Transcription of 半导体产业研究报告 - ssf.gov.cn
1 WSTS 2017 . 80% .. 1.. Integrated Device Manufacture IDM .. IDM .. Foundry Foundry . Fabless . IC . Outsourced Assembly and Test OSAT .. 2.. WSTS .. 3.. 5-7nm .. 1 .. 28nm . 1-2 14nm 2-3 . 1-2 . 28nm 50 . 20nm 100 . 18 1 . 1 .. 4.. 2 .. 3 .. 4-6 .. 5.. 4 .. " " .. 2017 5 10 . 33% 43% . 50% . 90% . " . " .. 6.. 20. 70-80 . DRAM 20 . 80-90 . PC . DRAM .. 50 .. 60 .. VLSI . 80 . DRAM 1986 . 90 .. 7. DRAM PC . IDM . DRAM . 1 . 2 . 3 . 90 . 1 . 2 . 3 . IDM . 80 LG 2001.. 97 . PC .. VLSI - - . 1994 . 256M DRAM DRAM .. 1987 2008 .. 2017 . 8. 3/4 .. 1 2 . 3 .. 1 . 2 3 .. 9.. 1/3 . 7% . 2000. 2017 2601. 1623 .. CPU DSP . FPGA . 2018 .. 10.. 1 .. 2011 .. 2014 6 .. 2020 .. 20% 2030 .. 2018 . 11.. 2 .. 1387 2017.
2 60 46 .. 5000 . 1:5 .. 3 .. 2008 . 2017 . 9 13 7000.. 12.. 4 .. 2018 .. 1019 .. 970 .. 16nm .. SEMI . 2017 2020 62 26. 42 .. 28-14nm . 10-7nm 28nm . 14 16nm . 13.. 28nm . 14nm .. 3-5 .. 5 . 5G .. 14.. 2016 60 . 2021 350 .. 6 .. ASML .. 15.. PC .. 70 . 80 5-10 5G .. 16.. 17.
