Transcription of 耐放射線設計標 準 - sma.jaxa.jp
1 JERG-2-143 9 3 JAXA JAXA Disclaimer The information contained herein is for general informational purposes only. JAXA makes no warranty, express or implied, including as to the accuracy, usefulness or timeliness of any information herein. JAXA will not be liable for any losses relating to the use of the information.
2 305-8505 2-1-1 JAXA Japan Aerospace Exploration Agency JERG-2-143 NOTICE-1 .. 1 .. 1 .. 1 .. 1 .. 1 .. 1 .. 1 .. 1 .. 3 .. 4 2 .. 5 .. 5 .. 5 .. 7 .. 10 .. 10 .. 10 ..11 ..11 .. 12 .. 18 .. 21 .. 25 .. 28.
3 28 .. 31 .. 32 .. 33 .. 34ii JERG-2-143 NOTICE-1 .. 34 .. 35 .. 35 .. 36 .. 37 .. 40 .. 40 .. 40 .. 42 .. 45 .. 45 .. 46 iii JERG-2-143 NOTICE-2 JAXA (1) ISO15390 Space environment (natural and artificial) Galactic cosmic ray model (2)
4 Cr me-MC Cosmic Ray Effects on Microelectronics MC (3) JERG-2-141 (1) JERG-2-143-HB001 (1) Trapped Radiation Particles (2) Galactic Cosmic Ray (3) Flux 1 JERG-2-143 NOTICE-1 dS(cm2) dS Flux m-2s-1 Flux m-2s-1 MeV-1 sr-1 (steradian) (4) Fluence -2 m-2 MeV-1 sr-1 (steradian) (5)
5 Absorbed Dose Gray rad (6) Dose (7) Total Dose (8) rad rad erg g -2 J (9) Gray : Gy J rad (10) Single Event Effect (11) Bremsstrahlung (12) Solar Flare (13) Spectrum 2 JERG-2-143 NOTICE-2 (14)
6 L L Value RE (15) Anneal (16) Linear Energy Transfer MeV m MeV g cm2 LET (17) Geomagnetic Effect (18) Dose Rate (19) He (20) NIEL Non-Ionizing Energy Loss (21) DDD Displacement Damage Dose NRL NIEL (22) RDC Relative Damage Coefficient JPL RDC (1) NASA: National Aeronautics and Space Administration (2) JPL: Jet Propulsion Laboratory (3) NRL: Naval Research Laboratory (4) MOS: Metal Oxide Semiconductor (5) cr me-MC.
7 Cosmic Ray Effects on Microelectronics MC3 JERG-2-143 NOTICE-1 (6) DDD: Displacement Damage Dose (7) RDC: Relative Damage Coefficient (8) NIEL: Non-Ionizing Energy Loss (9) CFRP: Carbon Fiber Reinforced Plastics (10) SEU: Single-Event Upset (11) SET: Single-Event Transient (12) SEL: Single-Event Latch up (13) SEB: Single-Event Burnout (14) SEGR: Single-Event Gate Rupture (15) MCU: Multiple Cell Upset (16) MBU: Multiple Bit Upset (17) EDAC: Error Detection And Correction (18) CTE: Charge Transfer Efficiency (19) CTR: Current Transfer Ratio (20) MSM.
8 Metal-Semiconductor-Metal JIS Z 8203 SI SI rad Gy 100 rad eV J 1 10-19eV 4 JERG-2-143 NOTICE-1 2 1 2 (1) LET (2)
9 MeV 1 MeV NIEL DDD LET LET NIEL 5 JERG-2-143 / (*2)(*4) (*2)(*3) NOOK (*2)(*2)(*3)NOOKNOOK(*1) (*2) (*3) (*4) (*2) (*2)(*2)(*3)(*4)
10 NOOK (*1)(*4)(*4) 1 MeV EOL (*2)(*2)(*2)(*2)(*3)(*3) 6 JERG-2-143 (3) (4) (1) (2)