areas .. Holes .. 22 FiguresFigure 1-1 Electrical assembly types .. 2 Figure 4-1 Dielectric layer thickness 4 February 1998 IPC-2222vFigure 4-2 Designer / end user materials selectionmap .. 11 Figure 5-1 Panel borders .. 14 Figure 5-2 Scoring parameters .. 14 Figure 5-3 Breakaway tabs .. 15 Figure 8-1 Permanent board 16 Figure 8-2 External board extractor .. 16 Figure 9-1 Clearance area in planes, mm .. 17 Figure 9-2 Foil web 18 Figure 9-3 Lead-to-hole 19 Figure 10-1A Typical flush circuit .. 21 Figure 10-1B Surface flushness 22 Figure 10-2 Cross-hatched large conductive layerswith isothermal 22 TablesTable 4-1 Clad Laminate Maximum 4 Table 4-2FR-4 Copper Clad Laminate ConstructionSelection Guide.

7 6 Table 4-3 High TGFR-4 Copper Clad LaminateConstruction Selection 7 Table 4-4 Cyanate Ester (170 to 250 TG) CopperClad Laminate Construction Selection Guide .. 8 Table 4-5BT Copper Clad Laminate ConstructionSelection Guide .. 9 Table 4-6 Polyimide Copper Clad LaminateConstruction Selection 10 Table 5-1 Panel Size to Manufacturing OperationRelationships .. 14 Table 5-2 Standard Scoring 14 Table 5-3 Tolerance of Profiles, Cutouts, Notches, andKeying Slots, as Machined, mm .. 15 Table 9-1 Feature Location Tolerances (Lands,Conductor Pattern, etc.) (Diameter TruePosition).. 18 Table 9-2 Minimum Unsupported Holes ToleranceRange (Difference between high and lowhole size limits).

8 18 Table 9-3 Plated-Through Hole Diameter to LeadDiameter Relationships .. 20 Table 9-4 Plated-Through Hole Aspect 20 Table 9-5 Minimum Plated-Through Hole DiameterTolerance Range, mm(Difference between high and low holesize limits).. 20 Table 9-6 Minimum Drilled Hole Size for Plated-ThroughHole Vias .. 20 Table 9-7 Drill Size Recommendations Related toMaximum Board Thickness .. 20 Table 10-1 Surface Flushness Requirements .. 21 IPC-2222 February 1998viSectional Design Standard forRigid Organic printed SCOPEThis Standard establishes the specific requirements for thedesign of Rigid Organic printed boards and other forms ofcomponent mounting and interconnecting structures.

9 Theorganic materials may be homogeneous, reinforced, or usedin combination with inorganic materials; the interconnec-tions may be single, double, or PurposeThe requirements contained herein areintended to establish specific Design details thatshallbeused in conjunction with IPC-2221 (see ) to producedetailed designs intended to mount and attach passive andactive components may be through-hole, surface mount, finepitch, ultra-fine pitch, array mounting or unpackaged baredie. The materials may be any combination able to performthe physical, thermal, environmental, and electronic Document HierarchyDocument hierarchyshallbein accordance with the generic Standard PresentationPresentationshallbe in accordancewith the generic Standard InterpretationInterpretationshallbe in accordancewith the generic Standard Classification of ProductsClassification of Productsshallbe in accordance with the generic Standard IPC-2221and as Board TypeThis Standard provides Design infor-mation for different board types.

10 Board types are classifiedas:Type 1 Single-Sided printed BoardType 2 Double-Sided printed BoardType 3 Multilayer Board without Blind or Buried ViasType 4 Multilayer Board with Blind and/or Buried ViasType 5 Multilayer Metal-Core Board without Blind orBuried ViasType 6 Multilayer Metal-Core Board with Blind and/orBuried Assembly TypesA type designation signifies furthersophistication describing whether components are mountedon one or both sides of the packaging and interconnectingstructure. Type 1 defines an assembly that has componentsmounted on only one side; Type 2 is an assembly withcomponents on both sides.