SMD1206 HF Series Surface Mount PTC Devices

1 SSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceessSSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceess 24-1 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 Page: 2 of 10 2011/10/28 Revision: G Description The 1206 Series provides miniature Surface Mount overcurrent protection with holding current from to This Series is suitable for wide range of applications in modern electronics where space is limited. Features Applications Agency Approval and Environmental Compliance RoHS compliant and lead-free Halogen-free Compact design saves board space Low profile Fast response to fault current Compatible with high temperature solders Mobile Internet Device (MID) Battery PCM USB hubs, ports and peripherals Set-top-box and HDMI Game console port protection General electronics Agency File Number RegulationStandard E201431 2002/95/EC R50099121 IEC 61249-2-21.

2 2003 Electrical Characteristics MaximumTime To Trip Resistance AgencyApproval Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax(A) Pd typ(W)Current(A) Time(Sec.)Rmin( ) R1max ( ) SMD1206P012TF 30 100 SMD1206P016TF 30 100 SMD1206P020TF/24 24 100 SMD1206P025TF 16 100 SMD1206P035TF/16 16 100 SMD1206P050TF

3 6 100 SMD1206P050TF/15 15 100 SMD1206P075 TFT 8 100 SMD1206P075 100 SMD1206P110 TFT 8 100 SMD1206P150 TFT 8 100 SMD1206P175TF 6 100 SMD1206P200TF 6 100 SSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceess 24-1 No.

4 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 Page: 3 of 10 2011/10/28 Revision: G Note on Electrical Characteristics Vocabulary Ihold = Hold current: maximum current device will pass without tripping in 23 C still air. Itrip = Trip current: minimum current at which the device will trip in 23 C still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 C still air.

5 Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23 C measured one hour after tripping or reflow soldering of 260 C for 20 sec. Value specified is determined by using the PWB with * copper traces. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Specifications are subject to change without notice. Polymeric PTC Selecting Guide Determine the following operating parameters for the circuits: Normal operating current (Ihold) Maximum circuit voltage (Vmax) Maximum interrupt current (Imax) Normal operating temperature surrounding device (min C/max C) Select the device form factor and dimension suitable for the application: Surface Mount Device (SMD) Radial Leaded Device (RLD) Axial Leaded Device (ALD) DISC Device Other Customized Form Factors Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit s requirement does not exceed the device rating.

6 Check that PPTC device s trip time (time-to-trip) will protect the circuit. Verify that the circuit operating temperature is within the PPTC device s normal operating temperature range. Verify the performance and suitability of the chosen PPTC device in the application. SSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceess 24-1 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 Page: 4 of 10 2011/10/28 Revision: G Thermal Derating Curve Ambient Temperature ()к of Rated CurrentThermal Derating Chart Recommended Hold Current (A) at Ambient Temperature ( C)

7 Ambient Operation Temperature Part Number -40 C -20 C0 C 23 C40 C50 C60 C 70 C 85 CSMD1206P012TF SMD1206P016TF SMD1206P020TF/24 SMD1206P025TF SMD1206P035TF/16 SMD1206P050TF SMD1206P050TF/15 SMD1206P075 TFT SMD1206P075 SMD1206P110 TFT

8 SMD1206P150 TFT SMD1206P175TF SMD1206P200TF SSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceess 24-1 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 Page: 5 of 10 2011/10/28 Revision: G Average Time-Current Curve Current (Amp.)

9 To Trip (Sec.)ACDBAЁSMD1206P012TF BЁSMD1206P016TF CЁSMD1206P020TF/24 DЁSMD1206P025TF Average Time-Current Curve Current (Amp.) to Trip (Sec.)ABCDEFGHAЁSMD1206P035TF/16 BЁSMD1206P050TF/15 CЁSMD1206P075 TFT DЁSMD1206P075 EЁSMD1206P110 TFT FЁSMD1206P150 TFT GЁSMD1206P175TF HЁSMD1206P200TF SSMMDD11220066 HHFF SSeerriieess SSuurrffaaccee MMoouunntt PPTTCC DDeevviicceess 24-1 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 Page: 6 of 10 2011/10/28 Revision: G Soldering Parameters Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to TP) 3 C/second max.

10 Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (Tsmin to Tsmax) 150 C 200 C 60-180 seconds Time maintained above: -Temperature (TL) -Time (tL) 217 C 60-150 seconds Peak Temperature (TP) 260 C Time within 5 C of actual Peak Temperature (tP) 20-40 seconds Ramp-Down Rate 6 C /second max. Time 25 C to Peak Temperature 8 minutes max. Storage Condition 0 C ~35 C, 70%RH Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is ( inch) Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body Surface .